Cleaning and liquid contact with solids inventions 06/06

20060137709 - Film formation apparatus and method of using the same: A method of using a film formation apparatus for a semiconductor process includes processing by a cleaning gas a by-product film deposited on an inner surface of a reaction chamber of the film formation apparatus. This step is arranged to supply the cleaning gas into the reaction chamber, and set...

20060137708 - Photocatalytic auto-cleaning process of stains: The present invention provides a process for photocatalytically treating stains of chilly and turmeric caused on kitchen tiles and platforms by coating a thin film of photocatalyst made of a semiconductor such as titanium dioxide uniformly dispersed in dilute silica sol thereon and using a light source such as a...

20060137710 - Method for controlling corrosion of a substrate: A method for controlling corrosion of a substrate is provided herein. In one embodiment, a method for controlling corrosion of a substrate includes the steps of providing a substrate having a patterned photoresist layer with a metallic residue disposed thereon; exposing the substrate to a hydrogen-based plasma to remove the...

20060137711 - Single-wafer cleaning procedure: A single-wafer dry cleaning procedure. First, an etched wafer having a photo resist pattern thereon is provided. Then, an ashing process is performed to remove the photo resist pattern. Finally, the etched wafer is hoisted and maintained in a suspended condition, a dry cleaning process then being performed upon the...

20060137713 - Apparatus for cleaning wafer and method of pre-cleaning wafer for gate oxide formation: An apparatus and a method for cleaning a wafer are described. A wafer is inserted into a bath by a loader, is supported by a guide in the bath, and is rotated by a roller. A cleaning solution such as dilute HF may remove impurities from the wafer by an...

20060137714 - Apparatus for removing edge bead in plating process for fabricating semiconductor device: An apparatus for removing an edge bead in, e.g., a plating process for fabricating a semiconductor device is provided, by which a wafer surface may be prevented from being oxidized by a chemical used in an edge bead removal (EBR) process. The apparatus may includes a spin chuck; a wafer...

20060137712 - Cleaning apparatus and method for electronic device: A method for cleaning electronic devices including the step of cleaning a target substrate placed in a cleaning chamber by etching using a cleaning solution which is circulated for reuse in a cleaning solution circulation path including at least the cleaning chamber and a cleaning solution circulation line, the method...

20060137715 - Cleaning method for removing copper-based foreign particles: A cleaning method for removing copper-based foreign particles from a wafer. The method includes changing the zeta-potential of the copper-based foreign particles to negative and removing the copper-based foreign particles having negative zeta-potential by spin-scrubbing. Consequently, the quality of the semiconductor device and the yield thereof can be increased....

20060137716 - Water treatment device for an article washer: A water treatment device for an article washer is configured to selectively treat a water supply for an article washer. In one example, the water treatment device can selectively pretreat a water supply for an article washer for subsequent introduction of the treated water into the wash area of a...

20060137717 - Method for removing impurities grown on a phase shift mask: A method for removing impurities grown on a phase shift mask. The method can advantageously control growth of impurities by further performing HF cleaning and baking after cleaning to minimize the amount of residual chemical ions generated during cleaning. Specifically, the method comprises forming a phase shift mask pattern including...

20060137718 - Method for removing impurities from porous materials: The present invention discloses a method for removing impurities from a porous material by flowing a supercritical fluid with or without a modifier therein over a to-be-cleaned porous material having pores at the nanometer level under suitable temperatures and pressures, so that the supercritical fluid migrates into the pores at...

20060137719 - Substrate processing apparatus and method: Pure water dissolving nitrogen gas and containing microbubbles is supplied to a substrate. Since microbubbles are very minute in size and also have the electrostatic property, they can efficiently adsorb particles on the substrate surface or in the pure water. Further, since pure water dissolving nitrogen gas is unlikely to...

20060137721 - Liquid processing apparatus and liquid processing method: A liquid processing apparatus comprises a liquid processing section for applying a liquid processing to wafers W, a carrier delivery section for delivering the carrier housing the wafers W, a carrier stock section capable of storing a plurality of carriers, an interface section for transferring the wafers W between the...

20060137720 - Method for the removal of organic residues from finely structured surfaces: Method for removing of organic residues from finely structured surfaces, in which the residues are incinerated by ozone....

20060137722 - Method and apparatus for cleaning a coating machine: An apparatus serves for cleaning a coating machine for coating confectionery products with a coating mass. The apparatus is designed to be arranged in the coating machine which includes a rotatingly driven grating belt. The grating belt is designed and arranged to support confectionery products to be coated. The grating...

20060137723 - Workpiece processing using ozone gas and solvents: In systems and methods for cleaning a wafer having metal areas, a non-aqueous polar solvent solution is applied onto the wafer, while the wafer is also contacted by ozone gas. The solvent helps to make the chemical bonds of contaminants on the wafer susceptible to oxidation by the ozone. The...

20060137724 - Method for removing engine deposits from turbie components and composition for use in same: A method and cleaning composition for removing engine deposits from turbine components, in particular turbine disks and turbine shafts. This method comprises the following steps: (a) providing a turbine component having a surface with engine deposits thereon, wherein the turbine component comprises a nickel and/or cobalt-containing base metal; and (b)...

20060137725 - Tilting dish rack assembly: A dish rack assembly has a dish rack, and a base having a bottom wall on which the dish rack is positioned. The base includes a first edge having a first water outlet provided adjacent the first edge, and a second edge having a second water outlet provided adjacent the...

20060137726 - Substrate treating apparatus: A substrate treating apparatus includes a storage block for accommodating foups each storing a plurality of substrates, a first treating block for treating a plurality of substrates en bloc, a second treating block for treating one substrate at a time, and a transport device for transporting the substrates between the...

20060137727 - Ultrasonic washing apparatus and ultrasonic washing method: This is an ultrasonic washing technique to enhance, when an object to be washed is subjected to ultrasonic washing, the efficiency of charging and discharging the object to be washed in and out of a washing tank while preventing the apparatus from getting larger in the vertical direction. An inlet...

20060130872 - Apparatus and method for performing predetermined processing on substrate with ultrasonic waves: A blocking plate 3 is disposed opposing a substrate W which is held by plural chuck pins 17 and a processing liquid is supplied from a processing liquid nozzle 5 to a space SP between the front surface Wf of the substrate and an opposed surface 3a of the blocking...

20060130871 - Megasonic cleaner having double cleaning probe and cleaning method: A megasonic cleaner includes a rotatable wafer supporting member for supporting a wafer; a cleaning solution supply member for supplying a cleaning solution to a wafer placed on the wafer supporting member; at least two vibration transfer members for agitating cleaning solutions supplied to different areas of the wafer placed...

20060130870 - Method for sonic cleaning of reactor with reduced acoustic wave cancellation: In some embodiments, a method for sonically cleaning a reactor (for example, a fluidized bed reactor useful for the production of polyolefins) using a set of sonic sources, including by varying the operating mode of the set of sources to reduce or prevent cleaning problems that would otherwise result from...

20060130873 - Plasma cleaning of deposition chamber residues using duo-step wafer-less auto clean method: A method involving plasma cleaning of deposit residues in process chamber using duo-step wafer-less auto clean method is detailed. Specifically, the method involves cleaning the processing chamber by flowing a first gaseous composition with at least about 75% of fluorine-containing compound of the formula XyFz, into a processing chamber and...

20060130874 - Oblique burnish/wipe mechanism for hard drive disk like media: An oblique burnish mechanism that provides both translation and rotation degrees of freedom to effectively remove the particles on an article is disclosed. The oblique angle of the mechanism can be adjusted so that the kinematical condition can be selected relative to the motion of the area of the article,...

20060130875 - Method and apparatus for clamping a substrate in a high pressure processing system: An isolated semiconductor wafer platen is disclosed for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is well known in the art and can be applied to high pressure systems as well, but some difficulties can arise under high pressure processes....

20060130877 - Automatic snow removal wiper system: A wiping system for use on a vehicle window comprises a window wiper assembly positioned proximate the window, a first sensor for detecting the presence of moisture on the window and a second sensor for detecting if the vehicle has been remotely started. A controller is coupled to the wiper...

20060130878 - Dish washer and control method thereof: A dish washer includes a sump communicated with a tub to accommodate water, a water supply pump for pumping the water in the sump, a filtering device for receiving a part of the water pumped through an auxiliary passageway to filter the pumped water and to supply the filtered water...

20060130876 - Method for detecting the quantity of dishes in the washing container of a dishwasher and dishwasher for carrying out said method: A dishwasher and a method for detecting the quantity of dishes in the washing container of the dishwasher are provided. The method includes detecting data relating to the motor operation of a circulating pump and detecting data relating to the heat increase in the dishwasher during a pre-washing phase and...

20060130879 - Solids separation system: A solids removal system for use in removing sand and silt from well production fluids. The system has a manifold assembly provided with jetting nozzles, which is installed in a liquid- and solids-containing vessel, where solids have settled in the walls. The jetting nozzles deliver, in a pre-determined sequence, a...

20060130880 - Substrate treating apparatus and method: A mixer produces a treating solution by mixing chloride into hot deionized water heated by a hot water unit. The treating solution produced is supplied to a treating tank through a treating solution pipe and a common pipe. In the treating tank, substrates held by a lifter are immersed in...

20060130881 - Method of cleaning optical tools for making contact lens molds using super-cooled fluids: The present invention includes a process for cleaning an optical tool for manufacturing contact lens molds comprising contacting the optical tool with a super-cooled fluid under conditions effective to clean the optical tool....

20060130882 - Dishwasher: A dishwasher provided with a parallelepiped housing with an opening in a forward wall and a sealing gasket mounted on the lower surface of its top wall and a drawer-like washing compartment having upper margins and moveable relative to the housing along rails mounted at an inclination on the side...

20060130883 - Closed-loop containment ash washer assembly and method: A closed-loop containment washer assembly for use with a pressure washer apparatus for washing an object containing a medium weight contaminant. The washer assembly includes a clean wash fluid basin, and a first collection basin configured and oriented to collect the run-off of a washing fluid after being flowed over...

20060130884 - Pressure washer: A pressure washer for delivering liquid under high pressure is connected to a liquid supply, and includes a motor unit, a storage tank unit, a hydraulic pump unit, a check valve unit, and a spray nozzle. When the motor unit is started and the spray nozzle is opened, liquid is...

20060130885 - Installation for cleaning different objects: An installation used to clean objects includes: a closed loop washing circuit (5A, 5B, 5C, 5D), a rinsing circuit (7A, 5B, 5C, 5D), a single pump (8) and at least one routine operating mode. The installation also has elements for automatically controlling the operation of the pump. The automatic control...

20060130886 - Method and apparatus for manufacturing cleaning material and cleaning system using the same: A cleaning material for cleaning, for instance, a substrate by being sprayed onto and colliding with the substrate being in a sherbet-form (in which a solid and liquid are co-present) that contains ice particles and being manufactured by cooling a mixed liquid, which comprises pure water and an organic compound...

20060124151 - Method for cleaning substrate processing chamber: A cleaning method of a substrate processor that reduces damage to a member in a substrate processing container. The method of cleaning the substrate processing container of the substrate processor that processes a target substrate according to the present invention includes: introducing gas into a remote plasma generating unit of...

20060124152 - Method and apparatus for washing solid substrate with ultrasonic wave after hybridization reaction: A method and apparatus for washing solid substrate with ultrasonic wave after hybridization reaction are provided. The method includes (1) putting the solid substrate into a container having a washing solution, on which the hybridization reaction has been completed, (2) using an ultrasonic generator to produce a certain strength of...

20060124153 - Enhanced wafer cleaning method: A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface...

20060124154 - System and method for washing a vehicle: A washing system configured for use in the interior storage area of a vehicle includes one or more guide rails disposed on an interior portion of the storage area of the vehicle. A washing unit is disposed in the storage area of the vehicle and is operatively connected to the...

20060124155 - Technique for reducing backside particles: A technique for reducing backside particles is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for reducing backside particles. The apparatus may comprise a delivery mechanism configured to supply a cleaning substance to a platen, wherein the platen is housed in a process chamber....

20060124156 - Carbon dioxide snow apparatus: A carbon dioxide snow apparatus of the present invention includes a carbon dioxide snow generation system and a propellant generation system connected to a common carbon dioxide gas source. The carbon dioxide snow generation system includes a condenser having a at least two connected segments, wherein a first segment has...

20060112969 - Wet cleaning of electrostatic chucks: A non-destructive and simple method for cleaning a new or used electrostatic chuck comprises a wet cleaning process, which removes contaminants deposited on a surface of the electrostatic chuck....

20060112970 - Electrostatic chuck cleaning method: An electrostatic chuck cleaning process that cleans an electrostatic chuck, equipped in a chamber, for chucking and holding a substrate. This method has a plasma etching process that performs plasma etching on the electrostatic chuck, a substrate mounting process that mounts a substrate on the electrostatic chuck that was subjected...

20060112971 - Method of eliminating galvanic corrosion in copper cmp: A method for cleaning a semiconductor wafer surface comprises sweeping the semiconductor wafer surface and applying a first cleaning solution having a first pH, stop applying the first cleaning solution and applying a first rinsing solution to the semiconductor wafer surface, the first rinsing solution having a second pH that...

20060112973 - Method and apparatus for substrate processing: A substrate processing apparatus admits nitrogen gas into a casing, while immersing a substrate in deionized water stored in a processing tank. Oxygen and water vapor within the casing are replaced with nitrogen gas and then removed. Subsequently, the substrate processing apparatus supplies IPA vapor toward substrates, while lifting the...

20060112972 - Methods and compositions for removing metal oxides: The invention relates to methods and compositions for removing metal oxide soils from surfaces. The compositions include an anionic surfactant and a pH adjuster at an acidic pH. In one embodiment, the invention relates to a method of removing a metal oxide soil from a surface by (1) applying a...

20060112974 - Methods for cleaning a substrate: The invention provides a water supplying apparatus and method thereof which has a high capacity of peeling and removing a disused material such as a resist film and the like, and can efficiently use water vapor. A water supplying apparatus for executing a washing process, a cleaning process and a...

20060112975 - Automatic cleaning mechanism for a paint sprayer: A cleaning device which washes each of the components of a paint sprayer from the correct angle to ensure that all residue is properly removed. The invention provides a mechanism for aligning cleaning nozzles with the components of the paint sprayer. Holding devices precisely position components of the paint sprayer...

20060112976 - Method for removing at least one partial area of a component made of metal or a metallic compound: The invention relates to a method for removing at least one layer area of a component made of metal or a metal compound. When components are used in high temperature areas, they acquire degraded areas which are removed by means of an acid attack. Removal during said acid treatment is...

20060112977 - Alternative technology for reducing fungi contamination on common building materials and facilities occupied by humans: A formulation containing specific GRAS-approved enzymes and ingredients is provided for preventing and inhibiting fungi and their proteins from forming on surface areas of common building materials, and for extending the time period for safer, healthier dwellings, office space, public schools, modular buildings, maritime and aviation equipment, and such, by...

20060112978 - Apparatus and method for wet-treating wafers: An apparatus is provided for wet-treating wafers. This apparatus can comprise at least one wet treatment bath for wet treating a plurality of wafers. Further, it can include a wafer transfer device for moving the plurality of wet-treated wafers to the wet treatment bath and a wafer sensor for sensing...

20060112979 - Nozzle apparatus for stripping edge bead of wafer: There is provided a nozzle apparatus for stripping an edge bead from a wafer, which includes a rotatable support arm, and a side rinse nozzle coupled to a leading end of the support arm to remove the bead of photoresist remaining on the edge of a wafer. The side rinse...

20060112980 - Apparatus and method for treating surfaces of semiconductor wafers using ozone: An apparatus and method for treating surfaces of semiconductor wafers with a reactive gas, such as ozone, utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of processing fluid formed on a semiconductor wafer surface to increase the...