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  Cooling structure of solid state and formation thereof with integrated packageUSPTO Application #: 20060156737Title: Cooling structure of solid state and formation thereof with integrated package Abstract: A cooling structure of solid state applied to a heat source has a module of thermoelectric transfer and a module of thermo transfer including two structures of passive cooling connected and attached the module of thermoelectric transfer, respectively. One structure of first structure of passive cooling is near heat source and heat generated by the heat source is transferred to another structure of passive cooling through the one structure passive cooling and the module of thermoelectric transfer when electrical power is employed to the module of thermoelectric transfer. (end of abstract)
Agent: Birch Stewart Kolasch & Birch - Falls Church, VA, US Inventors: Chun-Kai Liu, Jen-Hau Cheng USPTO Applicaton #: 20060156737 - Class: 062003200 (USPTO) Related Patent Categories: Refrigeration, Using Electrical Or Magnetic Effect, Thermoelectric; E.g., Peltier Effect The Patent Description & Claims data below is from USPTO Patent Application 20060156737. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] This invention relates generally to the cooling structure of solid state, the formation and application thereof. More specifically, this invention relates to the cooling structure of solid state in combination the structures of active and passive cooling, the formation and application thereof. [0003] 2. Description of the Prior Art [0004] With the development of high integrality for electric products, the issue about heat dissipation from CPU, LD or power transistor becomes more and more important. Cooling device of solid state is mostly used because of its high cooling power and low cooling temperature. [0005] Generally, the cooling modules for the cooling device of solid state include the types of passive cooling and active cooling. A heat sink, with passive cooling, dissipates heat when itself is in temperature higher than an environment. Oppositely, a thermoelectric cooler, with active cooling, dissipates heat even the temperature itself is lower than the environment. The structure of thermoelectric cooler is advantageous without pollution and noise, and with compact and light volume. [0006] For example, the known system of heat dissipation for the package structure of IC has thermoelectric device with predetermined size and shape associated with heat sink. However, on consideration of the variety of the package structures of IC, the end product of thermoelectric device restricts the selectivity for heat sink. Furthermore, the easy assembly and use for the dissipation elements would be considered for selecting the system of heat dissipation. For example, the mechanical intensities of conventional thermoelectric material are susceptible to crack and break when attached or used. Furthermore, the interfaces of hereto materials among the thermoelectric material, heat sink and package structure of IC leading to much thermal resistance. Once the existence of the more and more interfaces of hereto materials, the dissipation effect could be down. Furthermore, the done thermoelectric device and heat sink assembled to the package structure of IC increase the volume of a whole package. SUMMARY OF THE INVENTION [0007] To resolve the issue of heat dissipation caused by the interface of hereto materials, the structure of solid state in combination structures of active and passive cooling is provided herein. The structure of active cooling is directly formed or combined on the one of passive cooling during the formation of the structure of passive cooling to reduce the formation of hereto surface that causes the poor heat dissipation and transference. [0008] To reduce the size of an electrical device on consideration of heat dissipation, the structure of solid state in combination of active and passive cooling is provided herein. The cooling structure is directly applied to single electronics device, such as the package structure of IC, without the addition of assembly or fixture. [0009] Accordingly, a cooling structure of solid state applied to a heat source has a module of thermoelectric transfer and a module of thermal transfer including a first structure of passive cooling and a second structure of passive cooling connected and attached the module of thermoelectric transfer, respectively. The structure of first structure of passive cooling is near heat source and heat generated by the heat source is transferred to the structure of second structure of passive cooling through the structure of first structure of passive cooling and the module of thermoelectric transfer when electrical power is employed to the module of thermoelectric transfer. [0010] Accordingly, a method of forming cooling structure of solid state is provided. A plurality of first adhesion structures are on the first surface of a first structure of passive cooling. A plurality of thermoelectric transfer structures are positioned on the first surface. Each plurality of thermoelectric transfer structures is associated with each of the first adhesion structures. A plurality of second adhesion structures are on the second surface of a second structure of passive cooling. Each the plurality of thermoelectric transfer structures is attached to each of the second adhesion structures. BRIEF DESCRIPTION OF THE DRAWINGS [0011] These and other objects and advantages of the present invention will become more fully apparent from the following detailed description when read in conjunction with the accompanying drawings with like reference numerals indicating corresponding parts throughout, wherein: [0012] FIG. 1 is a schematically side diagram illustrating a structure of active cooling in accordance with one embodiment of the present invention. [0013] FIG. 2 is a side-sectional diagram illustrating a cooling structure of solid state in accordance with one embodiment of the present invention. [0014] FIG. 3A is a cross-sectional diagram illustrating a cooling structure of solid state applied to a package of wire bond in accordance with the present invention. [0015] FIG. 3B is a cross-sectional diagram illustrating a cooling structure of solid state applied to a package of cavity-down in accordance with the present invention. [0016] FIG. 3C is a cross-sectional diagram illustrating a cooling structure of solid state applied to a lead-frame package in accordance with the present invention. [0017] FIG. 3D is a cross-sectional diagram illustrating a cooling structure of solid state applied to multi-chip package in accordance with the present invention. [0018] FIG. 4A to FIG. 4D is a cross-sectional diagrams illustrating a cooling structure of solid state integrated to a package structure of wire bond in accordance with the present invention. [0019] FIG. 5A to FIG. 5D are schematically cross-sectional diagrams illustrating an exemplary cooling structure of solid state integrated into a package structure of wire bond in accordance with the present. [0020] FIG. 6 is a schematically cross-sectional diagram illustrating the cooling structure combined with a molding frame in accordance with the present invention. DESCRIPTION OF THE PREFERRED EMBODIMENT Continue reading... 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