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12/15/05 - USPTO Class 361 | 12 views | #20050276002 | Prev - Next | About this Page

Copper termination inks containing lead free and cadmium free glasses for capacitors

Title: Copper termination inks containing lead free and cadmium free glasses for capacitors

Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20050276002, Copper termination inks containing lead free and cadmium free glasses for capacitors.

1. A capacitor comprising a copper termination, said copper termination made by firing a lead-free and cadmium-free ink including a glass component, said glass component comprising: a. up to about 65 mole % ZnO; b. about 0.1 to about 61 mole % B.sub.2O.sub.3; c. about 0.1 to about 63 mole % SiO.sub.2; and d. wherein the ratio of B.sub.2O.sub.3 to SiO.sub.2 is from about 0.7 to about 5

2. The capacitor of claim 1 wherein the glass component comprises: a. up to about 51 mole % SrO; b. up to about 17 mole % Al.sub.2O.sub.3; c. up to about 40 mole % BaO+CaO; and d. up to about 20 mole % MgO.

3. The capacitor of claim 2 wherein the molar ratio of B.sub.2O.sub.3 to SiO.sub.2 in the glass component is about 0.7 to about 3.

4. The capacitor of claim 2 wherein the glass component comprises about 5 to about 60 mole % B.sub.2O.sub.3+SiO.sub.2.

5. The capacitor of claim 4 wherein the glass component excludes alkali oxides.

6. The capacitor of claim 1 wherein the glass component comprises: a. about 20 to about 60 mole % ZnO, b. up to about 49 mole % SrO, c. about 0.1 to about 61 mole % B.sub.2O.sub.3, d. about 0.1 to about 17 mole % Al.sub.2O.sub.3, e. about 0.1 to about 63 mole % SiO.sub.2, f. up to about 40 mole % BaO+CaO. g. up to about 20 mole % MgO, h. wherein the ratio of B.sub.2O.sub.3 to SiO.sub.2 is from about 0.7 to about 3.

7. The capacitor of claim 6 wherein the glass component comprises about 5 to about 60 mole % B.sub.2O.sub.3+SiO.sub.2.

8. The capacitor of claim 6 wherein the glass component comprises about 25 to about 35 mole % BaO+CaO.

9. The capacitor of claim 6 wherein the glass component comprises about 5 to about 15 mole % MgO.

10. The capacitor of claim 6 wherein the glass component further comprises about 0.1 to about 30 mole % CuO.

11. The capacitor of claim 8 further comprising 2-15 mole % Li.sub.2O+Na.sub.2O+K.sub.2O+Rb.sub.2O+Cs.sub.2O+Fr.sub.2O.

12. The capacitor of claim 1 wherein the glass component comprises: a. about 0.1 to about 65 mole % ZnO, b. about 0.1 to about 51 mole % SrO, c. about 0.1 to about 61 mole % B.sub.2O.sub.3, d. about 0.1 to about 17 mole % Al.sub.2O.sub.3, e. about 0.1 to about 63 mole % SiO.sub.2, f. about 0.1 to about 40 mole % BaO+CaO, g. about 0.1 to about 20 mole % MgO.

13. The capacitor of claim 1 wherein the glass component comprises: a. about 10 to about 56 mole % ZnO, b. about 0.1 to about 49 mole % SrO, c. about 15 to about 35 mole % B.sub.2O.sub.3, d. about 0.1 to about 17 mole % Al.sub.2O.sub.3, e. about 1 to about 35 mole % SiO.sub.2, f. about 0.1 to about 35 mole % BaO+CaO, g. about 0.1 to about 15 mol % MgO, h. wherein the ratio of B.sub.2O.sub.3 to SiO.sub.2 is from about 0.8 to about 4 i. wherein the ink has a viscosity of about 20,000 to about 30,000 centipoise.

14. The capacitor of claim 1 wherein the glass component comprises: a. about 40 to about 60 mole % ZnO, b. 0 mole % SrO, c. about 20 to about 30 mole % B.sub.2O.sub.3, d. about 0.2 to about 15 mole % Al.sub.2O.sub.3, e. about 10 to about 25 mole % SiO.sub.2, f. about 1 to about 15 mole % MgO, g. wherein the glass component excludes alkali oxides, h. wherein the molar ratio of B.sub.2O.sub.3 to SiO.sub.2 is from about 1.0 to about 1.8, i. wherein the ink has a viscosity of about 15,000 to about 35,000 centipoise.

15. A lead-free and cadmium-free ink for forming a conductive copper pathway, said ink including a glass component and a metal component, said glass component comprising: a. up to about 65 mole % ZnO, b. about 0.1 to about 61 mole % B.sub.2O.sub.3, c. about 0.1 to about 63 mole % SiO.sub.2, d. wherein the molar ratio of B.sub.2O.sub.3 to SiO.sub.2 is about 0.7 to about 5 e. wherein the ink has a viscosity of about 15,000 to about 35,000 centipoise, and f. wherein said ink comprises by weight from about 1 to about 22 percent by weight of said glass component.

16. The ink of claim 15, wherein the glass component further comprises: a. about 0.1 to about 20 mole % MgO, and the molar ratio of B.sub.2O.sub.3 to SiO.sub.2 is about 0.7 to about 4, and b. said ink comprises from about 55 to about 85 percent by weight of said metal component.

17. The ink of claim 15, wherein the glass component further comprises BaO and CaO, wherein the total of BaO+CaO is about 0.1 to about 40 mole %.

18. The ink of claim 15, wherein the glass component further comprises: a. about 0.1 to about 51 mole % SrO, b. about 0.1 to about 17 mole % Al.sub.2O.sub.3.

19. The ink of claim 18, wherein the glass component further comprises: a. about 1 to about 17 mole % Al.sub.2O.sub.3, b. about 0.1 to about 20 mole % CuO.

20. The capacitor of claim 18 wherein the glass component comprises: a. about 45 to about 65 mole % ZnO, b. about 10 to about 35 mole % B.sub.2O.sub.3, c. about 1 to about 20 mole % SiO.sub.2, d. about 0.1 to about 20 mole % MgO, e. about 0.1 to about 5 mole % Al.sub.2O.sub.3. f. wherein the molar ratio of B.sub.2O.sub.3 to SiO.sub.2 is about 0.7 to about 2.5.

21. The ink of claim 15 wherein said glass component further comprises: a. about 0.1 to about 20 mole % CO.sub.3O.sub.4+MnO.sub.2, and b. about 0.1 to about 17 mole % La.sub.2O.sub.3+Y.sub.2O.sub.3+Ga.sub.2O.sub.3.

22. A process for making a multilayer ceramic chip capacitor having end terminations comprising: a. forming a green chip by stacking alternating layers of a dielectric material and a conductive electrode material, b. firing the green chip to form a multilayer ceramic chip capacitor body, c. applying a conductive lead-free and cadmium-free ink to the ceramic chip capacitor body, said ink comprising a glass component, said glass component comprising: i. up to about 65 mole % ZnO, ii. about 0.1 to about 61 mole % B.sub.2O.sub.3, iii. about 0.1 to about 63 mole % SiO.sub.2, iv. wherein the ratio of B.sub.2O.sub.3 to SiO.sub.2 is from about 0.7 to about 5, and v. wherein the ink has a viscosity of about 15,000 to about 35,000 centipoise; and, d. post-firing the chip and forming the conductive end terminations.

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