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  Contact grid array systemUSPTO Application #: 20070020960Title: Contact grid array system Abstract: A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable connector for high speed, high performance electronic circuitry and semiconductors. The electrical connector can be used to make, for example, electrical connections from components such as a Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device. A normalized working range for an array of elastic contacts of the interposer can be about 0.2 to 1.0. A reversible normalized working range is maintained through multiple connections and reconnections using a highly elastic material for the contact arms. In one aspect, a first electrical component having a first array pitch can be connected to a second electrical component having a second array pitch. (end of abstract) Agent: Michael Bednarek Pillsbury Winthrop Shaw Pittman LLP - Mclean, VA, US Inventor: John D. Williams USPTO Applicaton #: 20070020960 - Class: 439066000 (USPTO) Related Patent Categories: Electrical Connectors, Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc., With Provision To Conduct Electricity From Panel Circuit To Another Panel Circuit, Conductor Is Compressible And To Be Sandwiched Between Panel Circuits The Patent Description & Claims data below is from USPTO Patent Application 20070020960. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a continuation-in-part of U.S. patent application Ser. No. 10/412,729, filed Apr. 11, 2003, and is a continuation in part of U.S. patent application Ser. No. 10/731,213 filed Dec. 8, 2003, which are hereby incorporated by reference in their entirety. BACKGROUND [0002] 1. Field of the Invention [0003] This invention pertains to elastic electric contacts made by processes for making electrical contacts using manufacturing techniques that result in flexibility in design and performance of the contacts. [0004] 2. Background of the Invention [0005] The ability to make separable electrical contact with contacts of miniature electronic circuits has become more problematic as the mechanical, electrical, and reliability requirements of these electrical contacts become more demanding. Nano springs, pogo pins, micro springs, and other miniature contact devices have been developed to deal with the problem of making reliable electrical contact between a microcircuit and the rest of an electronic system. The problem for the industry, however, is that no particular contact design appears to provide all of the properties required, even where specially designed contact elements are used in specific applications. None of the existing contacts can meet all of the design criteria. [0006] It is desirable to have separable electrical connections in electronic applications because these connections are used in system assembly, device testing, and wafer probing. DESCRIPTION OF THE DRAWINGS [0007] FIG. 1 is a flow chart that illustrates a method for forming an interposer, according to one aspect of this invention. [0008] FIG. 2 is a schematic diagram that illustrates an exemplary conductive sheet having a pre-formed contact array, according to a configuration of the present invention. [0009] FIG. 3A is a flow chart that illustrates exemplary steps involved in a method for forming an interposer, according to one aspect of the present invention. [0010] FIG. 3B is a flow chart that depicts exemplary steps involved in a method for forming an interposer, according to another aspect of the present invention. [0011] FIG. 4A is an image that illustrates a plan view of an array of capture pads disposed on a substrate, according to one configuration of this invention. [0012] FIG. 4B is an image that illustrates a cross section of an exemplary substrate illustrating a series of conductive vias surrounded by capture pads, according to one configuration of this invention. [0013] FIG. 5 is a graph that illustrates the shrinkage in a sheet of Be--Cu alloy after annealing at 600 F, in accordance with exemplary processing steps of FIG. 3A. [0014] FIGS. 6A and 6B are schematic diagrams that illustrate a perspective view of exemplary two dimensional contact structures. [0015] FIGS. 6C and 6D are schematic diagrams that illustrate a perspective view of exemplary three dimensional formed contact structures based on the two dimensional precursor structures of 6A, and 6B, respectively. [0016] FIGS. 7A and 7B are images that illustrate an example of the effect of relief depressions on a contact structure according to the method of FIG. 3A. [0017] FIG. 7C is an image that illustrates another exemplary contact arrangement having a depression in the contact sheet containing the elastic arm. [0018] FIG. 7D is an image that illustrates an exemplary contact arrangement having a spring sheet through hole that is filled with extruded adhesive material from layer. [0019] FIG. 7E is a graph that depicts load-displacement curves of exemplary contact arms in substrates with and without relief depressions, respectively. [0020] FIGS. 8A and 8B are schematic diagrams that illustrate top and side views of contact arms arranged in accordance with configurations of this invention. [0021] FIG. 8C is a schematic diagram that depicts an enlarged sectional view of exemplary contact arms for a BLGA contact array. [0022] FIG. 9 is an image that illustrates a cross-sectional view of a portion of an interposer arranged according to another configuration of this invention. Continue reading... Full patent description for Contact grid array system Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Contact grid array system patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Contact grid array system or other areas of interest. ### Previous Patent Application: Circuit board including jacks Next Patent Application: Electrical connector Industry Class: Electrical connectors ### FreshPatents.com Support Thank you for viewing the Contact grid array system patent info. IP-related news and info Results in 1.68243 seconds Other interesting Feshpatents.com categories: Accenture , Agouron Pharmaceuticals , Amgen , AT&T , Bausch & Lomb , Callaway Golf |
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