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Assembly with detachably attachable devicesRelated Patent Categories: Metal Working, Method Of Mechanical Manufacture, Electrical Device Making, Conductor Or Circuit Manufacturing, On Flat Or Curved Insulated Base, E.g., Printed Circuit, Etc., Assembling BasesAssembly with detachably attachable devices description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070271778, Assembly with detachably attachable devices. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATIONS [0001] The present application is a divisional application related to a patent application entitled "METHOD AND APPARATUS FOR INSERTING, RETAINING AND EXTRACTING A DEVICE FROM A COMPARTMENT", filed Jan. 12, 2006 and assigned Ser. No. 11/330,858 which application is related to and claims priority to a provisional application entitled "Method and Apparatus for Inserting, Retaining and Extracting a Device from a Compartment", filed Jan. 12, 2005, and assigned Ser. No. 60/643,524, which applications describe an invention by the present inventors and are assigned to the present assignee. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to mating assemblies and, more particularly, to a guide assembly for mechanically supporting and electrically connecting a rail mounted device. [0004] 2. Description of the Related Prior Art [0005] Various mechanical substructures, such as printed wiring boards and other mechanical devices provide support for detachably attached devices of various sorts that are electrically connected to elements attendant the mechanical substructure. No industry standard presently exists for mounting such devices on the mechanical substructure. Accordingly, provisions must be made unique to each device to mount same. Furthermore, the electrical interconnections vary widely in type and usually require manual engagement. The potential for substantial damage due to static electricity to components mounted on the mechanical substructure or components of a device being mounted exists. To dissipate any electrostatic charges, known procedures must be employed but the carrying out of such procedures is sometimes omitted with attendant actual or potential damage to one or more components. SUMMARY OF INVENTION [0006] The present invention relates to guides mounted upon a mechanical substructure for engaging corresponding rails attached to a device to be demountably mounted upon the mechanical substructure. The alignment of the device with components of the mechanical substructure is assured through predetermined interconnection and alignment between the guides and the rails. Such alignment permits mating between electro-mechanical connectors attendant the device and the mechanical substructure. Elements interacting between the guides, mechanical substructure, and rails assure dissipation of any electrostatic charges and zero static potential upon mounting of the device to preclude damage to the electrical components from static electricity. The cooperative engagement between the guides and rails eliminates the need for manual access to make further mechanical or electrical connections and thereby permits a low profile mechanical packaging enclosure commensurate in size with the device to be mounted. The device is retained upon the structure by one or more pivotable lockable handles that may be grasped to insert, lock, unlock and retract the device. [0007] It is therefore a primary objective of the present invention to provide a guide and rail assembly, and an insertion/extraction mechanism for mating and electrically connecting a device to a mechanical substructure. [0008] Another object of the present invention is to provide an industry standard assembly for demountably mounting electro-mechanical devices on a mechanical substructure. [0009] Still another object of the present invention is to provide a mating assembly which dissipates any existing electrostatic charges during the mounting procedure. [0010] Yet another objective of the present invention is to provide a mounting assembly which eliminates the need for manual mechanical connection and manual engagement of mating electrical conductors. [0011] A further object of the present invention is to provide rails attachable to any device, or a housing therefor, for engagement with guides mounted on a mechanical substructure to which the device is to be mechanically and electrically connected. [0012] A yet further object of the present invention is to provide a method for electrostatic dissipation upon mechanical and electrical attachment of a device to a substructure. [0013] A still further object of the present invention is to provide guides attachable to a front panel of a substructure, providing strength to the aligned guides, the substructure, and the device mounted on the guides. [0014] A still further object of the present invention is to provide either one or two pivotable handles secured to a device or housing for manually inserting and retracting the device from within a compartment having a substructure for engaging the device. [0015] A still further object of the present invention is to provide either one or two pivotable handles secured to a device or housing for manually locking and unlocking the device within a compartment having a substructure for engaging the device. [0016] These and other objects of the invention will become apparent to those skilled in the art as the description of the invention proceeds. DESCRIPTION OF THE DRAWINGS [0017] The present invention will be described with greater specificity and clarity with reference to the following drawings, in which: [0018] FIG. 1 illustrates a substructure used as a mounting for various electrical, electro-mechanical and mechanical elements, including illustration of devices mounted thereon and of a device segregated from the substructure and mountable thereon; [0019] FIG. 2 illustrates mounting elements or guides for engaging and supporting devices to be mounted upon the substructure; [0020] FIG. 3 illustrates the guides attached to the substructure; Continue reading about Assembly with detachably attachable devices... Full patent description for Assembly with detachably attachable devices Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Assembly with detachably attachable devices patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Assembly with detachably attachable devices or other areas of interest. ### Previous Patent Application: Ball grid array rework using a continuous belt furnace Next Patent Application: Method for covering a plurality of apertures while accommodating passage of devices Industry Class: Metal working ### FreshPatents.com Support Thank you for viewing the Assembly with detachably attachable devices patent info. 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