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Chih-Chao Yang patents

Recent bibliographic sampling of Chih-Chao Yang patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):



12/11/14 - 20140363941 - Replacement gate electrode with a self-aligned dielectric spacer
11/20/14 - 20140342549 - Dual damascene dual alignment interconnect scheme
11/13/14 - 20140332964 - Interconnect structures containing nitrided metallic residues
11/13/14 - 20140332960 - Interconnect structures containing nitrided metallic residues
10/30/14 - 20140319650 - Programmable electrical fuse
10/02/14 - 20140291760 - Fet semiconductor device with low resistance and enhanced metal fill
09/18/14 - 20140264878 - Copper interconnect structures and methods of making same
09/18/14 - 20140264490 - Replacement gate electrode with a self-aligned dielectric spacer
08/28/14 - 20140239439 - Electrical fuses and methods of making electrical fuses
08/21/14 - 20140231918 - Finfets and fin isolation structures
08/07/14 - 20140220777 - Processing system for combined metal deposition and reflow anneal for forming interconnect structures
08/07/14 - 20140216342 - Processing system for combined metal deposition and reflow anneal for forming interconnect structures
07/31/14 - 20140210041 - Electronic fuse having an insulation layer
07/24/14 - 20140206190 - Silicide formation in high-aspect ratio structures
07/24/14 - 20140203453 - Air-dielectric for subtractive etch line and via metallization
07/10/14 - 20140191323 - Method of forming finfet of variable channel width
07/10/14 - 20140191296 - Self-aligned dielectric isolation for finfet devices
07/10/14 - 20140190935 - Dual mandrel sidewall image transfer processes
07/03/14 - 20140183739 - Dual damascene structure with liner
06/12/14 - 20140162450 - Interconnect structure with an electromigration and stress migration enhancement liner
06/05/14 - 20140154846 - Semiconductor device with raised source/drain and replacement metal gate
06/05/14 - 20140151097 - Method and structure to improve the conductivity of narrow copper filled vias
05/08/14 - 20140124933 - Copper interconnect structures and methods of making same
05/01/14 - 20140120709 - Insulative cap for borderless self-aligning contact in semiconductor device
05/01/14 - 20140117423 - Insulative cap for borderless self-aligning contact in semiconductor device
04/24/14 - 20140110817 - Sub-lithographic semiconductor structures with non-constant pitch
04/10/14 - 20140099792 - Single fin cut employing angled processing methods
03/06/14 - 20140068541 - Interconnect structures and methods for back end of the line integration
03/06/14 - 20140065813 - Size-filtered multimetal structures
03/06/14 - 20140061930 - Overlay-tolerant via mask and reactive ion etch (rie) technique
02/20/14 - 20140048927 - Method to improve fine cu line reliability in an integrated circuit device
02/20/14 - 20140048905 - Low cost anti-fuse structure
02/06/14 - 20140035142 - Profile control in interconnect structures
01/30/14 - 20140027865 - Mosfet gate and source/drain contact metallization
01/23/14 - 20140024210 - Low cost anti-fuse structure and method to make same
01/23/14 - 20140021581 - Low cost anti-fuse structure
01/09/14 - 20140008764 - High-nitrogen content metal resistor and method of forming same
12/19/13 - 20130334580 - Replacement metal gate processing with reduced interlevel dielectric layer etch rate
12/12/13 - 20130328208 - Dual damascene dual alignment interconnect scheme
12/12/13 - 20130328167 - Self-aligned metal-insulator-metal (mim) capacitor
12/05/13 - 20130320546 - Dual-metal self-aligned wires and vias
12/05/13 - 20130320545 - Hybrid copper interconnect structure and method of fabricating same
12/05/13 - 20130320414 - Borderless contacts for metal gates through selective cap deposition
12/05/13 - 20130320411 - Borderless contacts for metal gates through selective cap deposition
11/28/13 - 20130313717 - Spacer for enhancing via pattern overlay tolerence
11/21/13 - 20130309857 - Mask free protection of work function material portions in wide replacement gate electrodes
11/21/13 - 20130307086 - Mask free protection of work function material portions in wide replacement gate electrodes
10/03/13 - 20130260530 - Modularized three-dimensional capacitor array
09/26/13 - 20130252419 - Metal alloy cap integration
09/26/13 - 20130252415 - Structure and process for metallization in high aspect ratio features
09/05/13 - 20130230983 - Hybrid interconnect structure for performance improvement and reliability enhancement
09/05/13 - 20130228925 - Hybrid interconnect structure for performance improvement and reliability enhancement
08/29/13 - 20130221529 - Hybrid interconnect structure for performance improvement and reliability enhancement
08/29/13 - 20130221527 - Metallic capped interconnect structure with high electromigration resistance and low resistivity
08/15/13 - 20130207270 - Dual-metal self-aligned wires and vias
08/01/13 - 20130193579 - Structure for nano-scale metallization and method for fabricating same
07/18/13 - 20130181261 - Borderless contact structure
07/04/13 - 20130168863 - Enhanced diffusion barrier for interconnect structures
07/04/13 - 20130168807 - Interconnect structure containing various capping materials for electrical fuse and other related applications, and design structure thereof
07/04/13 - 20130168806 - Electrical fuse structure and method of fabricating same
07/04/13 - 20130168749 - Borderless contact structure employing dual etch stop layers
06/27/13 - 20130164905 - 3d via capacitor with a floating conductive plate for improved reliability
06/27/13 - 20130161791 - 3d via capacitor with a floating conductive plate for improved reliability
06/27/13 - 20130161697 - Replacement gate mosfet with raised source and drain
06/13/13 - 20130149859 - Tungsten metallization: structure and fabrication of same
05/30/13 - 20130134590 - Formation of air gap with protection of metal lines
05/23/13 - 20130126817 - E-fuses containing at least one underlying tungsten contact for programming
05/09/13 - 20130115767 - Metal alloy cap integration
05/09/13 - 20130113101 - Use of gas cluster ion beam to reduce metal void formation in interconnect structures
04/18/13 - 20130093089 - Interconnect structure with an electromigration and stress migration enhancement liner
03/21/13 - 20130071998 - Electrical fuse with metal line migration
03/21/13 - 20130069161 - Integrated circuit structure having selectively formed metal cap
02/21/13 - 20130043591 - Tungsten metallization: structure and fabrication of same
02/21/13 - 20130043556 - Size-filtered multimetal structures
02/14/13 - 20130037865 - Semiconductor structure having a wetting layer
01/31/13 - 20130026635 - Hybrid copper interconnect structure and method of fabricating same
12/27/12 - 20120329275 - Borderless interconnect line structure self-aligned to upper and lower level contact vias
12/27/12 - 20120329271 - Discontinuous/non-uniform metal cap structure and process for interconnect integration
12/27/12 - 20120329270 - Surface repair structure and process for interconnect applications
12/27/12 - 20120326311 - Enhanced diffusion barrier for interconnect structures
12/13/12 - 20120313220 - High-nitrogen content metal resistor and method of forming same
12/13/12 - 20120313194 - Semiconductor switching device and method of making the same
12/06/12 - 20120306048 - Electrically programmable metal fuse
11/01/12 - 20120273848 - Borderless contact structure employing dual etch stop layers
10/18/12 - 20120264292 - Redundant metal barrier structure for interconnect applications
10/18/12 - 20120261794 - Design structure for interconnect structure containing various capping materials for electrical fuse and other related applications
10/18/12 - 20120261793 - Electrical fuse and method of making the same
09/13/12 - 20120228770 - Metal cap for back end of line (beol) interconnects, design structure and method of manufacture
09/06/12 - 20120225549 - Redundancy design with electro-migration immunity and method of manufacture
08/16/12 - 20120208362 - Structure and process for metallization in high aspect ratio features
08/16/12 - 20120205804 - Method to fabricate copper wiring structures and structures formed tehreby
07/26/12 - 20120190187 - Pad bonding employing a self-aligned plated liner for adhesion enhancement
07/26/12 - 20120188002 - Modularized three-dimensional capacitor array
07/26/12 - 20120187566 - Air-dielectric for subtractive etch line and via metallization
07/26/12 - 20120187528 - Finfet fuse with enhanced current crowding
07/05/12 - 20120171860 - Metal cap for back end of line (beol) interconnects, design structure and method of manufacture
06/28/12 - 20120161334 - Redundancy design with electro-migration immunity and method of manufacture
06/21/12 - 20120153482 - Structure and methods of forming contact structures
06/14/12 - 20120149191 - Metal cap with ultra-low k dielectric material for circuit interconnect applications
05/03/12 - 20120104619 - Sublithographic patterning employing image transfer of a controllably damaged dielectric sidewall
05/03/12 - 20120104470 - Replacement gate mosfet with raised source and drain
04/12/12 - 20120086128 - Borderless interconnect line structure self-aligned to upper and lower level contact vias
04/05/12 - 20120080771 - 3d via capacitor with a floating conductive plate for improved reliability
03/29/12 - 20120074520 - Electrical fuse structure and method of fabricating same
03/22/12 - 20120068346 - Structure for nano-scale metallization and method for fabricating same
01/19/12 - 20120012372 - Method and structure to improve the conductivity of narrow copper filled vias
11/24/11 - 20110285021 - Noble metal cap for interconnect structures
11/10/11 - 20110272765 - Mosfet gate and source/drain contact metallization
10/20/11 - 20110254121 - Programmable anti-fuse structures with conductive material islands
08/11/11 - 20110193230 - Formation of air gap with protection of metal lines
07/14/11 - 20110169127 - Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
04/21/11 - 20110092067 - Air gap structure having protective metal silicide pads on a metal feature
04/21/11 - 20110092031 - Efficient interconnect structure for electrical fuse applications
02/10/11 - 20110031623 - Interconnect structure and method for cu/ultra low k integration
02/03/11 - 20110024909 - Bilayer metal capping layer for interconnect applications
11/25/10 - 20100295181 - Redundant metal barrier structure for interconnect applications
10/21/10 - 20100264543 - Interconnect structure
07/15/10 - 20100176514 - Interconnect with recessed dielectric adjacent a noble metal cap
07/15/10 - 20100176512 - Structure and method for back end of the line integration
06/10/10 - 20100143649 - High aspect ratio electroplated metal feature and method
04/08/10 - 20100084767 - Discontinuous/non-uniform metal cap structure and process for interconnect integration
04/08/10 - 20100084766 - Surface repair structure and process for interconnect applications
02/18/10 - 20100038784 - Redundant barrier structure for interconnect and wiring applications, design structure and method of manufacture
02/18/10 - 20100038783 - Metal cap for back end of line (beol) interconnects, design structure and method of manufacture
02/18/10 - 20100038782 - Nitrogen-containing metal cap for interconnect structures
01/21/10 - 20100013043 - Crackstop structures and methods of making same
01/21/10 - 20100012950 - Crackstop structures and methods of making same
12/31/09 - 20090321933 - Structure to facilitate plating into high aspect ratio vias
12/17/09 - 20090309226 - Interconnect structure for electromigration enhancement
12/03/09 - 20090298281 - Interconnect structure with high leakage resistance
12/03/09 - 20090297759 - Stress locking layer for reliable metallization
11/26/09 - 20090289365 - Structure and process for conductive contact integration
11/12/09 - 20090280636 - Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications
11/12/09 - 20090278260 - Redundancy design with electro-migration immunity and method of manufacture
11/12/09 - 20090278258 - Interconnect structure with a mushroom-shaped oxide capping layer and method for fabricating same
11/12/09 - 20090278229 - Efficient interconnect structure for electrical fuse applications
11/12/09 - 20090278228 - Design structure for interconnect structure containing various capping materials for electrical fuse and other related applications
10/08/09 - 20090250815 - Surface treatment for selective metal cap applications
09/03/09 - 20090218695 - Low contact resistance metal contact
09/03/09 - 20090218691 - Bilayer metal capping layer for interconnect applications
08/27/09 - 20090212433 - Structure and process for metallization in high aspect ratio features
08/13/09 - 20090200668 - Interconnect structure with high leakage resistance
08/06/09 - 20090194876 - Interconnect structure and method for cu/ultra low k integration
08/06/09 - 20090194875 - High purity cu structure for interconnect applications
07/30/09 - 20090189287 - Noble metal cap for interconnect structures
07/23/09 - 20090184400 - Via gouging methods and related semiconductor structure
07/16/09 - 20090179328 - Barrier sequence for use in copper interconnect metallization
07/09/09 - 20090174075 - Simultaneous grain modulation for beol applications
06/11/09 - 20090148677 - High aspect ratio electroplated metal feature and method
06/04/09 - 20090140428 - Air gap structure having protective metal silicide pads on a metal feature
05/07/09 - 20090117360 - Self-assembled material pattern transfer contrast enhancement
04/30/09 - 20090108450 - Interconnect structure and method of making same
04/16/09 - 20090096108 - Structure and methods of forming contact structures
03/26/09 - 20090079077 - Interconnect structure with a via gouging feature absent profile damage to the interconnect dielectric and method of fabricating same
03/19/09 - 20090072406 - Interconnect structure with improved electromigration resistance and method of fabricating same
03/05/09 - 20090057818 - Methods and systems involving electrically programmable fuses
02/05/09 - 20090035954 - Interconnect structure with grain growth promotion layer and method for forming the same
International Business Machines

Archived*
(*May have duplicates - we are upgrading our archive.)

20130001789 - Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
20130005137 - Barrier sequence for use in copper interconnect metallization


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The bibliographic references displayed about Chih-Chao Yang's patents are for a recent sample of Chih-Chao Yang's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Chih-Chao Yang filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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