|Coating apparatus patents - Monitor Patents|
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Coating apparatus November recently filed with US Patent Office 11/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 11/25/2010 > patent applications in patent subcategories. recently filed with US Patent Office
20100294199 - Cvd apparatus for improved film thickness non-uniformity and particle performance: Embodiments of the invention provide improved apparatus for depositing layers on substrates, such as by chemical vapor deposition (CVD). The inventive apparatus disclosed herein may advantageously facilitate one or more of depositing films having reduced film thickness non-uniformity within a given process chamber, improved particle performance (e.g., reduced particles on... Agent: MoserIPLaw Group / Applied Materials, Inc.
20100294200 - Vapor chamber and method for manufacturing the same: A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are... Agent: Altis Law Group, Inc. Attn: Steven Reiss11/18/2010 > patent applications in patent subcategories. recently filed with US Patent Office
20100288193 - Film transfer tool with application head moveable between exposed and stowed positions: A film transfer tool includes an application head which is adapted to be moved to a stowed position and a reel assembly having a wall and two stopping members extended therefrom. The reel assembly and a shell have an active member disposed therebetween. The active member has a looped passage... Agent: Kamrath & Associates P.A.
20100288194 - Compositions and methods for selective deposition modeling: There is provided compositions and methods for producing three-dimensional objects by selective deposition modeling with a polar build material and a non-polar support material. The build material comprises a hydrocarbon wax material and a viscosity modifier, and the support material comprises a hydrocarbon alcohol wax material and a viscosity modifier.... Agent: 3d Systems, Inc. Attn: Keith A. Roberson
20100288195 - Plasma processing method and apparatus: Plasma processing of plural substrates is performed in a plasma processing apparatus, which is provided with a plasma processing chamber having an antenna electrode and a lower electrode for placing and retaining the plural substrates in turn within the plasma processing chamber, a gas feeder for feeding processing gas into... Agent: Antonelli, Terry, Stout & Kraus, LLP
20100288197 - Anodized showerhead: Embodiments disclosed herein generally relate to an apparatus having an anodized gas distribution showerhead. In large area, parallel plate RF processing chambers, mastering the RF return path can be challenging. Arcing is a frequent problem encountered in RF processing chambers. To reduce arcing in RF processing chambers, straps may be... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100288196 - Apparatus for forming a flexible nanostructured material for photovoltaic panels: Provided is an apparatus for manufacturing a composite material consisting of a flexible substrate and a multilayer nanostructured PV-active film supported by the substrate. The apparatus comprises a sealable chamber, the cylindrical inner wall of which is used as a support for a flexible substrate. The chamber contains a rotating... Agent: Boris Gilman11/11/2010 > patent applications in patent subcategories. recently filed with US Patent Office
20100282161 - Gas wiping apparatus: In a gas wiping apparatus for blowing a gas on the front side and the back side of a strip, which exits from a hot-dip plating bath and travels upward, from wiping nozzles to adjust the amount of a plating deposit, the wiping nozzles are supported to be linearly movable... Agent: Birch Stewart Kolasch & Birch
20100282162 - Roll-to-roll patterning apparatus and patterning system having the same: Disclosed herein is a roll-to-roll patterning apparatus and a patterning system using the same. The patterning system may include a supply roll to supply a film member, a recovery roll to recover the film member, and a roll-to-roll patterning apparatus forming a coating on the film member. The roll-to-roll patterning... Agent: Harness, Dickey & Pierce, P.L.C
20100282163 - Thermocouple assembly with guarded thermocouple junction: An improved thermocouple assembly for providing a temperature measurement is provided. The thermocouple assembly includes a sheath having a measuring tip, a support member received within the sheath, and first and second wires disposed within the support member. An end of each of the first and second wires are fused... Agent: Snell & Wilmer L.L.P. (asm America)
20100282164 - Methods and systems for controlling temperature during microfeature workpiece processing, e.g., cvd deposition: The present disclosure provides methods and systems for controlling temperature. The method has particular utility in connection with controlling temperature in a deposition process, e.g., in depositing a heat-reflective material via CVD. One exemplary embodiment provides a method that involves monitoring a first temperature outside the deposition chamber and a... Agent: Perkins Coie LLP Patent-sea
20100282165 - Production of adjustment structures for a structured layer deposition on a microsystem technology wafer: The invention relates to a method for selective material deposition for sensitive structures in micro systems technology for producing mechanical adjustment structures (6, 5) for a vapour penetration mask (8), the adjustment structures on the component disc (7) and the mask being created using the same structuring method. Complementary adjustment... Agent: Hunton & Williams LLP Intellectual Property Department
20100282166 - Heat treatment apparatus and method of heat treatment: Provided is a heat treatment apparatus. The heat treatment apparatus comprises a process chamber configured to grow silicon carbide (SiC) epitaxial films on SiC substrates, a substrate holding tool configured to hold a plurality of substrates in a state where the substrates are vertically arranged and approximately horizontally oriented, so... Agent: Brundidge & Stanger, P.C.
20100282167 - Linear deposition source: A deposition source includes a crucible for containing deposition material and a body comprising a conductance channel. An input of the conductance channel is coupled to an output of the crucible. A heater heats the crucible so that the crucible evaporates the deposition material into the conductance channel. A heat... Agent: Rauschenbach Patent Law Group, LLP
20100282168 - Plasma processing apparatus, heating device for plasma processing apparatus, and plasma processing method: An anode electrode 7 has provided therein tubular heating sections 31, . . . 31 for heating an object (including a tray 5 and a substrate 6) to be plasma-processed. The tubular heating sections 31, . . . 31 include seven tubular heaters (here, a sheath heater) 31, . .... Agent: Nixon & Vanderhye, PC
20100282169 - Substrate-supporting device, and a substrate-processing device having the same: A substrate support apparatus includes an upper plate supporting a substrate, a lower plate disposed under the upper plate, an insulating member interposed between the upper plate and the lower plate, an electrode interposed between the upper plate and the insulating member to direct plasma onto the substrate supported by... Agent: Daly, Crowley, Mofford & Durkee, LLP
20100282170 - Vapor phase growth susceptor and vapor phase growth apparatus: The present invention provides a vapor phase growth susceptor as a susceptor that supports a wafer in a vapor phase growth apparatus for subjecting a thin film to vapor phase growth on a wafer surface, wherein a pocket configured to accommodate a wafer is formed in the susceptor, many rectangular... Agent: Oliff & Berridge, PLC11/04/2010 > patent applications in patent subcategories. recently filed with US Patent Office
20100275838 - Coating apparatus: A coating apparatus includes a chamber device and a transporting device. The chamber device defines two coating chambers, two parallel coating channels, and a transportation channel communicating with the coating channels. The coating chambers are separated from each other. The coating chambers and the coating channels are alternately arranged. Each... Agent: Altis Law Group, Inc. Attn: Steven Reiss
20100275839 - Lens holders for use in lens coating processes: Lens holders are disclosed that clasp the lens using rubberized paddles to reduce scratching and which include legs that are shaped to enable visual inspection of a lens without removal of the lens from the lens holder. One embodiment includes a lens holder body including a clip and a leg,... Agent: Kauth , Pomeroy , Peck & Bailey ,llp
20100275840 - Resin layer formation method, resin layer formation device, disk, and disk manufacturing method: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a... Agent: Joseph W. Price Snell & Wilmer L.l.p
20100275841 - Deposition source: A deposition source capable of uniformly producing a deposition film. The deposition source includes a furnace, a first heating unit surrounding the furnace to heat the furnace and a second heating unit spaced-apart from the first heating unit by an interval and surrounding the furnace to heat the furnace, wherein... Agent: Robert E. Bushnell & Law Firm
20100275843 - hvpe reactor arrangement: An HVPE reactor arrangement comprises a reaction chamber (1), a gas inlet (2) for introducing process gases to the reaction chamber, a residual gas outlet (3), and a pump (4) for evacuating the residual gases from the reaction chamber via the residual gas outlet, the pump being capable of creating... Agent: Fay Sharpe LLP
20100275844 - Deposition apparatus: In a deposition apparatus according to an embodiment of the present invention, a buffer unit is provided between a vaporizer and a reactor of a vaporization supply system to temporarily store source gas, thus, before and when the source gas is supplied to the reactor, the variations of the internal... Agent: LexyoumeIPGroup, LLC
20100275842 - Evaporating apparatus: Provided is an evaporating apparatus that deposits a deposition material onto a treatment object. The evaporating apparatus includes a base, a deposition source, and first and second correction units. The deposition source deposits the deposition material onto the treatment object. The base is disposed separately from the treatment object. The... Agent: Robert E. Bushnell & Law Firm
20100275845 - Ultraviolet-resistant materials and devices and systems including same: UV-resistant materials are disclosed that include at least one self-supporting film of UV-resistant clay particles and that are substantially non-reactive to incident UV radiation. An exemplary material is substantially non-transmissive to at least one UV wavelength of less than 300 nm, can include a polymeric material for enhanced flexibility, and... Agent: Klarquist Sparkman, LLP
20100275847 - Dlc film coated plastic container, and device and method for manufacturing the plastic container: The apparatus for manufacturing the DLC film coated plastic container, comprising: a container side electrode which forms one portion of a pressure-reducing chamber which houses a container formed from plastic, a facing electrode which faces said container side electrode and is arranged inside said container or above said opening, wherein... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100275846 - Plasma processing method, plasma processing apparatus, and computer recording medium: According to the present invention, plasma oxidation processing and plasma nitridation processing are applied at the same time to the surface of a semiconductor substrate by plasma using a microwave. After forming an insulating film by the plasma oxynitridation processing as described above, the plasma nitridation processing is further applied... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100275848 - Heat treatment apparatus: Provided is a heat treatment apparatus that can form films having a uniform thickness on a plurality of substrates. The heat treatment apparatus comprises a process chamber configured to grow silicon carbide (SiC) films on wafers, a boat configured to hold a plurality of wafers in a state where the... Agent: Brundidge & Stanger, P.C.Previous industry: Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
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