Coating apparatus inventions 08/07

20070199506 - Method and apparatus for automated coating of electrical insulators with a silicone composition: The present invention provides an automated continuous coating apparatus for coating industrial components such as porcelain, glass, and polymeric insulators. The apparatus consists of a several stage continuous inline operation. The stages are a cleaning operation, followed by drying and heating, coating, and curing.... Agent: Dennison Associates Suite 301

20070199507 - Apparatus to improve wafer temperature uniformity for face-up wet processing: A method and apparatus for controlling a substrate temperature during an electroless deposition process. The apparatus includes a deposition cell configured to support a substrate at a position above a fluid distribution member. A heated fluid is dispensed from the fluid distribution member and contacts the backside of the substrate,... Agent: Patent Counsel Applied Materials, Inc.

20070199508 - Substrate holder and substrate treatment apparatus: A substrate holder whose component members are not being corroded even if employing a high concentration of hydrofluoric acid, phosphoric acid, or sulfuric acid as a treatment solution when plural pieces of substrates are held with a substrate holder and immerses in the treatment solution in a treatment reservoir for... Agent: Ostrolenk Faber Gerb & Soffen

20070199509 - Apparatus for the efficient coating of substrates: A process for the coating of substrates comprising insertion of a substrate into a process oven, dehydration of the substrate, withdrawal of a metered amount of one or more chemicals from one or more chemical reservoirs, vaporizing the withdrawn chemicals in one or more vapor chambers, and transfer of the... Agent: Michael A. Guth

20070199510 - Systems and methods for sealing in site-isolated reactors: Substrate processing systems and methods are described for site-isolated processing of substrates. The processing systems include numerous site-isolated reactors (SIRs). The processing systems include a reactor block having a cell array that includes numerous SIRs. A sleeve is coupled to an interior of each of the SIRs. The sleeve includes... Agent: Courtney Staniford & Gregory LLP

20070193508 - Liquid coating apparatus and maintenance method: A liquid coating apparatus, including; a head which has plural nozzles which eject liquid in which plural particles are dispersed, plural pressuring chambers each communicates to each nozzle, a piezo element which is provided on the pressuring chamber to change a volume of the pressuring chamber, and a common liquid... Agent: Cantor Colburn, LLP

20070193509 - Multi-station rotation system for use in spray operations: A system and method for use in applying a coating of a desired material onto one or more medical implant components. The system may include a thermal sprayer and a rotatable holding fixture having a plurality of mounting stations each operable to hold at least one medical implant component. The... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20070193510 - Electroless plating apparatus and plating solution: An electroless plating apparatus can suppress a change in quality of a plating solution and form a plated film without loss of its properties and reliability. The electroless plating apparatus includes a plating solution circulation system having a plating solution supply pipe for supplying a plating solution in a plating... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070193511 - Hot-melt adhesive temperature control method, applicator therefor, and bookbinding apparatus: Bookbinding apparatus adhesive applicator accurately, briefly controls adhesive temperature to a set value by selecting, in accordance with adhesive initial temperature, one of a plurality of temperature-controller heating modes defining different supply powers and supply durations for supplying power to an adhesive-container heater to control its heating temperature. A sensor... Agent: Judge & MurakamiIPAssociates

20070193514 - Method and apparatus for measuring electron density of plasma and plasma processing apparatus: An apparatus for measuring plasma electron density precisely measures electron density in plasma even under a low electron density condition or high pressure condition. This plasma electron density measuring apparatus includes a vector network analyzer in a measuring unit, which measures a complex reflection coefficient and determines a frequency characteristic... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070193512 - Plasma generating method, plasma generating apparatus, and plasma processing apparatus: One or more high-frequency antennas is allocated to and disposed in one cubic space C having a side of 0.4 [m] in a plasma generating chamber 1 or in each of plural cubic spaces C, each having a side of 0.4 [m], adjacent ones of the plural cubic spaces being... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20070193513 - Plasma generating method, plasma generating apparatus, and plasma processing apparatus: A plasma generating method and apparatus which use plural high-frequency antennas 2 to generate inductively coupled plasma, and a plasma processing apparatus using the apparatus. The antennas 2 are identical to one another. Application of a high-frequency electric power to the antennas 2 is performed from a high-frequency power source... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20070193518 - Plasma generator: A plasma generator for forming a thin film comprises a cathode (4) for supplying constituent particles of an arc plasma and a trigger-and-anode (6) for starting and sustaining the arc plasma. The cathode surface (4a) of the cathode (4) is flat or finely irregular, and the anode surface (6c) of... Agent: Koda & Androlia

20070193515 - Apparatus for generating remote plasma: Provided is an apparatus for generating remote plasma. The apparatus includes an RF antenna disposed in regard to a chamber, a plasma generating unit formed in an uppermost portion of the chamber, wherein a plurality of plasma generation gas introduction pipes are communicated with the plasma generating unit, a first... Agent: Hedman & Costigan P.C.

20070193516 - Plasma generation apparatus and work processing apparatus: A plasma generation apparatus is provided which includes: an apparatus main body which has a microwave generation section which generates a microwave and a plasma generation nozzle which generates and emits a plasma gas based on the energy of the microwave; a microwave detection unit which detects a microwave leaking... Agent: Jordan And Hamburg LLP

20070193517 - Plasma generation apparatus and work processing apparatus: A plasma generation apparatus is provided which includes: a microwave generation portion which generates a microwave; a gas supply portion which supplies a gas to be turned into plasma; a plasma generation nozzle which includes a reception member receiving the microwave, and turns the gas into plasma based on the... Agent: Jordan And Hamburg LLP

20070193519 - Large area deposition in high vacuum with high thickness uniformity: The invention relates to an effusing source for film deposition made of a reservoir comprising one hole characterized by the fact that the hole diameter is less than one order of magnitude than the mean free path of the molecules determined by the pressure and its thickness is at least... Agent: Nixon & Vanderhye, PC

20070193520 - Lift pin calibrator and method of setting position of lift pin using the same: A lift pin calibrator and a method of using the same set the height and orientation of a lift pin relative to a substrate support plate having a bore in which the lift pin is raised and lowered. The lift pin calibrator has a contact body, a pressure member and... Agent: Volentine & Whitt PLLC

20070186847 - Food breader: A breading machine for dispensing a coating material onto a food product includes a breading chamber, a continuous conveyor for transporting food products through the breading chamber, a hopper including at least one downspout and a sloped bottom for dispensing coating material onto the food products, a hopper conveyor positioned... Agent: Pauley Petersen & Erickson

20070186848 - Coating system and coating method: The invention relates to a coating system, especially a low pressure plasma coating system, with at least one treatment chamber and a coating tool, especially a plasma spraying device, wherein at least one pump is provided for evacuation of the treatment chamber, which treatment chamber is formed to be temperature... Agent: Siemens Corporation Intellectual Property Department

20070186849 - Coating system and coating method: An enhanced utilization efficiency of gases can be presented and an improved deposition characteristics are presented, when a film is deposited with a plurality of gases. A deposition apparatus 100 includes: a reaction chamber 102 for depositing a film; a first gas supply line 112 and a second gas supply... Agent: Young & Thompson

20070186852 - Manufacturing apparatus: The purpose of the invention is increasing the efficiency of utilizing an EL material and providing a deposition method and a vapor deposition apparatus which is one of the film formation systems which are excellent in throughput and uniformity in film thickness in forming an EL layer. According to the... Agent: Nixon Peabody, LLP

20070186850 - Substrate processing apparatus and substrate processing method: The object is to reduce the total processing time by transferring the substrate at the first delivery stage to the process block where processing can be carried out earliest. The substrate processing apparatus includes first transfer means (22) for delivering a wafer (W) with respect to a substrate carrier (C),... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070186851 - Vacuum chamber system for semiconductor processing: A vacuum chamber system for semiconductor processing includes at least two evacuable vacuum chambers (1a, 1b) which are provided for receiving semiconductor elements (5) to be processed and which in each case comprise a vacuum chamber opening (2a; 2b) and a vacuum chamber sealing surface (3a; 3b), and transfer aspects... Agent: Rothwell, Figg, Ernst & Manbeck, P.C.

20070186853 - System and method for varying wafer surface temperature via wafer-carrier temperature offset: A system and method for evenly heating a substrate placed in a wafer carrier used in wafer treatment systems such as chemical vapor deposition reactors, wherein a first pattern of wafer compartments is provided on the top of the wafer carrier, such as one or more rings of wafer carriers,... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20070186857 - Plasma processing apparatus and method of using the same: Example embodiments relate to an apparatus and method for manufacturing a semiconductor device. Other example embodiments relate to a plasma processing apparatus having an in-situ cleaning function and a method of using the same. The plasma processing apparatus may include an outer chamber, an inner chamber installed in the outer... Agent: Harness, Dickey & Pierce, P.L.C

20070186854 - Apparatus and method for plasma processing: Plasma processing apparatus is provided having a chamber (1), first (3) and second (8) electrodes, and power supply (10) to generate the plasma. The first electrode (3) is formed from a nickel alloy having substantially planar upper (16) and lower (17) surfaces. A heater (4) heats at least the first... Agent: Maine & Asmus

20070186856 - Plasma processing apparatus having high frequency power source with sag compensation function and plasma processing method: The plasma processing apparatus wherein the means for applying a high frequency voltage, which becomes a voltage waveform in which a positive constant voltage and a negative constant voltage alternate with each other at given cycles, is constituted by a DC power source and a switching circuit (a chopper circuit).... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070186855 - Plasma processing reactor with multiple capacitive and inductive power sources: Broadly speaking, the embodiments of the present invention provide an improved chamber cleaning mechanism, apparatus and method. The present invention can also be used to provide additional knobs to tune the etch processes. In one embodiment, a plasma processing chamber configured to generate a plasma includes a bottom electrode assembly... Agent: Martine Penilla & Gencarella, LLP

20070186858 - Susceptor: A susceptor used in semiconductor epitaxial growth that can simultaneously obtain a plurality of epitaxial films high in uniformity. The susceptor includes a barrel type susceptor having a plurality of surfaces on an outer side of each of which a plurality of substrates can be freely disposed, and a member... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070181059 - Apparatus and method for patterning pixels of an electro-luminescent display device: A patterning apparatus for an electroluminescent display includes a molding plate provided with a plurality of convex portions and concave portions; a polymer supplying roller adjacent to the molding plate to apply an electroluminescent material to the molding plate via rotational movement; and a molding roller attached to the molding... Agent: Birch Stewart Kolasch & Birch

20070181060 - Direct write™ system: Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of... Agent: Peacock Myers, P.C.

20070181061 - Dispensing apparatus: Dispensing apparatus is provided for use in dispensing a fluid lining material onto the interior wall surfaces of a conduit. The dispensing apparatus includes at least one reservoir for the containment of at least one fluid, dispensing outlet means communicating with said at least one reservoir for dispensing fluid therefrom... Agent: Winstead Sechrest & Minick P.C.

20070181062 - Semiconductor device manufacturing apparatus including temperature measuring unit: A semiconductor device manufacturing apparatus comprises a chamber for processing a wafer, a wafer loading unit configured to load a wafer into and out of the chamber, a heating unit coupled with a chamber wall and a temperature measuring unit located between the chamber wall and the wafer loading unit... Agent: Frank Chau, Esq. F. Chau & Associates, LLC

20070181063 - Method for plasma ignition: A method for igniting a plasma in a semiconductor process chamber is provided herein. In one embodiment, a method for igniting a plasma in a semiconductor substrate process chamber having an electrically isolated anode, wherein the plasma has failed to ignite upon applying a plasma ignition voltage to a cathode... Agent: MoserIPLaw Group / Applied Materials, Inc.

20070181064 - Plasma source assembly and method of manufacture: A plasma source assembly including an outer shield, a dielectric chamber wall, and a helical coil provided between the outer shield and the dielectric chamber wall. The plasma source assembly also includes a coil support assembly configured to facilitate repeatable performance of the helical coil. Preferably, the assembly includes a... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070181066 - Baffled liner cover: A baffled liner cover supported at the top of a liner surrounding a wafer support tower for semiconductor thermal processing. The cover may present a continuous horizontal surface for preventing particles from falling within the liner but present horizontal extending gas passageways in a baffle assembly to allow the flow... Agent: Law Offices Of Charles Guenzer

20070181065 - Etch resistant heater and assembly thereof: An etch resistant heater for use in a wafer processing assembly with an excellent ramp rate of at least 20° C. per minute. The heater is coated with a protective overcoating layer allowing the heater to have a radiation efficiency above 70% at elevated heater temperatures of >1500° C., and... Agent: Momentive Performance Materials Inc.-quartz C/o Dilworth & Barrese, LLP

20070175386 - Book-binding apparatus and image forming system: A book-binding apparatus having: a reception vessel to receive glue in liquid form: application section to apply the glue in the reception vessel to a sheet; a hopper to receive a raw material of the glue for refill; refilling section to refill the raw material of the glue from the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20070175387 - Substrate processing apparatus and substrate processing method: A substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities... Agent: Ostrolenk Faber Gerb & Soffen

20070175388 - Art creation device: An art creation device which utilizes a heated surface to melt crayons on a sheet of paper. The paper is held in place by paper clamps, and the device includes a temperature control thermostat, a heated surface, and a heat insulated border and base.... Agent: Robert L. Shaver Dykas, Shaver & Nipper, LLP

20070175389 - Self-adjusting masking plug for complex parts: A self-adjusting masking plug is provided which is adapted to be received in a region of a complex part intended to be masked. The plug has a body adapted to be received within a region of the part intended to be masked. The body includes a first body half having... Agent: Stetina Brunda Garred & Brucker

20070175390 - Door painting bracket: A door bracket for holding stable and upright two or more doors for painting. The door bracket is formed of interconnecting arms which provide an end which is inserted in the door lock passage of the doors. A bracket of two arms can hold 2 to 3 doors upright, and... Agent: Dykas, Shaver & Nipper, LLP

20070175391 - Gas supply system, substrate processing apparatus and gas supply method: A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second processing gas branch line; a branch flow control unit; an additional gas supply unit; an... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070175393 - Substrate processing apparatus, substrate processing method, and storage medium storing program for implementing the method: A substrate processing apparatus that enables an oxide layer and an organic layer to be removed efficiently. A substrate formed at its surface with an organic layer covered with the oxide layer is housed in a chemical reaction processing apparatus of the substrate processing apparatus, in which the oxide layer... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070175392 - Multiple precursor dispensing apparatus: An apparatus for dispensing multiple precursors to a manufacturing tool includes a fluidic manifold having a plurality of interconnected sub-manifolds, a plurality of tanks, each tank containing a different precursor, and wherein each of the sub-manifolds is connected to one of the tanks. A system for dispensing multiple precursors to... Agent: Air Liquide Intellectual Property

20070175395 - Semiconductor device manufacturing equipment including a vacuum apparatus and a method of operating the same: A vacuum apparatus includes a first isolation chamber, a second isolation chamber, a vacuum source configured to extract air from the first and second isolation chambers, and an isolation valve unit, wherein the isolation valve unit is configured to close a flow path between the vacuum source and the first... Agent: Lee & Morse, P.C.

20070175394 - Film forming apparatus: A film forming apparatus is provided that can prevent source gases from reacting together before reaching the substrate being processed in the apparatus, minimize the influence of the radiation heat from the substrate, and make the gas behavior in the reaction chamber better for crystal film formation. The apparatus forms... Agent: Wood, Phillips, Katz, Clark & Mortimer

20070175396 - Film-forming apparatus: A film-forming apparatus of the invention is a film-forming apparatus that includes: a processing container that defines a chamber, a pedestal arranged in the chamber, on which a substrate to be processed can be placed, a showerhead provided opposite to the pedestal, which has a large number of gas-discharging holes,... Agent: Smith, Gambrell & Russell

20070175397 - Method for packing solid organometallic compound and packed container: A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the... Agent: Wenderoth, Lind & Ponack, L.L.P.