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  Cooling fin assemblyUSPTO Application #: 20070023177Title: Cooling fin assembly Abstract: A cooling fin assembly provides a plurality of cooling fins and each of the cooling fins has a cooling fin body with at least a recess part indenting toward a side thereof. The recess part has an insert space with a through hole slightly less than the entire area of the recess part for being passed through with a heat guide pipe. Further, a folded side surrounds the through hole and extending toward the side. Once a heat guide medium, which is inserted between the through hole and the heat guide pipe, is heated up to become in a state of melting during being set up, the molten heat guide medium distributes between the outer surface of the heat guide pipe and the through hole and over the folded side evenly. (end of abstract)
Agent: G. Link Co., Ltd. - Minooka, IL, US Inventors: Li-Ping Lee, Wen-Yuan Wu, Hung-Ming Chou USPTO Applicaton #: 20070023177 - Class: 165182000 (USPTO) Related Patent Categories: Heat Exchange, Tubular Structure, With Discrete Heat Transfer Means, With Means Spacing Fins On Structure The Patent Description & Claims data below is from USPTO Patent Application 20070023177. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention is related to a cooling fin assembly and particularly to a cooling fin assembly joined to a heat guide pipe [0003] 2. Brief Description of the Related Art [0004] Technology progressing rapidly to allow many high power electronic components being able to minimize the sizes thereof in order to fulfill requirement of lightness, thinness, shortness and smallness. Hence, more parts can be installed in the same size as before. For instance, the CPU (central processing unit) in a computer increases more electronic parts inside in order to obtain higher performance efficiency. Therefore, heat removal from the electronic components is a subject much more important than before. In practice, mostly cooling fins associated with a fan is used for helping the electronic components to dissipate heat. However, due to external space limitation, it is required to have lighter and smaller cooling fins with high heat transmission rate. [0005] Under the preceding limitation, a conventional cooling fin structure is joined to a heat guide pipe for enhancing heat conductive capability. Referring to FIGS. 1 to 3 and 3a, the conventional cooling structure with a heat guide pipe includes a plurality of cooling fins 11 and at least a heat guide pipe 12. Each of the cooling fins 11 has a through hole 111 and an projection 112 surrounding the through hole 111 at a side of the respective cooling fin 11 such that the cooling fins 11 are attacked to each other in a way of the respective through hole aligning with each other. The heat guide pipe passes through the respective hole 111 and soldering paste 13 is coated between inside the through hole and the projection 112 and the heat guide pipe 12 for binding the through holes 111 and the heat guide pipe together. [0006] However, the problem of the preceding prior art is in that part of the coated soldering paste 13 is squeezed out and stays at the outer surface of the outermost cooling fin 11 during the heat guide pipe passing through the through holes 111. Under this circumference, the soldering paste 13 left between the through hole 111 and the projection 112 and the heat guide pipe 12 is unable to distribute evenly between the through hole 111 and the projection 112 and part of the soldering paste overflows to outside the respective projection 112 as shown in FIG. 3a. It results in undesirable tightness and looseness between the cooling fins 11 and the heat guide pipe 12 to degrade heat conductive effect and to defect appearance thereof. [0007] Further, when the molten soldering paste passes the respective cooling fins 11, the respective projection 112 increases flow resistance and lowers the flow rate such that effect of heat dissipation is seriously influenced and it is unable to meet the need of the high power electronic component. SUMMARY OF THE INVENTION [0008] In order to solve the preceding problems, an object of the present invention is to provide a cooling fin assembly in which at least a cooling fins has a cooling fin body with at least a recess part indenting toward a side thereof. The recess part has an insert space with a through hole slightly less than the entire area of the recess part for being passed through with a heat guide pipe. Further, a folded side surrounds the through hole and extending toward the side. Once a heat guide medium, which is inserted between the through hole and the heat guide pipe, is heated up to become in a state of melting during being set up, the molten heat guide medium distributes between the outer surface of the heat guide pipe and the through hole and over the folded side evenly. BRIEF DESCRIPTION OF THE DRAWINGS [0009] The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which: [0010] FIG. 1 is an exploded perspective view of a conventional cooling fin assembly; [0011] FIG. 2 is an exploded sectional view of the conventional cooling fin assembly; [0012] FIG. 3 is a sectional view of the conventional cooling fin assembly; [0013] FIG. 3a is an enlarged view of the part of dashed circle in FIG. 3 illustrating soldering paste residue thereon; [0014] FIG. 4 is a perspective view of a cooling fin assembly according to the present invention; [0015] FIG. 5 is a sectional view of a cooling fin assembly according to the present invention; [0016] FIG. 6 is a sectional view illustrating the cooling fin assembly of the present invention being joined to a heat guide pipe in series; [0017] FIG. 7 is a sectional view illustrating soldering paste being full between the inserted space and the clearance in the cooling fin assembly of the present invention; [0018] FIG. 8 is a sectional view illustrating the folded side of the cooling fin assembly contacting the outer surface of the heat guide pipe tightly; [0019] FIG. 9 is a sectional view of another configuration of a recess part in the cooling fin assembly of the present invention; [0020] FIG. 10 is a sectional view illustrating heat conductive media being full of the recess part shown in FIG. 9; and [0021] FIG. 11 is a sectional view illustrating another type of folded side of the cooling fin assembly contacting the outer surface of the heat guide pipe tightly. Continue reading... Full patent description for Cooling fin assembly Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Cooling fin assembly patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Cooling fin assembly or other areas of interest. ### Previous Patent Application: Stacked plate heat exchanger in particular an oil cooler for motor vehicles Next Patent Application: Cooling fin unit Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Cooling fin assembly patent info. IP-related news and info Results in 1.82396 seconds Other interesting Feshpatents.com categories: Novartis , Pfizer , Philips , Polaroid , Procter & Gamble , |
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