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  Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereofRelated Patent Categories: Heat Exchange, Conduit Within, Or Conforming To, Panel Or Wall Structure, Opposed Plates Or ShellsCooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060096748, Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a continuation of prior U.S. patent application Ser. No. 10/828,834, filed Apr. 21, 2004, the entire disclosure of which is incorporated herein, which is a continuation of prior U.S. patent application Ser. No. 10/024,598, abandoned. BACKGROUND OF THE INVENTION [0002] The present invention relates to a new cooling plate and a manufacturing method thereof, a sputtering target and a manufacturing method thereof, a backing plate and a manufacturing method thereof, and a sputtering target and a manufacturing method thereof. PRIOR ART [0003] Although a cooling plate is widely used industrially, an efficient cooling function is required. For example, in a sputtering apparatus, efficient radiation of the heat generated in a target material affects the performance of a thin film that is obtained. In particular, in the case of a sputtering apparatus for a liquid crystal manufacturing apparatus, a target material with a large area is used, which radiates plenty of heat. For this reason, a backing plate is used as a cooling plate, the backing plate having a channel inside a smooth plate composed of copper, a copper alloy, aluminum, or an aluminum alloy, and having the structure that the channel is covered with a lid and the lid and cooling plate are metallically joined to be sealed. Up to now, the joining of a body of a backing plate and a lid is performed by metallically joining them by electron beam welding, diffusion bonding, a brazing method, etc. In addition, besides the backing plate, various kinds of water cooled jackets, water-cooled chills, etc. are used as a heat sink, and every one has the structure of having a channel therein similarly to the above-described backing plate. [0004] Moreover, it is necessary for a backing plate used for a liquid crystal manufacturing apparatus to support a target material at a sputtering step, and to have an efficient cooling function. For this reason, the backing plate has a channel inside a smooth plate composed of copper, a copper alloy, aluminum, or an aluminum alloy, and has the structure that the channel is covered with a lid and the lid and cooling plate are metallically joined to be sealed up to now, the joining of a body of a backing plate and a lid is performed by metallically joining them by electron beam welding, diffusion bonding, a brazing method, etc. [0005] In regard to the manufacture of this backing plate, there is JP-A-2000-73164 specification, where a backing plate is shown, where a plate-like cooling section that has a coolant passage inside is integrated with a plate-like base section by friction stir welding. [0006] Since a backing plate needs to enhance cooling effectiveness, good flatness and smoothness are required of a surface of the backing plate that contacts with a target material etc. Up to now, the joining of a body of a backing plate and a lid covering a channel is performed by electron beam welding, laser welding, diffusion bonding, a brazing method, etc. However, since it is necessary to make a surface flat by correction or machining after joining because these welding methods have large heat distortion after joining, they have problems in respect of quality, and accuracy, and further productivity and cost. [0007] Furthermore, in the above-described known example, although the structure that a target is provided through a plate-like base section provided on a plate-like cooling section which has a coolant passage is shown, not only direct cooling cannot be obtained, but also the formation of a compact cooling passage cannot be obtained. SUMMARY OF THE INVENTION [0008] An object of the present invention is to provide a cooling plate, which has high cooling effectiveness and a thin, large area, and a manufacturing method thereof, and a sputtering target and a manufacturing method thereof. [0009] The present invention is a cooling plate characterized in that a groove, which becomes a passage of a coolant, is provided inside a body, that this groove is covered with a lid with width larger than the groove, that the lid is joined to the body by friction stir welding, and that a weld bead formed by the welding is outside the passage. [0010] Furthermore, the present invention is a cooling plate characterized in that grooves, which become passages of several independent coolants, are provided inside a body, that the groove is covered with a lid, that the lid is joined to the body by friction stir welding, and that a weld bead formed by the joining is outside the passage. [0011] Moreover, the present invention is a cooling plate characterized in having any one or combination of the structure that a groove, which becomes a passage of a coolant, is provided inside a body, the groove is covered with a lid, the lid is joined to the body by friction stir welding, and at least an end of a weld bead formed by the joining is formed in the body except a joining, the structure that a groove, which becomes a passage of a coolant, is provided inside a body, the groove is covered with a lid with width larger than the groove, the lid has one or more fins, the groove is covered with a lid with width larger than the groove, the lid is joined to the body by friction stir welding, and a weld bead formed by the joining is outside the passage, and the structure that the passage is a passage closed within the body, an air vent is provided in a portion forming the passage, and at least an end portion of the weld bead of the joining is formed except the joining. [0012] In particular, since the present invention performs joining with fitting a lid, which covers a groove., into the groove to a body where the groove with a path as a closed channel is formed, there is no mutual expansion of matching sections. Hence, not only good joining can be obtained, but also there is no excessive joining because the body itself is in one piece, and hence it is possible to obtain a cooling plate with a compact thin shape is obtained also in a large area regardless of an area. [0013] The channel is at least one of an I-shaped channel, a U-shaped channel, an S-shaped channel, and an M-shaped channel, a round channel, and a spiral channel, and it is preferable that one or more of them are used. Since each channel has a closed path, an entrance and an exit are located in each path. Hence, each entrance and each exit are connected in parallel in two or more channels, and hence, uniform cooling can be performed as the whole cooling plate. It is preferable to join the channels so that more uniform cooling may be performed. [0014] Although it is preferable that the body and lid are composed of copper, a copper alloy, aluminum, an aluminum alloy, titanium, or stainless steel, the former having higher heat conduction is more preferable. [0015] The present invention is a manufacturing method of a cooling plate that has a first groove, which becomes a passage of a coolant, and a second groove, which has width larger than the first groove and receives a lid on the first groove, inside a body, places the lid on the second groove, and is joined to the body, the manufacturing method of a cooling plate being characterized in that, while the lid and the body are joined together by friction stir welding owing to the insertion of a rotation tool having a shoulder and a pin, the joining is performed so that a weld bead formed by the joining may become outside the passage. The above-described joining method can perform joining at a temperature of a fusing point of copper or aluminum or lower. Furthermore, the above-described joining performs joining in a coolant such as water, oil, or an inert gas, or with compulsorily cooling the lid and body by pouring the above-described coolant near the joining. [0016] A friction stir welding method according to the present invention is a method of performing joining with using frictional heat and plastic flow which are generated between the rotation tool and joining material by rotating and inserting a rotation tool which has a shoulder and a pin that are made of material harder than the aluminum or a copper alloy substantially and relatively moving the joined material. This is disclosed by National Publication of the Translated Version of PCT Application No. 7-505090 specification, etc. That is, since a plastic flow phenomenon by the frictional heat between the rotation tool and joined material is used, this is different from conventional welding such as electric arc welding and electron beam welding, but does not perform joining (welding) with melting the joined material. Furthermore, the friction stir welding method differs from a method of rotating workpiece like a conventional friction welding method performing joining with frictional heat, but is a method of being able to continuously join a workpiece in the longitudinal direction of a joining line below a fusing point of the joining material. [0017] By using the friction stir welding method, since it is possible to perform joining at a low temperature below the fusing point of a joining material, distortion by the joining is small in comparison with a conventional welding method, and hence a cooling plate with high accuracy can be manufactured. Hence, it is possible to simplify the correction step after joining, and to reduce cost by shortening correction work-hours. [0018] Furthermore, this joining method can perform joining in a coolant such as water, oil, or an inert gas, or with pouring the above-described coolant near the joining. At this time, since it is possible to suppress temperature rise in a position apart by several mm from the joining, it is possible to suppress heat distortion after joining to the minimum. Hence, it is possible to make a face, which contacts to the silicon wafer, smooth and accurate, and therefore, to manufacture a reliable backing plate. [0019] Namely, the present invention is a manufacturing method of a backing plate that is made of copper, a copper alloy, aluminum, or an aluminum alloy, is composed of a body and a lid, and has a cooling channel that is covered with the lid, and in which the lid is metallically joined to the body, the manufacturing method of a backing plate being characterized in that the lid and body are joined by friction stir welding. [0020] When the rotation tool that is composed of the shoulder and pin that are used for friction stir welding rotates counterclockwise, it is preferable that the channel is in the left-hand side to the traveling direction of the rotation tool. Moreover, when the rotation tool rotates clockwise, it is preferable that the channel is in the right-hand side. When the rotation tool rotates counterclockwise, a minute defect may arise in the right-hand side to the traveling direction of the rotation tool rarely. When the channel is located in the right-hand side at this time, a defect will arise near a wall surface of the channel. However, when the channel is located in the left-hand side, a defect will arise inside the body and will not arise near the channel. Of course, what is necessary is just to consider this conversely, when the rotation tool rotates clockwise. [0021] Moreover, the center of the rotation tool which is composed of the shoulder and pin which are used for friction stir welding may be in a position apart from the channel by more than the maximum radius of a pin section. Thus, in the friction stir welding, a workpiece receives a downward load of about 10 kN from the rotation tool. If the rotation tool is on the lid above the channel, copper etc. will be deformed and collapsed due to this load, and a part of a wall will escape into the channel so that the joining will not be successful. In addition, in general, the geometry of a channel is about 50 W.times.5 D mm, and the thickness of a lid is about 5 mm. Continue reading about Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof... Full patent description for Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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