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  Camera device, method of manufacturing a camera device, wafer scale packageUSPTO Application #: 20070275505Title: Camera device, method of manufacturing a camera device, wafer scale package Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis through the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out. (end of abstract) Agent: Wood, Phillips, Katz, Clark & Mortimer - Chicago, IL, US Inventors: Edwin Maria Wolterink, Gerardus Maria Dohmen, Aloysius Franciscus Maria Sander, Arjen Gerben Van Der Sijde, Leendert De Bruin, Erik Harold Groot, Anton Petrus Maria Van Arendonk USPTO Applicaton #: 20070275505 - Class: 438118000 (USPTO) Related Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Including Adhesive Bonding Step The Patent Description & Claims data below is from USPTO Patent Application 20070275505. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] The invention relates to a camera device comprising an image capturing element, a lens element for projecting an object on the image capturing element, a spacer means for maintaining a predetermined distance between the lens and the image capturing element, and a lens substrate for carrying the lens. [0002] The invention also relates to a method for manufacturing a camera device, a wafer scale package comprising a base substrate having a plurality of image capturing elements, and an optical assembly for use in a process for manufacturing a camera device. [0003] Camera devices of this type are used in, for instance small portable devices such as mobile telephones, personal digital assistants (PDAs) and laptop computers. [0004] A camera device as mentioned in the opening paragraph is disclosed in the Japanese patent application published under number JP-2002/139662. The known camera device comprises an image pick-up element mounted on a substrate, and a lens support carrying one or more lenses. The lens support is integrally formed with the lens and is fastened to the image pick-up element whereby the lens support takes care of an accurate position in the direction of a main optical axis through the lenses on the image pick-up element. In a manufacturing process the individual image pick-up element, lens support, and lens are stacked and joined together. In order to obtain a high-quality image of an object on the image pick-up element, the dimensions of the lens support in the direction of the main optical axis should have a high accuracy. Furthermore positioning of these parts relative to each other should be accurate. [0005] A disadvantage of the known camera device is that the manufacturing process each lens support has to be adjusted separately relative to the image pick-up element in each camera device, so there is little possibility to manufacture the known camera device in an efficient mass production process while maintaining a high positioning accuracy. [0006] It is inter alia an object of the invention to provide a camera device of the type mentioned in the opening paragraph, having an increased capability for an efficient mass manufacturing process with a high positioning accuracy. [0007] To this end the invention provides camera device as defined in the opening paragraph which is characterized in that the spacer means comprises an adhesive layer. [0008] In this arrangement the lens substrate including the lens element and the spacer means comprising the adhesive layer, can be positioned and aligned along the main optical axis through the lens element and the image capturing element, after which a predetermined distance is set between the lens element and the image capturing device. After hardening the adhesive layer this predetermined distance is maintained by the spacer means. This arrangement provides increased capabilities for mass manufacturing wherein a plurality of image capturing elements, lens elements and spacer means can be manufactured on a base substrate comprising the imaging elements and a lens substrate respectively, whereby the base substrate and the lens substrate are stacked and joined with a high accuracy and the individual camera devices are separated from the stack. The hardening of the adhesive layer can be performed in case of an ultra-violet curable adhesive by UV radiation or in case of a thermo-hardening adhesive by heating the adhesive layer. [0009] U.S. Pat. No. 6,285,064 introduces a wafer scale package for solid state image sensor integrated circuits, whereby arrays of micro lenses are placed on top of a wafer having the image sensors formed thereon. An adhesive matrix is placed atop of the wafer. The adhesive matrix has openings that align with the micro lens arrays on top of the wafer. A cover glass is then placed over the adhesive and the adhesive is activated to secure the cover glass to the wafer. Because the adhesive has openings above the micro lensed portion distortion or reduction of the lens effect by the adhesive shall be avoided. [0010] It is a further object of the invention to provide a method for an efficient mass production process of a camera device. This object is achieved by a method for manufacturing a camera device, characterized by the steps of [0011] providing a lens substrate comprising a plurality of lens elements, the lens substrate comprising an adhesive layer; [0012] stacking the lens substrate and a base substrate comprising a plurality of image capturing elements; [0013] aligning the lens substrate and the base substrate along main optical axes through respective lens elements and associated image capturing elements; [0014] setting the distance between the lens elements and the associated image capturing elements along the main optical axes through the lens elements and the associated image capturing elements; [0015] hardening the adhesive layer; and [0016] separating camera devices from the stack of the lens substrate and the base substrate. [0017] In this process the camera devices are manufactured by stacking a lens substrate comprising a plurality of lens elements, spacer means in the form of a spacer substrate and a base substrate containing a plurality of image capturing elements. The predetermined distances along the optical axis through the individual lens elements and the associated image capturing elements between the different substrates can be accurately adjusted after the stacking of the substrates and maintained by hardening of the adhesive layer between the different substrates. After completing the stack, the individual camera devices can be separated from the stack. This process yields relatively cheap camera devices which are suitable for use in small electronic equipment, such as mobile phones and personal digital assistants. [0018] It is a further object of the invention to provide a wafer scale package for an efficient mass production of a camera device. This object is achieved by a wafer scale package comprising a base substrate having a plurality of image capturing elements, characterized in that it further comprises a lens substrate having a plurality of lens elements associated with respective image capturing elements, and a spacer means for maintaining a predetermined distance between the lens substrate and the base substrate, whereby the position of the lens substrate relative to the base substrate is fixated by means of an adhesive layer. [0019] In this wafer scale package the lenses are already aligned relative to the corresponding image capturing elements and the distance between the lenses and the corresponding image capturing elements is accurately adjusted. In this way it is not required to position individual lens elements relative to corresponding individual image capturing elements, thereby simplifying the manufacturing of camera devices. [0020] It is a further object of the invention to provide an optical assembly for an efficient mass production of a camera device. This object is achieved by An optical assembly for use in a process for manufacturing a camera device according to the invention, characterized in that it comprises a lens substrate having a plurality of lens elements. [0021] By stacking the optical assembly and a base substrate comprising a image capturing elements corresponding to the plurality of lens elements it is possible to position the lens elements relatively to the image capturing elements for all lens elements simultaneously. In this way it is not necessary to position individual lens elements relative to individual image capturing elements in a later stage of production. [0022] Preferably the optical assembly has area dimensions corresponding to the area dimensions of the base substrate comprising the image capturing elements. [0023] In embodiments the adhesive layer comprises an ultra-violet curing resin or a thermo-hardening resin. [0024] In a further embodiment the adhesive layer has the shape of a rim situated outside the projection of the hole on the spacer means, co-axially positioned with the main optical axis of the lens element. In this way, no adhesive material is in the optical path between the lens element and the image capturing element. Continue reading... Full patent description for Camera device, method of manufacturing a camera device, wafer scale package Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Camera device, method of manufacturing a camera device, wafer scale package patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. 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