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Bonding of elastomeric substrate under stretched conditionsUSPTO Application #: 20070131343Title: Bonding of elastomeric substrate under stretched conditions Abstract: A method of bonding material in a process system for producing a bonded product includes the steps of loading a plurality of rolls of elastomeric material in an unwind system; programming a controller with an unwind speed and a rewind speed, the controller in communication with the unwind system and a rewinder disposed downstream from the unwind system for respective communication of the unwind and rewind speeds to the unwind system and the rewinder; unwinding a quantity of material from the plurality of rolls of elastomeric material into a pressure bonder disposed upstream of the rewinder, the pressure bonder and the rewinder operating faster than the unwind system operating at the unwind speed to generate a speed differential, wherein the speed differential imparts a stretch state to the quantity of material; and bonding the stretched quantity of material with the pressure bonder. (end of abstract) USPTO Applicaton #: 20070131343 - Class: 156229000 (USPTO) Related Patent Categories: Adhesive Bonding And Miscellaneous Chemical Manufacture, Methods, Surface Bonding And/or Assembly Therefor, With Stretching
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