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Conductive terminal and the electrical connector using the conductive terminalUSPTO Application #: 20060105598Title: Conductive terminal and the electrical connector using the conductive terminal Abstract: A conductive terminal and the electrical connector using the conductive terminal, the conductive terminal is received in a terminal channel defined in an insulative housing of the electrical connector which can transmit signal between an electronic component and a circuit board. The conductive terminal has a first wall, a second wall connecting with the first wall in a certain angle and third wall connecting with the second wall in a certain angle and opposite to the first wall. The conductive terminal forms a mounting portion connecting with the solder ball. The mounting terminal forms a mounting portion connecting with the solder ball. The mounting portion comprises a first horizontal portion extending and bending from one end of the first wall toward the third wall, and a second horizontal portion on the third wall and corresponding to the first horizontal portion toward the first wall. A gap is defined between an end of the second horizontal portion and an end of the first horizontal portion near the second horizontal portion so that the first horizontal portion and the second horizontal portion form a structure for locating the solder ball. (end of abstract) Agent: Robert J Zeitler Molex Incorporated - Lisle, IL, US Inventor: Yin Hao USPTO Applicaton #: 20060105598 - Class: 439083000 (USPTO) Related Patent Categories: Electrical Connectors, Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc., Distinct Contact Secured To Panel Circuit, Contact Soldered To Panel Circuit The Patent Description & Claims data below is from USPTO Patent Application 20060105598. Brief Patent Description - Full Patent Description - Patent Application Claims FIELD OF THE INVENTION [0001] The present invention generally relates to a conductive terminal and, more particularly, to a conductive terminal used in an electrical connector which can transmit signals between an electronic component and a circuit board via a solder ball connected with the circuit board. BACKGROUND OF THE INVENTION [0002] Referring to FIG. 1 to 3, as disclosed in T.W. patent application No. 087216147, publication No. 392975, an electrical connector 1 is a zero insertion force ("ZIF") electrical connector for electrically interconnecting a central processing unit ("CPU") and a mainboard used in computer device. The electrical connector 1 comprises an insulative housing 10 and a plurality of conductive terminals 2. Each of the conductive terminals 2 electrically connects with the circuit board 30 through surface mounting technology ("SMT") by pre-setting a solder ball 23 onto an end thereof. [0003] The insulative housing 10 of the electrical connector 1 has a mounting surface 12 on the bottom surface thereof which is positioned proximate to the circuit board 30 and a receiving surface 11 on the top surface thereof for supporting the electronic component. The insulative housing 10 also defines a plurality of through holes 13 extending between the mounting surface 12 and the receiving surface 11. [0004] Each of the conductive terminals 2 respectively received in the corresponding through holes 13 forms a contact portion 20 extending toward the receiving surface 11 and an end portion 21 opposite extending to the mounting surface 12. The end portion 21 has a bottom surface 22 for soldering with the corresponding solder ball 23. [0005] To improve successful rate of pre-setting the solder ball 23 onto the end portion 21 of the conductive terminals 2, the end portion 21 forms a disk-shape plane approximately 90 degrees bending to the contact portion 20 so that the end portion 21 and the mounting surface 12 of the insulative housing 10 are approximately located in the same plane. The plane disk-shape end portion 21 provides a larger area of pre-setting the solder ball 23 so as to steadily pre-set the solder ball 23. In addition, a plurality of protrusions 25 is integrity extending from the side of the end portion 21 for preventing the solder ball 23 dropping from the bottom surface 22 of the end portion 21. [0006] To applying the SMT of pre-setting the solder ball 23, one end of the conductive terminal 2 must have a structure of easily locating and connecting the solder ball 23. The above method is only one of the resolving schemes with which the end portion of the conductive terminal 2 has different structures to locate and connect the solder ball 23. The present invention provides an improved conductive terminal to locate and connect the solder ball 23. SUMMARY OF THE INVENTION [0007] An object of the present invention is to provide a conductive terminal that easily locates a solder ball and an electrical connector using the conductive terminals. [0008] Another object of the present invention is to provide a conductive terminal enhancing steadiness of soldering with a solder ball. [0009] The conductive terminals of the present invention are received in a plurality of terminal channels of an insulative housing of the electrical connector which can transmit signals between an electronic component and a circuit board. [0010] The conductive terminal has a first wall, a second wall connecting with the first wall in a certain angle and a third wall connecting with the second wall in a certain angle and opposite to the first wall. The conductive terminal forms a contact portion electrically connecting with the electronic component and a mounting portion electrically connecting with the circuit board via the solder ball. The mounting portion comprises a first horizontal portion extending and bending from one end of the first wall toward the third wall, and a second horizontal portion on the third wall and corresponding to the first horizontal portion toward the first wall. A gap is defined between an end of the second horizontal portion and an end of the first horizontal portion near the second horizontal portion so that the first horizontal portion and the second horizontal portion form a structure for locating the solder ball. [0011] The first horizontal portion defines a first recess at its end thereof and the second horizontal portion defines a second recess at its end thereof. The first recess and the second recess form a concavity structure which connects the surface of the solder ball. [0012] When the solder ball contacts with the mounting portion, the solder ball can be received and located in the concavity structure defined by the first recess and the second recess. Tin of the melting solder ball flow into the gap between the first horizontal portion and the second horizontal portion so as to enhance steadiness of soldering between the solder ball and the mounting portion. [0013] Other objects, features and advantages of the invention will be apparent from the following detailed description taken in connection with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS [0014] The features of this invention which are believed to be novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements in the figures and in which: [0015] FIG. 1 is a partial sectional view illustrating a conventional electrical connector; [0016] FIG. 2 is a side partial sectional view illustrating of FIG. 1; [0017] FIG. 3 is a perspective view of a conductive terminal of the conventional electrical connector of FIG. 1; [0018] FIG. 4 is a perspective view of a conductive terminal inserting into a terminal channel of an insulative housing of the first embodiment of the present invention from under the insulative housing; [0019] FIG. 5 is a perspective-assembled view of FIG. 4 illustrating a solder ball located in a mounting portion of the conductive terminal of the present invention; [0020] FIG. 6 is a perspective view of the conductive terminal inserting into the terminal channel of the insulative housing of the first embodiment from the above of the insulative housing; Continue reading... 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