Hsinchu, China

Patent applications with an agent or inventor associated with Hsinchu, China.

20070164412 - Method of wire bonding over active area of a semiconductor circuit

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The listing of Patent Applications for Hsinchu, China is of recent patent applications only. Freshpatents.com tracks patent applications. The applications are submitted to the USPTO for approval, published and eventually approved or denied. This process is completed in anywhere between 1-3 years time by the USPTO, a US goverment agency not affiliated with Freshpatents.com. Notifiy us with any corrections or comments about Hsinchu, China patents or the website in general.