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08/30/07 - USPTO Class 165 | 20 views | #20070199681 | Prev - Next | About this Page

Dissipation heat pipe structure and manufacturing method thereof

Title: Dissipation heat pipe structure and manufacturing method thereof

Related Patent Categories: Heat Exchange, Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat, Liquid Fluent Heat Exchange Material, Utilizing Change Of State, Utilizing Capillary Attraction

Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20070199681, Dissipation heat pipe structure and manufacturing method thereof.

1. A dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising: a hollow closed pipe having a heat source end for contacting said heat source and a heat dissipation end which being corresponded to said heat source end for contacting a heat dissipation device, a temperature of said heat dissipation device being lower than said heat source; a type of fluid, set at said heat source end within said hollow closed pipe, after said heat source being contacted to said heat source end to vaporize said type of fluid to be a vapor, said vapor being then contacted to said heat dissipation end to form said type of fluid; and a wick structure, set at an interior wall of said hollow closed pipe for conducting said type of fluid to said heat source end from said heat dissipation end; wherein said hollow closed pipe is combined a metal with a bracket structure of carbon element to form a heat conduction material.

2. The dissipation heat pipe structure of claim 1, wherein said heat source generated by said chip can be conducted by a heat dissipation slip to said heat source end.

3. The dissipation heat pipe structure of claim 1, wherein said hollow closed pipe can be any long column.

4. The dissipation heat pipe structure of claim 1, wherein said hollow closed pipe can be any flat column.

5. The dissipation heat pipe structure of claim 1, wherein said heat dissipation device is composed of a plurality of heat sink fins.

6. The dissipation heat pipe structure of claim 1, wherein said metal is copper.

7. The dissipation heat pipe structure of claim 1, wherein said metal is aluminum.

8. The dissipation heat pipe structure of claim 1, wherein said metal is silver.

9. The dissipation heat pipe structure of claim 1, wherein said metal is a metal material with high thermal conductivity.

10. The dissipation heat pipe structure of claim 1, wherein said bracket structure of carbon element is a diamond.

11. The dissipation heat pipe structure of claim 1, wherein said heat conduction material can be formed by chemical vapor deposition (CVD).

12. The dissipation heat pipe structure of claim 1, wherein said heat conduction material can be formed by physical vapor deposition (PVD).

13. The dissipation heat pipe structure of claim 1, wherein said heat conduction material can be formed by melting.

14. The dissipation heat pipe structure of claim 1, wherein said heat conduction material can be formed by electroplating.

15. A method for manufacturing a dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising: employing a manufacturing to form a heat conduction material having a metal and a bracket structure of carbon element; employing a die to form a hollow closed pipe; forming a wick structure in an interior wall of said hollow closed pipe; forming a type of fluid, set at an end within said hollow closed pipe; and sealing said hollow closed pipe.

16. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing copper to be said metal.

17. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing aluminum to be said metal.

18. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing silver to be said metal.

19. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing a metal material having high thermal conductivity to be said metal.

20. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing diamonds to be said bracket structure of carbon element.

21. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing CVD to form said heat conduction material.

22. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing PVD to form said heat conduction material.

23. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing melting to form said heat conduction material.

24. The method for manufacturing a dissipation heat pipe structure of claim 15, further comprising providing electroplating to form said heat conduction material.

Brief Patent Description - Full Patent Description - Patent Claims

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