| Double sided heat sink with microchannel cooling -> Monitor Keywords |
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  Double sided heat sink with microchannel coolingRelated Patent Categories: Heat Exchange, With Retainer For Removable Article, Electrical Component, Liquid CooledThe Patent Description & Claims data below is from USPTO Patent Application 20070215325. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation in part of U.S. patent application Ser. No. 10/998,707, Stevanovic et al., entitled "Heat sink with microchannel cooling for power devices," which patent application is incorporated by reference herein in its entirety. BACKGROUND [0002] The invention relates generally to an apparatus for cooling a heated surface and, more particularly, to a heat sink with microchannel cooling for semiconductor power devices. [0003] The development of higher-density power electronics has made it increasingly more difficult to cool power semiconductor devices. With modern silicon-based power devices capable of dissipating up to 500 W/cm.sup.2, there is a need for improved thermal anagement solutions. When device temperatures are limited to 50K increases, natural and forced-air cooling schemes can only handle heat fluxes up to about one (1) W/cm.sup.2. Conventional liquid cooling plates can achieve heat fluxes on the order of a twenty (20) W/cm.sup.2. Heat pipes, impingement sprays, and liquid boiling are capable of larger heat fluxes, but these techniques can lead to manufacturing difficulties and high cost. [0004] An additional problem encountered in conventional cooling of high heat flux power devices is non-uniform temperature distribution across the heated surface. This is due to the non-uniform cooling channel structure, as well as the temperature rise of the cooling fluid as it flows through long channels parallel to the heated surface. [0005] One promising technology for high performance thermal management is microchannel cooling. In the 1980's, it was demonstrated as an effective means of cooling silicon integrated circuits, with designs demonstrating heat fluxes of up to 1000 W/cm.sup.2 and surface temperature rise below 100.degree. C. [0006] U.S. patent application Ser. No. 10/998,707, Stevanovic et al. discusses drawbacks associated with a number of known heat sink designs. As discussed in Stevanovic et al., desired heat sink properties include improved thermal performance, relatively simple assembly to reduce manufacturing cost, and scalability for accommodating small and large power devices as well as different numbers of power devices. In addition, it would be desirable for the apparatus to provide electrical isolation between high power devices and the coolant. Moreover, volume and weight are important limitations in many power electronics applications, so compact heat exchangers are desired. BRIEF DECSRIPTION [0007] One aspect of the present invention resides in an apparatus for cooling at least two heated surfaces. The apparatus includes a base plate defining a number of upper and lower supply manifolds and a number of upper and lower exhaust manifolds. The upper and lower supply manifolds are configured to receive a coolant, and the upper and lower exhaust manifolds are configured to exhaust the coolant. The upper (lower) supply and exhaust manifolds are interleaved. The apparatus further includes an upper substrate having an inner surface and an outer surface. The inner surface is coupled to the base plate and defines a number of microchannels configured to receive the coolant from the upper supply manifolds and to deliver the coolant to the upper exhaust manifolds. The microchannels are oriented substantially perpendicular to the upper supply and exhaust manifolds. The outer surface is in thermal contact with one of the heated surfaces. The apparatus further includes a lower substrate having an inner surface and an outer surface. The inner surface is coupled to the base plate and defines a number of microchannels configured to receive the coolant from the lower supply manifolds and to deliver the coolant to the lower exhaust manifolds. The microchannels are oriented substantially perpendicular to the lower supply and exhaust manifolds. The outer surface is in thermal contact with another of the heated surfaces. The apparatus further includes a supply plenum configured to supply the coolant to the upper and lower supply manifolds and an exhaust plenum configured to exhaust the coolant from the upper and lower exhaust manifolds. The supply plenum and exhaust plenum are oriented in a plane of base plate. [0008] Another aspect of the present invention resides in an apparatus for cooling at least two heated surfaces. The apparatus includes a base plate, as described above. The apparatus further includes an upper substrate comprising a top layer, an insulating layer and an inner layer. The inner layer defines a number of microchannels, described above. The insulating layer is disposed between the top and inner layers, the inner layer is coupled to the base plate, and the top layer is in thermal contact with one of the heated surfaces. The apparatus further includes a lower substrate comprising a bottom layer, a second insulating layer and a second inner layer. The second inner layer defines a number of microchannels, described above. The second insulating layer is disposed between the bottom and second inner layers, the second inner layer is coupled to the base plate, and the bottom layer is in thermal contact with another of the heated surfaces. The apparatus further includes a supply plenum and an exhaust plenum, as described above. [0009] Yet another aspect of the present invention resides in an apparatus for cooling at least two heated surfaces. The apparatus includes a base plate, as described above. The apparatus further includes an upper substrate that includes a top layer and an insulating microchannel layer. The insulating microchannel layer defines a number of microchannels, described above. The insulating microchannel layer is disposed between the top layer and the base plate, and the top layer is thermally coupled to one of the heated surfaces. The apparatus further includes a lower substrate that includes a bottom layer and an insulating microchannel layer. The insulating microchannel layer defines a number of microchannels, described above. The insulating microchannel layer is disposed between the bottom layer and the base plate, and the bottom layer is thermally coupled to another of the heated surfaces. The apparatus further includes a supply plenum and an exhaust plenum, as described above. DRAWINGS [0010] These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein: [0011] FIG. 1 is a perspective view of an apparatus for cooling at least two heated surfaces; [0012] FIG. 2 shows interleaved upper and lower supply and exhaust manifolds within a base plate of the apparatus of FIG. 1; [0013] FIG. 3 depicts, in cross-sectional view, an exemplary heat-sink with microchannels formed in the inner surfaces of the upper and lower substrates; [0014] FIG. 4 depicts, in cross-sectional view, an exemplary heat-sink with microchannels formed in insulating microchannel layers; [0015] FIG. 5 depicts, in cross-sectional view, an exemplary heat-sink for use with low-voltage devices; [0016] FIG. 6 illustrates in side view a double-sided heat sink apparatus for cooling multiple power devices; [0017] FIG. 7 is a top view of the manifolds for the double-sided heat sink module of FIGS. 2 and 3; and [0018] FIG. 8 is a side view of the manifolds for the double-sided heat sink module of FIG. 7. DETAILED DESCRIPTION [0019] An apparatus 10 (for example a heat sink) for cooling at least two heated surfaces 42, 44 is described first with reference to FIGS. 1, 2 and 6. As shown, for example in FIGS. 1 and. 6, the apparatus 10 includes a base plate 8, which is shown in greater detail in FIG. 2. As shown, for example, in FIG. 2, the base plate 8 defines a number of upper supply manifolds 12, a number of upper exhaust manifolds 14, a number of lower supply manifolds 16 and a number of lower exhaust manifolds 18. The upper and lower supply manifolds 12, 16 are configured to receive a coolant, and the upper and lower exhaust manifolds 14, 18 are configured to exhaust the coolant. As indicated, the upper supply and exhaust manifolds 12, 14 are interleaved, and the lower supply and exhaust manifolds 16, 18 are interleaved. For the illustrated embodiments, the supply manifolds 12, 14, 16 and 18 are oriented in a plane of the base plate 8. Continue reading... Full patent description for Double sided heat sink with microchannel cooling Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Double sided heat sink with microchannel cooling patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Double sided heat sink with microchannel cooling or other areas of interest. ### Previous Patent Application: Heat-dissipating structure Next Patent Application: Liquid-cooled heat dissipater Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Double sided heat sink with microchannel cooling patent info. 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