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Chip-based cpu cooler and cooling method thereofRelated Patent Categories: Refrigeration, Using Electrical Or Magnetic Effect, Thermoelectric; E.g., Peltier EffectChip-based cpu cooler and cooling method thereof description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060162340, Chip-based cpu cooler and cooling method thereof. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of Invention The present invention generally relates to CPU (central processing unit) cooling devices and more particularly to a chip-based CPU cooling device having a thermal electric cooler and a cooling method thereof. [0002] 2. Description of Related Art [0003] Operating frequency of the CPU of a computer has been continuously increasing as the technology develops. Accordingly, heat generated by a running CPU increases greatly. Heat dissipation thus has become a critical issue in maintaining the normal operation of a CPU (i.e., computer). [0004] Conventionally, a CPU cooler is implemented as a passive one. In detail, a member formed of high heat conduction metal or alloy is mounted on the CPU. The member comprises a plurality of parallel fins. In operation, heat generated by CPU is transferred to the fins by contact prior to dissipating to the ambient. For achieving maximum heat dissipation, the number of fins, locations of the fins, angles of the fins with respect to CPU, convection, material of the cooler (i.e., heat conductivity of material) are considered. However, the desired good heat dissipation of CPU is compromised as interference among heat conduction, convection, and radiation. [0005] Another conventional CPU cooler is implemented as a thermal electric cooler which is in direct contact with CPU. A heat absorbing surface and a heat dissipating surface are formed on both sides of a semiconductor chip in response to electric current flowing through the thermal electric cooler. The heat absorbing surface contacts the hot CPU and the heat dissipating surface is in fluid communication with a heat sink or cooling fan so as to carry out cooling of the CPU. Such technique is disclosed in Taiwanese Patent No. 88,203,663. However, heat may undesirably transfer back to the heat absorbing surface if cooling members arranged at the heat dissipating surface operate abnormally. Moreover, dew may generate on the cooler due to abrupt temperature drop. Thus, the need for improvement of thermal electric cooler for CPU still exists. SUMMARY OF THE INVENTION [0006] It is therefore an object of the present invention to provide a chip-based CPU cooling device having a metal cover completely covered and contacted the CPU for facilitating heat dissipation by eliminating external air interference. [0007] It is another object of the present invention to provide a chip-based CPU cooling device comprising a hollow seat and a housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fins by eliminating external air interference. [0008] It is yet another object of the present invention to provide a chip-based CPU cooling device comprising a thermal electric cooler, a first fan mounted on a first outlet, and a second fan mounted on a second outlet such that an optimum heat dissipation can be obtained by running a control program to optionally control on/off of the fans and power of the activated thermal electric cooler depending on actual demand. [0009] In one aspect of the present invention, there is provided a chip-based cooling device mountable on a CPU arranged on a motherboard, comprising a metal cover, a hollow seat, a thermal electric cooler, a heat dissipation member, a housing, a first fan, and a second fan wherein the cover is adapted to completely cover and contact the CPU, the thermal electric cooler is shaped to fit in the seat, the heat dissipation member is enclosed by the housing and is mounted on the seat, the first fan is mounted on top of the housing, the second fan is mounted on one side of the housing, the thermal electric cooler is adapted to contact the cover, and the heat dissipation member is adapted to contact the thermal electric cooler, and wherein the seat and housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fin by eliminating external air interference. [0010] In another aspect of the present invention, in a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device there is provided a method of cooling the CPU comprising the steps of a) defining an operating temperature of the CPU into one of a plurality of ranges; b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range each of the thermal electric cooler, the first fan, and the second fan is off; in a second range each of the thermal electric cooler, the first fan, and the second fan is in a standby condition; in a third range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a fourth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; in a fifth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; and in a sixth range the thermal electric cooler operates in full power, the first fan is on, and the second fan is on; c) measuring the operating temperature of the CPU; and d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform. [0011] In yet another aspect of the present invention, in a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device there is provided a method of cooling the CPU comprising the steps of a) defining an operating temperature of the CPU into one of a plurality of ranges; b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; and in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; c) measuring the operating temperature of the CPU; d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform; and e) forming a cycle including the first, the second, and the third ranges such that a drop of the operating temperature of the CPU out of the third range is adapted to cause the cooling device to operate in the first range. [0012] The above and other objects, features and advantages of the present invention will become apparent from the following detailed description taken with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1 is an exploded perspective view of a preferred embodiment of cooling device according to the invention to be mounted on a CPU; [0014] FIG. 2 is a perspective view of one portion of the assembled cooling device shown in FIG. 1; [0015] FIG. 3 is a perspective view of the remaining portion of the assembled cooling device shown in FIG. 1; [0016] FIG. 4 is a perspective view of the completely assembled cooling device on the CPU shown in FIG. 1; and [0017] FIG. 5 is a state diagram illustrating a plurality of temperature cases according to a cooling method of the invention. DETAILED DESCRIPTION OF THE INVENTION [0018] Referring to FIGS. 1 to 4, there is shown a cooling device for CPU in accordance with a preferred embodiment of the invention. The cooling device comprises a cover 11 formed of metal of high heat conductivity, a seat 12, a thermal electric cooler 13, a frame 14, a plurality of fins 21 of high heat conductivity as a heat sink, a housing 22, a first fan 23, and a second fan 24. Each component is discussed in detailed below. [0019] A CPU 3 is completely covered by the cover 11 thereon. The cover 11 also completely contacts the CPU 3 and the thermal electric cooler 13. The cover 11 is served to direct out heat produced from CPU 3. The square hollow seat 12 comprises an outer U-shaped wall 121, an inner U-shaped wall 122, a U-shaped groove 123 defined by the walls 121 and 122 for directing air communication with the cover 11 (i.e., no external air interference), and a central opening 124 which is a hollow-through opening. A chip powered by flowing electric current therethrough is provided in the thermal electric cooler 13 and the chip comprises a lower heat absorbing surface 131 and an upper heat dissipating surface 132. A lower portion of the thermal electric cooler 13 is shaped to neatly fit in the opening 124 to contact the cover 11. [0020] The square frame 14 comprises a central opening 141 with an upper portion of the thermal electric cooler 13 neatly fitted therein and slightly, upwardly projected from the seat 12 (as shown in FIG. 3) to contact the base of the fins 21. The housing 22 is secured to the seat 12 (as shown in FIG. 4), which is in turn secured to a motherboard with the CPU 3 mounted thereon in a manner known in the art. The housing 22, as shown in FIG. 1, comprises an outer wall 221, an inner wall 222, a channel 223 defined by the walls 221 and 222 for directing air communication with the fins 21 (i.e., no external air interference), a central passageway 224 defined by the inner wall 222 for neatly fitting the fins 21 therein, an upper opening 225 with the first fan 23 mounted thereon, and an inclined passage 226 at one side, the passage 226 having an opening 227 at an open end with the second fan 24 mounted thereon. This completes the assembly of the cooling device for CPU on the motherboard, as shown in FIG. 4. Note that the fins 21 may be replaced by any of other good heat dissipation members (e.g., heat pipe) in other embodiments. Continue reading about Chip-based cpu cooler and cooling method thereof... Full patent description for Chip-based cpu cooler and cooling method thereof Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Chip-based cpu cooler and cooling method thereof patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Chip-based cpu cooler and cooling method thereof or other areas of interest. ### Previous Patent Application: Gas turbine engine component having bypass circuit Next Patent Application: Comestible preparation apparatus Industry Class: Refrigeration ### FreshPatents.com Support Thank you for viewing the Chip-based cpu cooler and cooling method thereof patent info. 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