| Connection arrangement for optical communication systems -> Monitor Keywords |
|
|
  Connection arrangement for optical communication systemsUSPTO Application #: 20060140549Title: Connection arrangement for optical communication systems Abstract: An arrangement including: an electrical subassembly, an optical subassembly, the electrical subassembly and the optical subassembly having an associated electrical connection including at least one electrical lead extending therebetween, and an electrically non-conductive electromagnetic absorber body arranged to at least partly cover the electrical lead. (end of abstract) Agent: Paul D. Greeley Ohlandt, Greeley, Ruggiero & Perle, L.L.P. - Stamford, CT, US Inventor: Salvatore Sabbatino USPTO Applicaton #: 20060140549 - Class: 385089000 (USPTO) Related Patent Categories: Optical Waveguides, With Disengagable Mechanical Connector, Optical Fiber To A Nonfiber Optical Device Connector, Plural Fiber/device Connections The Patent Description & Claims data below is from USPTO Patent Application 20060140549. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERANCE TO RELATED APPLICATIONS [0001] This application is a divisional of U.S. application Ser. No. 10/809,298 filed Mar. 25, 2004, which is now pending. 1. FIELD OF THE INVENTION [0002] The present invention relates to optical communication systems such as fiber optic communication systems. 2. DISCUSSION OF THE BACKGROUND ART [0003] Transmission bit-rates of 10 Gb/s are now current in optical data communication systems and higher bit-rates are expected to become current in the future. [0004] At these operational speeds, using metallic leads to carry electrical signals between optical and electrical subassemblies may appreciably affect radio-frequency (RF) performance. This is particularly true in fiber optic transceivers where large volumes of data are aggregated to produce a very high speed serial data stream, which is then used to drive a light source, e.g. a laser. [0005] Additionally, at very high operational speeds, low cost and/or small dimension requirements imposed on apparatus give rise to significant problems in terms of electromagnetic immunity (EMI), electromagnetic compatibility (EMC), RF management and signal integrity. [0006] At 10 Gb/s and higher, the existing solutions for connecting the optical subassemblies (OSAs) and the electrical subassembly (ESA) in a fiber optic transceiver primarily aim at minimizing the interconnection loss. Exemplary of such prior art solutions is the use of a flexible printed circuit board (PCB). This is oftentimes referred to as a "flex". [0007] Using a flex generally improves RF performance of the interconnection. However, implementing this solution is time consuming in view of the need of attaching the flex to the ESA and the OSA. Moreover, the flex is not self-protected from crosstalk (X-Talk) and is not exempt from EMC problems. SUMMARY OF THE INVENTION [0008] A basic object of the invention is to provide an improved solution dispensing with the problems inherent in such prior art arrangement as the use of a "flex" discussed in the foregoing. [0009] A specific object of the invention is to provide an improved solution dispensing with crosstalk developed between transmitter and receiver in an optical communication environment (e.g. in a fiber optic transceiver). Essentially, crosstalk is due to the electromagnetic field irradiated from the transmitter (receiver) and picked up by the receiver (transmitter). [0010] Another object of the invention is to provide an arrangement improved in terms of RF-performance of the OSA-to-ESA interconnections: these being usually comprised of a so-called lead frames in air causes these interconnections to exhibit an undesirably high impedance. [0011] Still another object of the invention is to provide an arrangement improved in terms of electromagnetic immunity (EMI) of the RF-paths. [0012] A still further object of the invention is to provide an arrangement improved in terms of electromagnetic compatibility (EMC) of e.g. a transceiver. [0013] An additional object of the invention is to provide an arrangement that jointly achieves all the objects considered in the foregoing. [0014] A preferred embodiment of the invention is thus based on the use of a lead frame in conjunction with electromagnetic absorber material. Electrical connection of the OSAs and the ESA is ensured by means of metallic leads. These leads are easy to produce while simultaneously easy and fast to solder to the ESA. [0015] As indicated, crosstalk and other problems related to EMC and EMI are primarily related to emissions of electromagnetic fields from the leads and/or to electromagnetic fields picked up by the leads. More specifically, crosstalk is due to the electromagnetic field irradiated from the transmitter (receiver) and picked up by the receiver (transmitter). The influence of these fields is drastically reduced by the absorber material. Using the absorber material on both the receiver (RX) and the transmitter (TX) side will drastically reduce electromagnetic emissions. Due to the absorbing properties of the material, these electromagnetic emissions are converted into thermal power, which is easily dissipated. [0016] Additionally, the absorber material reduces the discontinuity in the electrical path generated when leads in air are used as well as the relative difference of characteristic impedance of the lead zone. The absorber material has a dielectric constant higher than air and thus closer to the dielectric constant of the PCB and the feed throughs of the OSAs. [0017] RF-performance of the interconnection will be improved using the absorber, because the dielectric constant of the material is highly beneficial in reaching the desired characteristic impedance. Without an absorber material, a frame comprised of leads in air will typically have an impedance higher than the desired impedance. At least partly embedding the leads in an absorber material reduces the impedance and thus leads to improved performance. [0018] From the viewpoint of EMI/EMC, the absorber material represents a way to increase immunity and compatibility in apparatus such as a transceiver. The electromagnetic emissions otherwise likely to be picked up by equipment around the transceiver will be shielded by the external protections of the transceiver and eventually absorbed internally to the module. Additionally, leakage of electromagnetic fields from the transceiver towards the surrounding environment will be drastically reduced because a large portion of them is absorbed internally to the module. BRIEF DESCRIPTION OF THE DRAWINGS [0019] The invention will now be described, by way of example only, by referring to he annexed figures of drawing, wherein: Continue reading... Full patent description for Connection arrangement for optical communication systems Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Connection arrangement for optical communication systems patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Connection arrangement for optical communication systems or other areas of interest. ### Previous Patent Application: Optional waveguide, optional waveguide module, and a method for fabricating optional waveguide module Next Patent Application: Optical module for multi-wavelength Industry Class: Optical waveguides ### FreshPatents.com Support Thank you for viewing the Connection arrangement for optical communication systems patent info. IP-related news and info Results in 0.44284 seconds Other interesting Feshpatents.com categories: Accenture , Agouron Pharmaceuticals , Amgen , AT&T , Bausch & Lomb , Callaway Golf |
||
