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Browse: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 1 | 3 | Baker & Mckenzie On Behalf Of Tsmc patentsThe following is a sampling of recent Baker & Mckenzie On Behalf Of Tsmc patent applications (USPTO Patent Application #, Patent Title) sorted by month.October 2008 - Baker & Mckenzie On Behalf Of Tsmc patents 20080251916 - Ubm structure for strengthening solder bumps 20080239794 - Magnetoresistive random access memory device with small-angle toggle write lines August 2008 - Baker & Mckenzie On Behalf Of Tsmc patents 20080186757 - Advanced mram design July 2008 - Baker & Mckenzie On Behalf Of Tsmc patents 20080179689 - Metal salicide formation having nitride liner to reduce silicide stringer and encroachment June 2008 - Baker & Mckenzie On Behalf Of Tsmc patents 20080135957 - Mram cell structure May 2008 - Baker & Mckenzie On Behalf Of Tsmc patents 20080106278 - Method and system for centrally-controlled semiconductor wafer correlation April 2008 - Baker & Mckenzie On Behalf Of Tsmc patents 20080094874 - Multiple-read resistance-variable memory cell structure and method of sensing a resistance thereof January 2008 - Baker & Mckenzie On Behalf Of Tsmc patents 20080002453 - Multiple port resistive memory cell November 2007 - Baker & Mckenzie On Behalf Of Tsmc patents 20070253244 - Magnetic random access memory October 2007 - Baker & Mckenzie On Behalf Of Tsmc patents 20070247784 - Low tunneling current mim structure and method of manufacturing same 20070247900 - 3-parameter switching technique for use in mram memory arrays 20070247940 - High speed sensing amplifier for an mram cell 20070236238 - Systems and methods for reducing testing times on integrated circuit dies May 2007 - Baker & Mckenzie On Behalf Of Tsmc patents 20070096230 - Magnetic memory cells and manufacturing methods April 2007 - Baker & Mckenzie On Behalf Of Tsmc patents 20070091672 - Mram arrays and methods for writing and reading magnetic memory devices 20070087479 - Method of manufacturing low cte substrates for use with low-k flip-chip package devices January 2007 - Baker & Mckenzie On Behalf Of Tsmc patents 20070007649 - Low cte substrates for use with low-k flip-chip package devices December 2006 - Baker & Mckenzie On Behalf Of Tsmc patents 20060286719 - Semiconductor packages and methods of manufacturing thereof November 2006 - Baker & Mckenzie On Behalf Of Tsmc patents 20060267008 - Semiconductor bond pad structures and methods of manufacturing thereof 20060267123 - Microlens designs for cmos image sensors 20060255824 - Method of automatically creating a semiconductor processing prober device file 20060257790 - A semiconductor device structure and methods of manufacturing thereof 20060243599 - Electroplating additive for improved reliability 20060244151 - Oblique recess for interconnecting conductors in a semiconductor device 20060246686 - Multiple etch-stop layer deposition scheme and materials October 2006 - Baker & Mckenzie On Behalf Of Tsmc patents 20060238925 - Magnetoresistive structures and fabrication methods 20060239064 - Magnetic random access memory device 20060239066 - Magnetic random access memory device 20060232322 - Voltage transfer circuit 20060220225 - Semiconductor packages and methods of manufacturing thereof ### This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Baker & Mckenzie On Behalf Of Tsmc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Baker & Mckenzie On Behalf Of Tsmc with additional patents listed. Browse our Agent directory for other possible listings. ### FreshPatents.com Support - Terms & Conditions |