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Electrical resistors inventions 06/08

Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
06/26/2008 > patent applications in patent subcategories.

20080150672 - Bistable microelectronic switch stack: A stack for a bistable microelectronic switch. A porphyrin compound and a conductive polymer are sandwiched between two electrodes. The device exhibits a switching behavior at a certain voltage and can be used in arrays to form a memory device. When a first voltage is applied between the electrodes, the... Agent: Motorola, Inc.

20080150673 - Resistance dividing circuit: A resistance dividing circuit includes a resistive element formed in an area in a first line segment and a second line segment which are set on a substrate and arranged in parallel to each other; and a tap portion connected to the resistive element at a predetermined position of the... Agent: Mcginn Intellectual Property Law Group, Pllc

  
06/19/2008 > patent applications in patent subcategories.
  
06/12/2008 > patent applications in patent subcategories.

20080136578 - Method for sheathing a varsitor block with an electrically insulating sheath, as well as a varsitor block for a surge arrester: A method for coating a varistor block with an electrically insulating coating and a varistor block for a surge arrester. A varistor block is formed from several varistor elements. An electrically insulating coating is disposed around the varistor elements. The electrically insulating coating rests directly on a surface of the... Agent: Lerner Greenberg Stemer LLP

20080136579 - High resistivity thin film composition and fabrication method: A thin film composition is made from silicon, an insulator such as alumina or silicon dioxide, and at least one additional material such as chromium, nickel, boron and/or carbon. These materials are combined to provide a thin film having a ρ of at least 0.02 Ω-cm (typically 0.02-1.0 Ω-cm), and... Agent: Koppel, Patrick & Heybl

20080136580 - Chip network resistor contacting pcb through solder balls and semiconductor module having the same: Provided are a chip network resistor contacting a printed circuit board (PCB) through solder balls and a semiconductor module having the chip network resistor. The chip network resistor includes: a body formed of an insulating material; a resistor formed on the body; external electrodes connected to the resistor and disposed... Agent: Marger Johnson & Mccollom, P.c.

  
06/05/2008 > patent applications in patent subcategories.

20080129442 - Method of manufacturing a varistor: A varistor including a varistor body with two parallel end faces made of a material that contains one or more metal oxides, and at least one electrode made of an electrically conductive electrode material arranged on any of the end faces of the varistor body. The electrode includes a layer... Agent: Venable LLP

20080129443 - Chip resistor and manufacturing method thereof: The chip resistor (1) includes an insulating substrate (2) and a main upper electrode (4) formed on a main surface of the insulating substrate (2). On the main surface of the insulating substrate (2) , a resistor film (5) including an end (5a) overlapping the upper surface of main upper... Agent: Hamre, Schumann, Mueller & Larson, P.c.

Previous industry: Electricity: electrothermally or thermally actuated switches
Next industry: Communications: electrical


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