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Cooling deviceCooling device description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20080283216, Cooling device. Brief Patent Description - Full Patent Description - Patent Application Claims The present invention relates to a cooling structure for motor of fan, and more particularly to a cooling fan that achieves the object of temperature rise for its heat-generating electronic components without changing the original mechanism design, to prolong the operation lifespan of fan. BACKGROUND OF THE INVENTIONAs shown in FIG. 1 and FIG. 2, a conventional cooling fan structure includes a housing 1, an impeller 2 and a circuit board 3. The housing 1 has an air flow channel 10, an air inlet, an air outlet, a base 13 and a stator set 14, in which the air flow channel 10 accommodates the impeller 2 such that air flow is inputted from the air inlet 11 and outputted from the air outlet 12, the base is located beside the air inlet 12 for carrying the circuit board 3, and the stator set 14 and is integrated with the impeller 2. The impeller 2 has a hub 21, a spindle 22, several bladed and an annular magnet 24, in which the spindle 22 is located centrally within the hub 21 and is movably bundled on the base 13, and the blades are circularly disposed around the periphery of the hub 21. A sensing component 31 and at least a heat-generating electronic component 32 are disposed on the circuit board 3 for controlling alternate excitation of the stator set 14 to impel and rotate the impeller 2. Air flow is further driven by the blades 23 to flow from the air inlet 11 to the air outlet 12. Whereas, the gate current direction of the heat-generating electronic component 32 is controlled with a metallic/non-metallic doping material with semi-conductivity. As a result, while the heat-generating electronic component is operated, its material certainly consumes partial electrical energy and converts that into thermal energy. However, structurally, the heat-generating electronic component 32 is located within the range covered by the base 13 and the hub 21. Accordingly, the heat-generating electronic component 32 lacks of an adequate cooling mechanism, easily impacts on its operational stability due to an excessively high temperature and even deteriorates the efficacy and lifespan of the cooling fan. Therefore, the inventor of the present invention has invented a cooling fan as shown in FIG. 3 and FIG. 4 to improve the shortcoming of the conventional structure. Such cooling fan has a protrusion 30 extended from the circuit board 3 and beyond the hub 21 of the impeller 2. The heat-generating electronic component 32 is disposed on the protrusion 30 so that one part or the entire heat-generating electronic component 32 is located at a downwind place of the blades 23 of the impeller 21, thereby dissipating the heat of the heat-generating electronic component 32 by virtue of air flow guided by the blades 23. The cooling fan previously developed by the present invention can surely reduce the temperature rise of the heat-generating electronic component 32 and prevent from affecting the overall performance and lifespan of the cooling fan as a result of high temperature. However, such solution also gives rise to the issues of the conflict between the blades 23 and the heat-generating electronic component 32 accruing electrostatic interference at the same time. In original mechanism design of the cooling fan, a minimum safety distance H is maintained between the bottom edge of the hub 21 of the impeller 2 and the circuit board 3. However, after the protrusion 3 and the heat-generating electronic component 32 are extended beyond the hub 21, the distance h between the bottom edge of the hub 21 of the impeller 2 and the heat-generating electronic component 32 will be diminished and thus will result in a conflict between the impeller 2 and the heat-generating electronic component 32 because it is less than the minimum safety distance H. If intending to prevent the conflict, the original mechanism design of the cooling fan must be altered. Furthermore, when one part or the entire heat-generating electronic component 32 is located at a downwind place of the blades 23, it is equivalent to a situation directly exposed to an air flow field guided by the blades 23, making electrostatic charge generated by air collision in the flow field interfere with the normal operation of the heat-generating electronic component 32 or even cause malfunction thereof. SUMMARY OF THE INVENTIONIn view of the foregoing concern, the present invention thus provides a cooling structure for motor of fan, whose main object targets at achieving the function of lowering the temperature rise of a heat-generating electronic component under the premise of no change of the original mechanism design. The cooling structure has a highly heat-conductive metal integrated with at least one side of a circuit board to enhance the heat dissipation area and heat transfer performance of the circuit board, and at least one part of the circuit board is protruded beyond a hub of an impeller so as to position the protrusion at a downwind place of blades of the impeller to facilitate fast heat dissipation. Consequently, the present invention can carry out heat dissipation of the entire circuit board and the heat-generating electronic component by the heat transfer function of the highly heat-conductive metal to similarly attain a good cooling mechanism without altering the original mechanism design. A second object of the present invention is to prevent the heat-generating electronic component from being interfered by electrostatic charge in the air flow field. The present invention can carry out heat dissipation of the entire circuit board and the heat-generating electronic component such that the heat-generating electronic component on the circuit won't be necessarily exposed in the air flow field so as to ensure that its normal operation function won't be interfered due to electrostatic interference. BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a plane view showing a conventional structure; FIG. 2 is a cross-sectional view showing the conventional structure; FIG. 3 is a plane view showing a prior cooling fan developed by the inventor of the present invention; FIG. 4 is a cross-sectional view showing the prior cooling fan developed by the inventor of the present invention; FIG. 5 is a 3D exploded view showing a first preferred embodiment of the present invention; Continue reading about Cooling device... Full patent description for Cooling device Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Cooling device patent application. Patent Applications in related categories: 20090288801 - Capillary pumped diphasic fluid loop passive thermal control device with thermal capacitor - The thermal control device comprises at least one capillary pumped diphasic fluid loop, comprising, in a known manner, an evaporator extracting the heat from a so-called hot source and connected via a vapour pipe to a condenser in which the condensation of the fluid vapour releases thermal energy transmitted to ... ### 1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Cooling device or other areas of interest. ### Previous Patent Application: Vehicle air conditioning device Next Patent Application: Stackable energy transfer core spacer Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Cooling device patent info. 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