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Carrier for substrate filmRelated Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Making Plural Separate Devices, Using Strip Lead FrameCarrier for substrate film description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060194369, Carrier for substrate film. Brief Patent Description - Full Patent Description - Patent Application Claims
RELATED APPLICATIONS [0001] This application is a continuation of U.S. patent application Ser. No. 11/218,137, filed Sep. 1, 2005, which is a continuation of U.S. patent application Ser. No. 09/389,720, filed Sep. 3, 1999, now U.S. Pat. No. 6,975,021, the entirety of each one of which is hereby incorporated by reference herein. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates generally to the handling of semiconductor chips and, specifically, to a carrier adapted for supporting a substrate film during the assembly and bonding process. [0004] 2. Description of the Related Art [0005] In today's integrated circuit (IC) technology, semiconductor chips or dies are typically batch fabricated on a silicon wafer. The wafer may contain hundreds of dies arranged in a matrix. The dies are separated and each die is typically mounted on an appropriate substrate, contacted, and packaged. [0006] The substrate is typically a thin flexible tape or film reel which permits automated transport and handling of the dies. Many dies may be attached adjacently to a single tape using, for example, a suitable adhesive material. Bond pads on the dies and the substrate film allow the dies to be wire bonded or connected, using suitable leads, to the substrate. The die-substrate assemblies may then be cut into individual units. Each unit is packaged in a suitable medium with output leads, for example, ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like. The outputs of these packages allow interconnections to a similarly patterned arrangement of connections on a printed circuit board (PCB). [0007] The thinness of the substrate film or tape is advantageous in that it does not significantly add to the weight and size of the end product. But this thinness can also cause the substrate film reel to be fragile and flimsy. As a result, during the assembly process, the film is prone to undesirable and/or unwanted bending and movement. This cannot only cause damage to the die, the substrate and the die-substrate interface, but can also complicate the handling and assembly of the die and substrate. For example, undesirable bending of the film substrate can result in breakage of one or more of the leads connecting the dies to the substrate. SUMMARY OF THE INVENTION [0008] The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments of the carrier include easier handling, reduced probability of defective end products, and increased control in choosing the thinness of the substrate film. For example, the substrate film carrier can be used for lead-over-chip (LOC) assemblies and lead-under-chip (LUC) assemblies to create ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like. [0009] In one embodiment, a carrier for supporting a substrate film comprises side bars and cross bars. The side bars and cross bars are in mechanical communication with the substrate film and provide rigidity during the manufacturing process. In another embodiment, an assembly comprises a substrate film and a carrier. The carrier comprises side bars which are in mechanical communication with the substrate film. [0010] In another embodiment, an assembly comprises a film and a carrier. The film includes a plurality of substrate units. The plurality of substrate units is adapted to electrically interface with a plurality of dies. The carrier is in mechanical communication with the film. The carrier provides enhanced rigidity to the film by being sized and configured to add material at selected regions of the film. [0011] In another embodiment, an assembly for attachment of integrated circuits comprises a film, a plurality of dies and a carrier. The film includes a plurality of substrate units. The plurality of dies are in electrical contact with the plurality of substrate units. The carrier is in mechanical communication with the film for providing enhanced rigidity to the film. [0012] One embodiment of the invention relates to method for supporting a substrate film. The method comprises connecting side bars to a substrate film and connecting cross bars to the substrate film, whereby the side bars and the cross bars provide rigidity during the manufacturing process. [0013] Another embodiment relates to a method of manufacturing an assembly. The method comprises connecting side bars to a substrate film and transporting the side bars and the substrate film through a manufacturing process. The method further comprises removing the side bars after at least a portion of the manufacturing process. [0014] An additional embodiment relates to a method of processing semiconductor dies. The method comprises forming a plurality of substrate units within a film and interfacing the substrate units with a plurality of dies. The method further comprises adding support material at selected regions of the film so as to provide enhanced rigidity to the substrate units. The method also comprises removing the support material at the completion of at least a portion of a manufacturing process. [0015] One embodiment relates to a method of manufacturing integrated circuits. The method comprises forming a plurality of substrate units within a substrate film and interfacing a plurality of dies to the plurality of substrate units. The method further comprises connecting a carrier to the film to enhance the rigidity of the film. [0016] For purposes of summarizing the invention, certain aspects, advantages and novel features of the invention have been described herein above. Of course, it is to be understood that not necessarily all such advantages may be achieved in accordance with any particular embodiment of the invention. Thus, the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein. [0017] All of these embodiments are intended to be within the scope of the invention herein disclosed. These and other embodiments of the present invention will become readily apparent to those skilled in the art from the following detailed description of the preferred embodiments having reference to the attached figures, the invention not being limited to any particular preferred embodiment(s) disclosed. BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a schematic exploded perspective view of one embodiment of a ball grid array (BGA) chip package and a printed circuit board (PCB); [0019] FIG. 2 is a partially exploded perspective view of a substrate film, carrier and lead-over-chip (LOC) die assembly in accordance with one embodiment of the present invention; [0020] FIG. 3 is a top plan view of the substrate film of FIG. 2; Continue reading about Carrier for substrate film... Full patent description for Carrier for substrate film Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Carrier for substrate film patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Carrier for substrate film or other areas of interest. ### Previous Patent Application: Thin film translator array panel and a method for manufacturing the panel Next Patent Application: Method of manufacturing semiconductor device Industry Class: Semiconductor device manufacturing: process ### FreshPatents.com Support Thank you for viewing the Carrier for substrate film patent info. 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