|Electrical resistors patents - Monitor Patents|
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Electrical resistorsBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 03/06/2014 > patent applications in patent subcategories.
02/27/2014 > 1 patent applications in 1 patent subcategories.
20140055228 - Chip resistor device and method for fabricating the same: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in... Agent: Ralec Electronic Corporation02/20/2014 > 3 patent applications in 3 patent subcategories.
20140049356 - On-chip impedance network with digital coarse and analog fine tuning: System and method for providing precision a self calibrating resistance circuit is described that provides for matching a reference resistor using dynamically configurable resistance networks. The resistor network is coupled to the connection, wherein the resistor network provides a configurable resistance across the connection. In addition, the resistor network comprises... Agent:
20140049357 - Over-current protection device: An over-current protection device comprises a PTC material layer, a first electrode layer and a second electrode layer. The PTC material layer has opposite first and second surfaces and opposite first and second lateral surfaces. The first electrode layer is in physical contact with the first surface of the PTC... Agent: Polytronics Technology Corp.
20140049358 - Chip resistor and method of manufacturing the same: There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu),... Agent: Samsung Electro-mechanics Co., Ltd.02/13/2014 > 3 patent applications in 3 patent subcategories.
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