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  Dielectric films and materials thereforRelated Patent Categories: Synthetic Resins Or Natural Rubbers -- Part Of The Class 520 Series, Polymer Derived From Nitrile, Conjugated Diene And Aromatic Co-monomers, , From Ketone-containing Phenolic Reactant Or With Ketone-containing ReactantThe Patent Description & Claims data below is from USPTO Patent Application 20060241275. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a Divisional application under 35 U.S.C. .sctn.120 of co-pending application Ser. No. 10/807,326, filed on Mar. 24, 2004, and application Ser. No. 10/807,326 claims priority under 35 U.S.C. .sctn.119(a) on Patent Application No(s). JP2003-086164 and JP2003-325518 filed in JAPAN on Mar. 26, 2003 and Sep. 18, 2003, respectively, the entire contents of which are hereby incorporated by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a material for the formation of a polybenzazole (imidazole, oxazole or thiazole) film having high heat resistance and a low dielectric constant, as well as a polymer and a dielectric film using the material. More specifically, it relates to a material for the formation of a dielectric film which is useful as a semiconductor part, as well as a polymer and a dielectric film using the material. [0004] 2. Description of the Related Art [0005] Polybenzazoles having an adamantane skeleton are useful as highly heat-resistant resins (Journal of Polymer Science, Part A-1 (1970), 8(12), p. 3665-3666). In particular, highly crosslinked polybenzazoles using a trifunctional or tetrafunctional adamantane derivative involve a multitude of molecular-scale voids, have a low relative dielectric constant and satisfactory mechanical strength and heat resistance and are thereby very useful as materials for interlayer dielectrics (Japanese Unexamined Patent Application Publication (JP-A) No. 2001-332543). These highly crosslinked polybenzazoles can be prepared, for example, by heating a material in the presence of a condensing agent such as a polyphosphoric acid. However, the resulting highly crosslinked resin is hardly soluble in solvent and cannot be significantly applied to a substrate by coating to form a thin film. [0006] A thin film of a wholly aromatic chain polybenzazole is formed by a method, in which an aldehyde derivative as a material monomer is spread over an aqueous solution of an amine as another material monomer to form a film by polymerization on a gas-liquid interface; the film is laminated on a substrate by a horizontal attachment method and is subjected to a thermal treatment in the air to form a thin film of a polybenzazole (Japanese Unexamined Patent Application Publication (JP-A) No. 62-183881). However, the method is not suitable for industrial production, since it takes quite a long time to form the thin film. In addition, the precursor polyimine is subjected to an oxidative thermal treatment in a final process, and the resulting polybenzazole film may be possibly oxidized, thus a lower dielectric constant as a dielectric film is not expected. SUMMARY OF THE INVENTION [0007] Accordingly, an object of the present invention is to provide a material for dielectric films, which can easily yield a film containing a highly crosslinked polybenzazole and having high heat resistance and a low dielectric constant. [0008] Another object of the present invention is to provide a polymer formed from specific compounds, and a dielectric film which contains the polymer and is useful as, for example, semiconductor parts. [0009] After intensive investigations to achieve the above objects, the present inventors have found that a highly functional highly crosslinked polybenzazole film can be formed by dissolving an adamantanepolycarboxylic acid and an aromatic polyamine in a specific solvent. The present invention has been accomplished based on these findings. [0010] Specifically, the present invention provides a material for dielectric films, which is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y.sup.1, Y.sup.2, Y.sup.3 and Y.sup.4 may be the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group, an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R.sup.1 and R.sup.2 are each a substituent bound to Ring Z, may be the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, wherein the adamantanepolycarboxylic acid and the aromatic polyamine are dissolved in the solvent. [0011] The present invention also provides a polymer which is a polymerized product of a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y.sup.1, Y.sup.2, Y.sup.3 and Y.sup.4 may be the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R.sup.1 and R.sup.2 are each a substituent bound to Ring Z, may be the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, wherein the adamantanepolycarboxylic acid and the aromatic polyamine are dissolved in the solvent. [0012] The present invention further provides a polymer which is a polymerized product of an adamantanepolycarboxylic acid represented by following Formula (1a): wherein X.sup.a is a hydrogen atom or a hydrocarbon group; and Y.sup.1, Y.sup.2, Y.sup.3 and Y.sup.4 may be the same as or different from each other and are each a single bond or a bivalent aromatic cyclic group, and an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R.sup.1 and R.sup.2 are each a substituent bound to Ring Z, may be the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group. [0013] The present invention further provides a dielectric film containing one of the polymers. [0014] The present invention also provides a dielectric film containing a polymer formed from an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; Y.sup.1, Y.sup.2, Y.sup.3 and Y.sup.4 may be the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; and an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R.sup.1 and R.sup.2 are each a substituent bound to Ring Z, may be the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group, in which the dielectric film has a 5% weight loss temperature of 500.degree. C. or higher. [0015] The material for dielectric films of the present invention uses a solvent other than ketones and aldehydes and can easily yield a highly crosslinked polymer, whose polymerization reaction is not adversely affected by a Schiff base formed with a monomer component aromatic polyamine. The resulting dielectric film formed by using the material can have high heat resistance and a low dielectric constant. [0016] Further objects, features and advantages of the present invention will become apparent from the following description of the preferred embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1 shows an infrared absorption spectrum of a polymer film prepared in Example 1; and [0018] FIG. 2 shows an infrared absorption spectrum of a polymer film prepared in Comparative Example 1. DESCRIPTION OF THE PREFERRED EMBODIMENTS [0019] The material for dielectric films of the present invention is a polymerizable composition as a solution of an adamantanepolycarboxylic acid represented by Formula (1) and an aromatic polyamine represented by Formula (2) in a solvent other than ketones and aldehydes. Adamantanepolycarboxylic Acid Continue reading... Full patent description for Dielectric films and materials therefor Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Dielectric films and materials therefor patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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