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Direct embedded heat pipe apparatus

Direct embedded heat pipe apparatus description/claims

Be it known that I, Yong Chong, a citizen of Canada, have invented new and useful improvements in a direct embedded heat pipe apparatus as described in this specification. This application claims the benefit of my previously filed U.S. Provisional Application No. 60/883,793 filed on 2007 Jan. 07.

Heating costs are of ever-present concern. This concern holds true in heating buildings, floors, pipes, roofs, and a host of other components and objects. Any device which can more efficiently and conveniently transport and conduct heat is therefore of vital concern in a host of industries and applications. The field of hydronics involves the use of liquid carrying pipes used in heating. Currently, pipe known as Pex™ is of widespread use. Additionally, a newer addition to flexible heat delivery pipes is provided, known as PEOC-Plus PE-RT™. This heat pipe is comprised of five-ply tubing. The interior layer of the tubing is PE-RT, with successively outward layers of adhesive polymer, EVOH, adhesive polymer, and PE-RT. The advantages provided by the PEOC-Plus PE-RT™ include flexibility, formability, pliability, UV stability, temperature and pressure characteristics, weldable with plastic welding machine, controlled shrinkage, and economical application. PEOC-Plus PE-RT™ does not heat liquid within the pipe, though, but instead transports liquid typically used in heating. Improvements are therefore indicated. The present heat pipe apparatus offers improvements with a pipe design that incorporates heating capability into pipes used in heating.

The direct embedded heat pipe apparatus relates to fluid delivery pipes and more especially to a flexible heated pipe which is directly embedded with aluminum and heating elements which are surrounded by inner and outer polyethylene layers.

Prior related art U.S. Pat. No. 5,832,179 issued to Kim et al. 1998 Nov. 03 teaches a floor heater with water tube and thin copper electric heating element inserted therein. The device exposes the heating wire to the liquid within the tube, thereby limiting what may be carried in the tube. The device does not provide the further multi-layer advantages of the present apparatus. U.S. Pat. Publication No. 2002/0124995A1 issued to Moon et al. 2002 Sep. 12 teaches a heat pipe having woven-wire wick and straight-wire wick. The pipe is designed for cooling of semiconductors. The pipe does not carry electrical current to heat any fluid contained therein.

U.S. Pat. No. Des. 472,881 issued to Haushulz 2003 Apr. 08 teaches an ornamental design for a pipe heater controller. The controller does not provide the multi-layered pipe and benefits thereof of the present apparatus.

While the above-described devices fulfill their respective and particular objects and requirements, they do not describe a direct embedded heat pipe apparatus that provides for the advantages of the direct embedded heat pipe apparatus. In this respect, the direct embedded heat pipe apparatus substantially departs from the conventional concepts and designs of the prior art. Therefore, a need exists for an improved direct embedded heat pipe apparatus.

The general purpose of the direct embedded heat pipe apparatus, described subsequently in greater detail, is to provide a direct embedded heat pipe apparatus which has many novel features that result in an improved direct embedded heat pipe apparatus which is not anticipated, rendered obvious, suggested, or even implied by prior art, either alone or in combination thereof.

To attain this, the direct embedded heat pipe apparatus comprises a multi-layer flexible pipe. The pipe comprises inner and outer layers of PE, the term for the polyethylene makeup of the inner and outer layers. Between the inner and outer layers are sandwiched bonding layers, and a central layer of aluminum. The heating elements are embedded within the pipe in the outer bonding layer which bonds the aluminum to the outer PE layer.

The heating elements are arranged in a continuous serpentine configuration which surrounds about ¾ of the circumference of the pipe, leaving about ¼ of the circumference of the pipe without the heating elements. As the heating elements are embedded between the inner and outer PE layers, the heating elements are naked (uncoated) themselves. The serpentine arrangement of the heating elements provides for more than one problem solution. The serpentine arrangement provides for even heat introduction into the aluminum layer. The serpentine arrangement also provides for expansion and contraction of the pipe without breakage of the heating elements. Heating elements are exposed wires at each end of the pipe, to provide for electrical connection. The aluminum layer provides the advantage that accessory ground wires are negated. The aluminum provides continuous ground.

The component makeup of the pipe provides for ultrasonic welding. The polyethylene inner layer provides for carrying a variety of liquids successfully, without deterioration. The outer PE makeup is designed for UV protection. The aluminum and heating elements are isolated from contact with any liquids carried within the apparatus. The pipe apparatus can be used to transport and hold liquids in a variety of heating applications, including but not limited to floors, walls, ceilings and roofs. The pipe can be used in existing heating systems which use liquids for heat transfer and transport. The pipe can be used for carrying potable water in order to prevent freezing of the water.

Thus has been broadly outlined the more important features of the improved direct embedded heat pipe apparatus so that the detailed description thereof that follows may be better understood and in order that the present contribution to the art may be better appreciated.

An object of the direct embedded heat pipe apparatus is to save heating costs.

Another object of the direct embedded heat pipe apparatus is to hold and transport liquids used in heating.

A further object of the direct embedded heat pipe apparatus is to be flexible.

An added object of the direct embedded heat pipe apparatus is to carry a plurality of liquids.

And, an object of the direct embedded heat pipe apparatus is to provide for expansion and contraction.

An additional object of the direct embedded heat pipe apparatus is to provide for ultrasonic welding of the pipe apparatus.

• Provisional Patent
• Utility Patent

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