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  Backplane connectorUSPTO Application #: 20080026637Title: Backplane connector Abstract: A card assembly includes two spaced-apart circuit boards defining an interior region between the cards. Connectors may be mounted on the circuit boards and be located within the interior region. That is, respective interior sides of the circuit boards may face each other and the interior region. A connector may be mounted on each interior side. Mounting the connectors in the interior region provides an assembly that defines a mating footprint that is independent of the respective thicknesses, and variations in the thicknesses, of the spaced-apart printed circuit boards. (end of abstract) Agent: Woodcock Washburn, LLP - Philadelphia, PA, US Inventor: Steven E. Minich USPTO Applicaton #: 20080026637 - Class: 439608 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20080026637. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001]This application claims benefit under 35 U.S.C. .sctn. 119(e) of provisional U.S. patent application No. 60/834,415, filed Jul. 31, 2006, the contents of which are incorporated herein by reference. FIELD OF THE INVENTION [0002]Generally, the invention relates to electrical connector systems. More particularly, the invention relates to a card connector assembly with a mating footprint that is independent of and unaffected by variations in card thickness. BACKGROUND OF THE INVENTION [0003]FIGS. 1A and 1B, respectively, are isometric and side views of an example prior art card assembly 100. As shown, the assembly 100 may include two circuit boards 110, 120 disposed in a parallel arrangement. An interior region 115 is defined between the first and second circuit boards 110, 120. Two vertical connectors 130, 140 connect the first and second circuit boards 110, 120. A first right-angle connector 160 is connected to a side 112 of the first circuit board 110 that faces away from the interior region 115. A second right-angle connector 150 is connected to a side 122 of the second circuit board 120 that faces the interior region 115. [0004]FIG. 2 depicts a prior art card assembly 100 being mated to an electrical device 210. The electrical device 210 includes two vertical connectors 220, 230, each positioned to receive a respective one of the right-angle connectors 150, 160 of the assembly 100. [0005]FIGS. 3A and 3B, respectively, are isometric and side views of an assembly 200 that includes the mezzanine card assembly 100 mated to the device 210. As shown in FIG. 3B, a distance A is defined between the inner side 122 of the circuit board 120 and the inner side 114 of the circuit board 110 (i.e., the sides 114, 122 of the boards 110, 120 that face the interior region 115 of the assembly 100). The distance A may be defined by the height H of the vertical connectors 130, 140. The circuit board 110 may define a thickness B that is equal to a nominal thickness plus or minus a thickness tolerance. The thickness tolerance may be as much as 10%, or more, of the nominal thickness. A distance C may be defined from the inner side 122 of the circuit board 120 and the outer side 112 of the circuit board 110. That is, the distance C may be defined between mounting interfaces 153, 163 of, respectively, the right-angle connectors 150, 160. Thus, the distance C is defined by the distance A (between the inner sides 114, 122 of the circuit boards 110, 120) plus the thickness B of the circuit board 110. [0006]A problem may be that the thickness tolerance of the thickness B of the circuit board 110 may inhibit proper positioning of one or more of the right-angle connectors 150, 160 with respect to the corresponding vertical connectors 220, 230 on the device 210. High mating forces or component damage may result. SUMMARY OF THE INVENTION [0007]A card assembly according to one aspect of the invention may enable mating of a card assembly with an electrical device despite variations in thicknesses of the printed circuit boards of the assembly. Such an assembly may be, for example, a mezzanine assembly or a mezzanine daughtercard assembly. The card assembly may include two spaced-apart circuit boards defining an interior region between the cards. Connectors may be mounted on the circuit boards and be located within the interior region. That is, respective interior sides of the circuit boards may face each other and the interior region. A connector may be mounted on each interior side. [0008]Mounting connectors in the interior region provide an assembly defining a mating footprint that is independent of the respective thicknesses of the spaced-apart printed circuit boards. In this way, the assembly may be mated with an electrical device such as a backpanel (e.g., a backplane, midplane, etc.) without board thickness affecting the mating properties between the assembly and the device. [0009]One embodiment of the invention is an assembly such as, for example, a daughtercard mezzanine assembly, that includes a first circuit board defining a first side and a second circuit board connected to the first circuit board and defining a second side that faces the first side of the first circuit board. A first electrical connector is connected to the first side of the first circuit board and defines a first mating interface for electrical connection to an electrical device. A second electrical connector is connected to the second side of the second circuit board and defines a second mating interface for electrical connection to the electrical device. [0010]An alternative embodiment, for example, is an assembly that includes an electrical device, a first circuit board defining a first side, and a first electrical connector connected to the first side of the first circuit board and to the device. A second circuit board is connected to the first circuit board and defines a second side that faces the first side. A second electrical connector is connected to the second side of the second circuit board and to the device. [0011]Another alternative embodiment, for example, is an assembly that includes a first circuit board having a first board thickness, and a second circuit board positioned a separation distance from the first circuit board, the second circuit board having a second board thickness. A first electrical connector is connected to the first circuit board and defines a first mating interface. A second electrical connector is connected to the second circuit board and defines a second mating interface. The first mating interface and the second mating interface together define a mating footprint of the assembly that is independent of each of the first and the second board thickness. BRIEF DESCRIPTION OF THE DRAWINGS [0012]FIGS. 1A and 1B, respectively, are isometric and side views of an example mezzanine card assembly. [0013]FIG. 2 depicts a mezzanine card assembly being mated to an electrical device. [0014]FIGS. 3A and 3B, respectively, are isometric and side views of a mezzanine card assembly mated to an electrical device. [0015]FIGS. 4A and 4B, respectively, are isometric and side views of an example mezzanine card assembly according to an embodiment of the invention. [0016]FIG. 5 depicts an isometric view of an assembly according to an aspect of the invention that includes a mezzanine card assembly being mated to an electrical device. [0017]FIGS. 6A and 6B, respectively, are isometric and side views an assembly according to an embodiment of the invention that includes a mezzanine card assembly mated to an electrical device. DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS [0018]FIGS. 4A and 4B, respectively, are isometric and side views of an example mezzanine card assembly 300 according to an embodiment of the invention. Such an assembly 300 may be, for example, a mezzanine daughtercard assembly. As shown, the assembly 300 may include two circuit boards 310, 320 disposed in a parallel arrangement. That is, X and Z arrows of FIG. 4A may define an XZ plane, and the printed circuit boards 310 and 320 each may define a plane that is parallel to XZ plane as well as to each other. An interior region 315 is defined between the circuit boards 310, 320. One or more vertical connectors 330, 340 may connect the circuit boards 310, 320. Continue reading... Full patent description for Backplane connector Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Backplane connector patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Backplane connector or other areas of interest. ### Previous Patent Application: Adjustable feed through bushing base Next Patent Application: Differential electrical connector assembly Industry Class: Electrical connectors ### FreshPatents.com Support Thank you for viewing the Backplane connector patent info. IP-related news and info Results in 16.82291 seconds Other interesting Feshpatents.com categories: Electronics: Semiconductor , Audio , Illumination , Connectors , Crypto , |
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