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04/24/08 | 36 views | #20080093057 | Prev - Next | USPTO Class 165 | About this Page  165 rss/xml feed  monitor keywords

Cooling apparatus having an auxiliary chiller, and an apparatus and method of fabricating a semiconductor device using the same

USPTO Application #: 20080093057
Title: Cooling apparatus having an auxiliary chiller, and an apparatus and method of fabricating a semiconductor device using the same
Abstract: A cooling apparatus having an auxiliary chiller is provided. The apparatus can include a wafer chuck on which a wafer is mounted and in which a cooling cavity is formed. A main chiller having a main coolant reservoir can be spaced apart from the wafer chuck. The cooling cavity and the main coolant reservoir can be arranged in communication with each other through coolant passages. The coolant passages can include an auxiliary chiller detachably installed thereon, respectively. A method of cooling a wafer chuck or process chamber during a semiconductor device fabrication process is also provided. Using the method and apparatuses of this invention, fine temperature adjustments of the wafer chuck are possible. (end of abstract)
Agent: Marger Johnson & Mccollom, P.C. - Portland, OR, US
Inventors: Dong-Hyun CHOI, Yong-Wook KIM, Cheol-Won JANG, Yong-Ho CHOI
USPTO Applicaton #: 20080093057 - Class: 165104330 (USPTO)
Related Patent Categories: Heat Exchange, Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat, Liquid Fluent Heat Exchange Material, Cooling Electrical Device

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Thermal module
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Systems and methods for orientation and direction-free cooling of devices
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