|Coating apparatus patents - Monitor Patents|
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Coating apparatusBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 08/07/2014 > 18 patent applications in 14 patent subcategories.
20140216331 - Edible pellet producing apparatus: An edible pellet producing apparatus and an operation method are provided. The edible pellet producing apparatus includes a solidifying device, a processing chamber, a boiling tank and a cooling tank for producing an edible pellet.... Agent:
20140216332 - Vacuum treatment device: Provided is a vacuum treatment device, when a lifting pin inserted to a through hole is moved up, a substrate on a placement table is placed on a lid member which is connected to an upper end of a lifting pin and is separated from a placement surface of the... Agent: Ulvac, Inc.
20140216333 - Powder coating system having powder recovery cyclone with hinged lower section: A cyclone comprises a second or lower portion that is pivotable with respect to a first or upper portion about an articulation between a first position and a second position; the second portion being aligned with the first portion along a first or vertical axis when the second portion is... Agent: Nordson Corporation
20140216334 - Apparatus for preventing a cover from being drawn into an axis joint of a paint robot and related method: An arrangement for automated painting of an object includes a paint robot, a cover and a cover blocking member. The paint robot defines an axis joint about which a first portion rotates relative to a second portion. The cover covers at least a portion of the paint robot. The cover... Agent: Td Industrial Coverings, Inc.
20140216335 - Painting protector: A painting protector which can be easily held with one hand and placed snugly against an area in which paint is not to be applied, such an outlet or switch. The other hand can then be used to apply paint to the areas around the painting protector which are desired... Agent:
20140216336 - Metal and silicon containing capping layers for interconnects: Disclosed methods cap exposed surfaces of copper lines with a layer of metal or metal-containing compound combined with silicon. In some cases, the metal or metal-containing compound forms an atomic layer. In certain embodiments, the methods involve exposing the copper surface first to a metal containing precursor to form an... Agent: Novellus Systems, Inc.
20140216337 - Plasma activated conformal dielectric film deposition: Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction. In one aspect, the method is characterized by intermittent delivery of dopant species to the film between the cycles of adsorption... Agent: Novellus Systems, Inc.
20140216338 - Device for properly applying conductive glue on photoelectric element: A device to apply and confirm the proper dispensation of conductive glue includes a nozzle vacuum-lifting a photoelectric element having a bonding surface, a base defining a receiving recess, a conductive glue received in the recess, a driver, and a controller controlling the driver to drive the nozzle to dip... Agent:
20140216340 - Method and apparatus for producing insulated wire: Disclosed is a method of producing an insulated electric wire, in which a primary coating layer including at least an enamel-baking layer is formed on a metallic conductor to form a primary coated electric wire, and a secondary coating layer is extrusion-formed on the primary coating layer of the primary... Agent: Furukawa Electric Co., Ltd.
20140216339 - Raw material vaporizing and supplying apparatus: A raw material vaporizing and supplying apparatus including a source tank in which a raw material is stored, a raw material gas supply channel through which raw material gas is supplied from an internal space portion of the source tank to a process chamber, a pressure type flow rate control... Agent: Fujikin Incorporated
20140216341 - Chemical vapor deposition reactor: A CVD reactor, such as a MOCVD reactor conducting metalorganic chemical vapor deposition of epitaxial layers, is provided. The CVD or MOCVD reactor generally comprises a flow flange assembly, adjustable proportional flow injector assembly, a chamber assembly, and a multi-segment center rotation shaft. The reactor provides a novel geometry to... Agent: Valence Process Equipment, Inc.
20140216342 - Processing system for combined metal deposition and reflow anneal for forming interconnect structures: An interconnect conductive metal used in forming an interconnect structure can be formed using a method in which deposition of a metal liner and a reflow anneal are performed in a same multi-chambered processing system without exposing the structure to air between the steps of deposition and reflow annealing. In... Agent: International Business Machines Corporation
20140216343 - Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition: The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for plasma-enhanced chemical vapor deposition. The... Agent: Asahi Glass Co., Ltd.
20140216344 - Rf choke for gas delivery to an rf driven electrode in a plasma processing apparatus: In large area plasma processing systems, process gases may be introduced to the chamber via the showerhead assembly which may be driven as an RF electrode. The gas feed tube, which is grounded, is electrically isolated from the showerhead. The gas feed tube may provide not only process gases, but... Agent: Applied Materials, Inc.
20140216345 - Plasma processing apparatus: A plasma processing apparatus includes a processing chamber including a dielectric window; a coil-shaped RF antenna, provided outside the dielectric window; a substrate supporting unit provided in the processing chamber; a processing gas supply unit; an RF power supply unit for supplying an RF power to the RF antenna to... Agent: Tokyo Electron Limited
20140216346 - Plasma processing apparatus: A plasma processing apparatus includes a processing chamber including a dielectric window; a coil-shaped RF antenna, provided outside the dielectric window; a substrate supporting unit provided in the processing chamber; a processing gas supply unit; an RF power supply unit for supplying an RF power to the RF antenna to... Agent: Tokyo Electron Limited
20140216347 - Chemical vapor deposition reactor: A CVD reactor, such as a MOCVD reactor conducting metalorganic chemical vapor deposition of epitaxial layers, is provided. The CVD or MOCVD reactor generally comprises a flow flange assembly, adjustable proportional flow injector assembly, a chamber assembly, and a multi-segment center rotation shaft. The reactor provides a novel geometry to... Agent: Valence Process Equipment, Inc.
20140216348 - Apparatus for fabricating ingot: An apparatus for fabricating an ingot comprises an inner crucible for receiving a raw material; a seed holder placed on the raw material; and an outer crucible surrounding the inner crucible and comprising an open area in which a part of the raw material is exposed.... Agent: Lg Innotek Co., Ltd.07/31/2014 > 18 patent applications in 14 patent subcategories.
07/24/2014 > 10 patent applications in 9 patent subcategories.
20140202380 - Wiping device and hot dip coating apparatus using the same: A wiping device which blows a wiping gas toward a steel sheet from a pair of wiping nozzles disposed on both sides of the steel sheet so as to face sheet surfaces of the steel sheet, wherein the steel sheet is interposed between the pair of wiping nozzles and is... Agent: Nppon Steel & Sumikin Coated Sheet Corporation
20140202381 - Method and device for conveying particulate material during the layer-wise production of patterns: The present invention relates to apparatus, devices and methods for conveying particulate material during the manufacture of patterns in layers, wherein powder is conveyed out of a reservoir into a spreader unit and, if applicable, excess powder fed to the spreader unit is again conveyed back into the reservoir and... Agent:
20140202382 - Deposition apparatus: A deposition apparatus is provided to eliminate unnecessary empty spaces that may form between a substrate and a substrate supporting pin, which may be formed within a substrate supporting pin hole, by covering the substrate supporting pin, inserted into the substrate supporting pin hole formed in the substrate support, by... Agent: AsmIPHolding B.v.
20140202383 - Wafer processing system using multi-zone chuck: A wafer processing system includes at least one metrology chamber, a process chamber, and a controller. The at least one metrology chamber is configured to measure a thickness of a first layer on a back side of a wafer. The process chamber is configured to perform a treatment on a... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140202384 - Glue spreading system: A glue spreading system includes a spreading unit and a control unit. The spreading unit includes a primary pressing roller and a spreading roller. The spreading roller is adjacent to the primary pressing roller. A thin film transports between the primary pressing roller and the spreading roller. The spreading roller... Agent: Hon Hai Precision Industry Co., Ltd.
20140202385 - Flat-plate type pecvd device: The present application discloses a flat-plate type PECVD device including a vacuum chamber for accommodating a work piece and a plasma emitter provided above the vacuum chamber. The plasma emitter includes an emitting box fixed to the vacuum chamber, and a radio frequency impedance matching device provided above the emitting... Agent: Shenzhen Jt Automation Equipment Co., Ltd.
20140202386 - Substrate processing apparatus and susceptor: A substrate processing apparatus includes a chamber, a susceptor to receive a substrate and provided in the chamber, a gas supply source to supply a predetermined gas into the chamber, and a high frequency power source to treat the substrate by plasma. The susceptor includes a first ceramics base member... Agent: Tokyo Electron Limited
20140202388 - Shower head unit and chemical vapor deposition apparatus: A chemical vapor deposition apparatus comprises a chamber, a chamber lead having a gas in port configured to receive a reaction gas, the chamber lead connected to a top surface of the chamber to seal up the chamber, a shower head connected to the chamber lead, the shower head having... Agent: Eugene Technology Co., Ltd.
20140202387 - Vertical diffusion furnace: A diffusion furnace includes a boat which supports a semiconductor wafer thereon and is rotatable together with the semiconductor wafer. A heater is arranged on the periphery of a core tube which houses the boat therein. The core tube includes a reaction gas supply pipe through which a reaction gas... Agent: Kabushiki Kaisha Toshiba
20140202389 - Apparatus for fabricating ingot: Disclosed is an apparatus for fabricating an ingot. The apparatus includes a crucible receiving a raw material, and comprising an upper portion and a lower portion opposite to each other, and seed holders disposed at the upper and lower portions, respectively.... Agent: Lg Innotek Co., Ltd.07/17/2014 > 4 patent applications in 3 patent subcategories.
20140196661 - Overspray protection system: A spray system sprays an object within an enclosure. A plurality of gutters affixed to sidewalls of the enclosure catch excess spray for reuse. The gutters are affixed to sidewalls and hold a garment such that a shield is formed that protects the areas under a platen from overspray.... Agent:
20140196662 - Nanoclad pipe weld repair, systems and methods: An in situ apparatus, system, and method for cladding or repairing cladding in installed pipelines are presented. The apparatus can include a coating collar, a material reservoir, a cladding head, an adjustable cladding chamber, and a chamber controller. The coating collar can include an external surface, a first circumferential wall,... Agent: Fluor Technologies Corporation
20140196663 - Alignment device and substrate processing apparatus: An aligner includes a plurality of substrate rotators and a shaft member. Each substrate rotator includes a holder, a notch detector, an electromagnetic clutch and a driving belt. Each holder sucks the back surface of the substrate under vacuum and horizontally holds the substrate. Each notch detector detects a notch... Agent:
20140196664 - System and method for tungsten hexafluoride recovery and reuse: Condensable materials, such as but not limited to tungsten fluoride (WF6), can be used deposit films in a chemical vapor deposition (CVD) process. Described herein are methods to collect and reuse the condensable materials that are unreacted in the production process rather than treat these materials as waste. In one... Agent: Air Products And Chemicals, Inc.Previous industry: Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
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