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Chonghua Zhong patents

Recent patents with Chonghua Zhong listed as an inventor - additional entries may be under other spellings.


Chonghua Zhong - Related organizations: Apple Inc. patents

Dual-sided silicon integrated passive devices

01/19/17 - 20170018546 - In some embodiments, a system may include an integrated circuit. The integrated circuit may include a substrate including a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface. The first set of electrical conductors may function
Inventors: Jun Zhai, Vidhya Ramachandran, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong

Package-on-package options with multiple layer 3-d stacking

10/13/16 - 20160300823 - In some embodiments, a semiconductor device package on package assembly may include a first package, a second package, and a third package. The first package may include a first surface, a second surface, a first die, and a first set of electrical conductors. The first set of electrical conductors may
Inventors: Jun Zhai, Kunzhong Hu, Chonghua Zhong

Double side mounting memory integration in thin low warpage fanout package

10/13/16 - 20160300813 - Packages and methods of formation are described. In an embodiment, a package includes a redistribution layer (RDL) formed directly on a top die, and a bottom die mounted on a back surface of the RDL.
Inventors: Jun Zhai, Kunzhong Hu, Chonghua Zhong, Mengzhi Pang, Se Young Yang

System in package fan out stacking architecture and process flow

09/08/16 - 20160260684 - Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of
Inventors: Jun Zhai, Kunzhong Hu, Kwan-yu Lai, Mengzhi Pang, Chonghua Zhong, Se Young Yang

Package-on-package options with multiple layer 3-d stacking

01/14/16 - 20160013156 - In some embodiments, a semiconductor device package on package assembly may include a first package, a second package, and a third package. The first package may include a first surface, a second surface, a first die, and a first set of electrical conductors. The first set of electrical conductors may
Inventors: Jun Zhai, Kunzhong Hu, Chonghua Zhong

Reconfigured wide i/o memory modules and package architectures using same

12/17/15 - 20150364454 - In some embodiments, it is desirable to increase memory bandwidth using an integrated solution. In one embodiment, wide I/O memory may be used. Described herein are embodiments of systems and methods of reconfiguring wide I/O memory modules. The reconfigured memory modules may be configured such that the memory modules function
Inventors: Jun Zhai, Chonghua Zhong, Kunzhong Hu, Se Young Yang


### Chonghua Zhong patent invention listings

The bibliographic references displayed about Chonghua Zhong's patents are for a recent sample of Chonghua Zhong's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Chonghua Zhong filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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