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05/11/06 - USPTO Class 446 |  119 views | #20060099877 | Prev - Next | About this Page  446 rss/xml feed  monitor keywords

Chemical modeling apparatus

USPTO Application #: 20060099877
Title: Chemical modeling apparatus
Abstract: The present invention relates to an apparatus for modeling chemical structures having multiple types of bonding. In an embodiment, the present invention relates to an apparatus for modeling chemical structures having multiple types of bonding, including hydrogen bonding. In an embodiment, the invention is a molecular modeling device including a plurality of molecular components. The molecular components can include a first elemental component comprising a plurality of first magnets, a second elemental component comprising a second magnet, and a primary structural bond attaching the first elemental component to the second elemental component. The molecular components can be attached to other molecular components through secondary structural bonds, wherein the primary structural bond attaches more strongly than the secondary structural bond. In an embodiment, the first and second magnets each include first and second magnetic poles, the first magnets disposed on the exterior of the first elemental component with the first magnetic pole pointing away from the interior of the first elemental components. The second magnet can be disposed on the exterior of the second elemental component with the second magnetic pole of the second magnet pointing away from the interior of the second elemental component. (end of abstract)



Agent: Merchant & Gould PC - Minneapolis, MN, US
Inventor: George R. Anderson
USPTO Applicaton #: 20060099877 - Class: 446092000 (USPTO)

Related Patent Categories: Amusement Devices: Toys, Construction Toy, Including Permanent Magnet Or Suction Cup To Secure Elements

Chemical modeling apparatus description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20060099877, Chemical modeling apparatus.

Brief Patent Description - Full Patent Description - Patent Application Claims
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FIELD OF THE INVENTION

[0001] The present invention relates to an apparatus for modeling chemical structures. More specifically, the present invention relates to an apparatus for modeling chemical structures having multiple types of bonding.

BACKGROUND OF THE INVENTION

[0002] Atoms are the building blocks of all matter. Atoms can associate with other atoms through chemical bonds. A chemical bond can be said to exist between two atoms or groups of atoms when forces acting between them lead to the formation of an aggregate with sufficient stability to make it convenient for the scientist to consider it as an independent molecular species. See L. Pauling, 1960, The Nature of the Chemical Bond. Understanding the effect that chemical bonding has on molecular structure is important in many areas of study including chemistry, physics, and biology.

[0003] Chemical bonds can be broadly classified as electrostatic, covalent, and metallic. More specific classifications of bonding can be made under these three broad categories. By way of example, ionic bonds, ion-dipole bonds, and hydrogen bonds can all be thought of as electrostatic bonds, in whole or in part.

[0004] Various modeling systems for chemical structures and bonding exist. By way of example, U.S. Pat. No. 6,508,652 (Kestyn) and U.S. Pat. No. 4,099,339 (Snelson) disclose chemical modeling systems. These modeling systems can help in visualizing the structure of chemical compounds. However, such modeling systems do not allow one to visualize the effect that hydrogen bonding has on the structure of molecules or on how molecules are arranged with respect to one another. Also, such modeling systems do not allow one to see the structural effects of different types of bonding having different relative strengths, such as the difference in strength between covalent bonding and ion-dipole bonding.

[0005] Therefore, a need exists for a chemical modeling system that will model the effects of hydrogen bonding and/or ion-dipole bonding.

SUMMARY OF THE INVENTION

[0006] The present invention relates to an apparatus for modeling chemical structures having multiple types of bonding, including ion-dipole bonding and/or dipole-dipole bonding including hydrogen bonding. In an embodiment, the invention is a molecular modeling device including a plurality of molecular components including a first elemental component comprising a plurality of first magnets and a second elemental component comprising a second magnet. A primary structural bond can attach the first elemental component to the second elemental component. In an embodiment, the primary structural bond can model a covalent bond. The molecular components can be attached to other molecular components through secondary structural bonds, wherein the primary structural bond attaches more strongly than the secondary structural bond. In an embodiment, the secondary structural bond models an ion-dipole bond. In an embodiment, the secondary structural bond models a dipole-dipole bond. In an embodiment the secondary structural bond models a hydrogen bond. In an embodiment, the first and second magnets each include first and second magnetic poles. The first magnets can be disposed on the exterior of the first elemental component with the first magnetic pole pointing away from the interior of the first elemental components. The second magnet can be disposed on the exterior of the second elemental component with the second magnetic pole of the second magnet pointing away from the interior of the second elemental component.

[0007] In an embodiment, the invention is directed to a molecular modeling device comprising a plurality of molecular components comprising a first atomic component and a second atomic component and means for attaching molecular components together to simulate both primary and secondary structure of a chemical compound.

[0008] The above summary of the present invention is not intended to describe each discussed embodiment of the present invention. This is the purpose of the figures and the detailed description that follows.

DRAWINGS

[0009] The invention may be more completely understood in connection with the following drawings, in which:

[0010] FIG. 1 is a front schematic view of a modeling component in accordance with an embodiment of the invention modeling water (H.sub.2O).

[0011] FIG. 2 is a back schematic view of the modeling component of FIG. 1.

[0012] FIG. 3 is a cross-sectional schematic view of a modeling component taken along lines A-A' of FIG. 1.

[0013] FIG. 4 is a cross-sectional schematic view of the modeling component taken along lines B-B' of FIG. 2.

[0014] FIG. 5 is a cross-sectional schematic view of an alternative embodiment of a modeling component.

[0015] FIG. 6 is cross-section schematic view of a modeling component with magnets that are disposed within channels away from the surface of the modeling component.

[0016] FIG. 7 is a schematic view of another embodiment of a modeling component in accordance with the invention.

[0017] FIG. 8 is a schematic side offset view of another embodiment of a modeling component in accordance with the invention.

[0018] FIG. 9 is a schematic view of an embodiment of the invention modeling a hydrogen-bonded cyclic five-water complex.

[0019] FIG. 10 is a schematic view of an embodiment of the invention modeling a hydrogen bonded cyclic six-water complex (primitive unit cell of hexagonal ice).

[0020] FIG. 11 is a schematic offset view of an embodiment of the invention modeling two hexagonal water complexes hydrogen bonded to each other (complete unit cell of hexagonal ice).

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