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Duane Morris LLPIPDepartment (tsmc) patentsThe following is a sampling of recent Duane Morris LLPIPDepartment (tsmc) patent applications (USPTO Patent Application #, Patent Title) sorted by month.
April 2008 - Duane Morris LLPIPDepartment (tsmc) patents
20080094093 - Universal array type probe card design for semiconductor device testing
20080096394 - Gate dielectric layers and methods of fabricating gate dielectric layers
20080083710 - Adjustable electrodes and coils for plasma density distribution control
20080083938 - Image sensors and methods of fabricating image sensors
20080083959 - Stacked structures and methods of forming stacked structures
20080083975 - Stacked structures and methods of fabricating stacked structures
20080083992 - Novel bonding and probing pad structures
20080081441 - Methods of forming semiconductor structures and systems for forming semiconductor structures
March 2008 - Duane Morris LLPIPDepartment (tsmc) patents
20080073724 - Double layer etch stop layer structure for advanced semiconductor processing technology
20080060682 - High temperature spm treatment for photoresist stripping
20080061030 - Methods for patterning indium tin oxide films
20080064127 - Method and system for yield and productivity improvements in semiconductor processing
20080054455 - Semiconductor ball grid array package
20080057211 - Methods for plating and fabrication apparatus thereof
February 2008 - Duane Morris LLPIPDepartment (tsmc) patents
20080047578 - Method for preventing clogging of reaction chamber exhaust lines
20080047589 - Apparatus and methods of cleaning substrates
20080050879 - Methods of forming metal-containing gate structures
20080042269 - Bump structures and packaged structures thereof
20080044756 - Method of fine pitch bump stripping
20080044984 - Methods of avoiding wafer breakage during manufacture of backside illuminated image sensors
20080029876 - Bump pattern design for flip chip semiconductor package
20080032482 - Isolation structures and methods of fabricating isolation structures
January 2008 - Duane Morris LLPIPDepartment (tsmc) patents
20080017956 - Interconnect structure for semiconductor package
20080019586 - Methods of determining quality of a light source
20080020559 - Pad structure design with reduced density
20080002832 - Methods of detecting an abnormal operation of processing apparatus and systems thereof
December 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070296073 - Three dimensional integrated circuit and method of making the same
20070290371 - Pad structure and method of testing
20070293019 - Methods of die sawing and structures formed thereby
20070294654 - Method for using mixed multi-vt devices in a cell-based design
20070284747 - Integrated circuit having improved interconnect structure
20070285890 - Method and apparatus for increasing heat dissipation of high performance integrated circuits (ic)
20070279816 - System to protect electrical fuses
November 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070267461 - Process apparatuses
20070267737 - Packaged devices and methods for forming packaged devices
20070269293 - Substrate carrier and facility interface and apparatus including same
20070262270 - Insulator for high current ion implanters
20070257339 - Shield structures
October 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070248895 - Method for reduction of photomask defects
20070249179 - Method of forming a low-k dielectric layer with improved damage resistance and chemical integrity
20070235862 - Hybrid flip-chip and wire-bond connection package system
20070235873 - Pad structures and methods for forming pad structures
20070238200 - Method of nbti prediction
20070238220 - Stratified underfill in an ic package
20070238283 - Novel under-bump metallization for bond pad soldering
20070238306 - Method of forming dual damascene semiconductor device
August 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070197005 - Delamination resistant semiconductor film and method for forming the same
20070197037 - Surface preparation for gate oxide formation that avoids chemical oxide formation
20070190474 - Systems and methods of controlling systems
20070177788 - System and method for detecting wafer failure in wet bench applications
20070178389 - Universal photomask
20070178696 - Method for silicide formation on semiconductor devices
20070178713 - Method for forming a dielectric layer with an air gap, and a structure including the dielectric layer with the air gap
July 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070163716 - Gas distribution apparatuses and methods for controlling gas distribution apparatuses
20070151949 - Semiconductor processes and apparatuses thereof
20070154060 - Digital imaging device having watermarking capability
June 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070145366 - Semiconductor structures
20070132061 - Mim capacitor in a copper damascene interconnect
20070127287 - Resistive cell structure for reducing soft error rate
May 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070122958 - Spacer barrier structure to prevent spacer voids and method for forming the same
April 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070082473 - Process for low resistance metal cap
20070082474 - Process for making a metal seed layer
20070077697 - Semiconductor device with semi-insulating substrate portions and method for forming the same
February 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070034923 - Devices with different electrical gate dielectric thicknesses but with substantially similar physical configurations
20070026668 - Low k dielectric surface damage control
January 2007 - Duane Morris LLPIPDepartment (tsmc) patents
20070019360 - Method and apparatus for dynamic plasma treatment of bipolar esc system
20070012336 - Photomask cleaning using vacuum ultraviolet (vuv) light cleaning
October 2006 - Duane Morris LLPIPDepartment (tsmc) patents
20060238220 - Method of using mixed multi-vt devices in a cell-based design
20060220653 - Measuring low dielectric constant film properties during processing
September 2006 - Duane Morris LLPIPDepartment (tsmc) patents
20060201848 - Method for reducing mask precipitation defects
20060203600 - Low power word line control circuits with boosted voltage output for semiconductor memory
20060196530 - Novel semiconductor wafer lifter
20060197171 - System and method to improve image sensor sensitivity
20060197464 - Integrated circuit with low power consumption and high operations speed
20060197593 - Negative feedback system with an error compensation scheme
20060197616 - Oscillating buffer with single gate oxide devices
20060199393 - H20 plasma and h20 vapor methods for releasing charges
August 2006 - Duane Morris LLPIPDepartment (tsmc) patents
20060192251 - Bipolar-based scr for electrostatic discharge protection
20060195811 - System and method for reducing design cycle time for designing input/output cells
20060186921 - Dual-voltage three-state buffer circuit with simplified tri-state level shifter
20060190215 - Method and system for timing measurement of embedded macro module
20060175290 - Photo resist stripping and de-charge method for metal post etching to prevent metal corrosion
20060175671 - Mosfet having a channel mechanically stressed by an epitaxially grown, high k strain layer
20060176067 - Method and system for detecting potential reliability failures of integrated circuit
20060177992 - Backside coating for mems wafer
20060178008 - Post etch copper cleaning using dry plasma
20060170053 - Accumulation mode multiple gate transistor
20060172719 - Method and apparatus for inter-chip wireless communication
July 2006 - Duane Morris LLPIPDepartment (tsmc) patents
20060166458 - Method for forming shallow trench isolation structures
20060166495 - Contact structure formed using supercritical cleaning fluid and alcvd
20060166509 - Method to avoid alpha-si damage during wet stripping processes in the manufacture of mems devices
20060160362 - Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereof
20060154478 - Contact hole structures and contact structures and fabrication methods thereof
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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Duane Morris LLPIPDepartment (tsmc) in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Duane Morris LLPIPDepartment (tsmc) with additional patents listed. Browse our Agent directory for other possible listings.
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