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  Assemblies useful for the preparation of electronic components and methods for making sameUSPTO Application #: 20080009211Title: Assemblies useful for the preparation of electronic components and methods for making same Abstract: In accordance with the present invention, assemblies have been developed which are useful for a variety of applications, e.g., in RF applications where low electrical loss products are desirable, e.g., in cellular communications, RF antennas, satellite communications, radar, power amplifiers, high speed digital applications, laminate-based chip carriers, and the like. Invention assemblies comprise a combination of a first reinforced thermoplastic-containing layer and a first non-reinforced thermoplastic-containing layer, wherein the reinforced and non-reinforced thermoplastic-containing layers are capable of forming a bond (e.g., a cohesive or adhesive bond) therebetween, thereby providing performance properties (e.g., electrical performance and cladding bond strength) that are superior to the performance properties of either material alone. The reinforced thermoplastic-containing layer can include a porous substrate impregnated with a composition comprising: a first component (i.e., a low loss, low dielectric constant, hydrocarbyl thermoplastic), a second component (i.e., a component able to crosslink and produce a thermoset in the presence of the first component), and a free radical source. Also provided in accordance with the present invention are methods for preparing the above-described assemblies. (end of abstract) Agent: Foley & Lardner LLP - San Diego, CA, US Inventors: Matthew Raymond Himes, John Charles Frankosky USPTO Applicaton #: 20080009211 - Class: 442181 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20080009211. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001]The present invention relates to assemblies and laminate structures, methods for making same, and uses thereof. Invention assemblies and laminate structures are useful, for example, in the preparation of components used in RF applications, applications where low electrical loss products are required, e.g., in cellular telecommunications, RF antennas, satellite communications, radar, power amplifiers, high speed digital applications, laminate-based chip carriers, and the like. BACKGROUND OF THE INVENTION [0002]Laminate structures employed in cellular telecommunications, laminate-based chip carriers, and the like, must meet a number of physical and electrical performance criteria, e.g., low loss, low dielectric constant, good heat resistance, good dimensional stability, low density, and the like. [0003]Historically, in the production of printed circuit boards used as antennas and other elements of cellular and wireless infrastructure, conventional woven glass laminates based on PTFE (polytetrafluoroethylene) have been utilized. While these are readily and conveniently manufactured using technology well known to those of skill in the art, they tend to be expensive and heavy (having a density of about 2.5). [0004]Thermoplastic resins are commonly used for the preparation of substrates for laminate and prepreg systems. However, thermoplastics frequently have limitations which may preclude their use as a substrate material in foil-clad laminate structures. These limitations may include insufficient thermo-mechanical stability and an inability to form a sufficient bond with the foil cladding. [0005]Thermoplastic materials used in the preparation of laminate and prepreg systems preferably have glass and melt transition temperatures which are higher than the maximum temperatures achieved during processing of the substrate (e.g., the temperature achieved for processing of a printed circuit board). However, such thermoplastic materials are frequently expensive. [0006]Preparation of foil-clad laminate thermoplastic structures is often difficult as it is generally difficult to form a bond between a metal foil and the surface of the substrate. A variety of factors, including molecular composition and structure, may influence the ability to form a foil layer on a thermoplastic substrate surface. [0007]Reinforcement of substrate layer is desirable and known in the art. Preferably, a thermally-resistant reinforcement is added to a thermoplastic polymer to form a composite substrate. One method for adding reinforcement to the substrate includes uniformly blending microfibers into the polymer for the preparation of the substrate. However, the amount of microfiber that may be incorporated into a substrate by this method is limited. [0008]An alternate method for preparing a reinforced substrate is to coat a fabric-like reinforcement with a thermoplastic polymer. However, this method has limitations as this route of preparation may be limited to co-extrusion, which can be difficult to perform with light-weight reinforcements, as are typically required for use with PCB substrates. [0009]In view of the high demand and widespread use of such laminate structures, in addition to meeting the above-described performance properties (i.e., a low dielectric constant, low weight and low loss), it is further desirable that such materials can be prepared from relatively inexpensive starting materials employing readily scalable, low cost processes. The present invention addresses these and other needs as described in greater detail herein. SUMMARY OF THE INVENTION [0010]In accordance with the present invention, there are provided novel assemblies and laminate structures, methods for the preparation thereof, and various uses therefor. Invention materials are useful, for example, in the preparation of components used in RF applications, applications where low electrical loss products are required, e.g., in cellular telecommunications, RF antennas, satellite communications, radar, power amplifiers, high speed digital applications, laminate-based chip carriers, and the like. DETAILED DESCRIPTION OF THE INVENTION [0011]In accordance with one aspect of the present invention, there are provided assemblies comprising: (a) a first reinforced thermoplastic-containing layer and (b) a first non-reinforced thermoplastic layer, wherein the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer are capable of interacting sufficiently so as to form a bond therebetween, wherein said first reinforced thermoplastic-containing layer comprises a porous substrate impregnated with a composition comprising: [0012](a) a first component comprising a low loss, low dielectric constant, hydrocarbyl thermoplastic resin, [0013](b) a second component which is capable of crosslinking to produce a thermoset in the presence of the first component, [0014](c) a free radical source, [0015](d) optionally, one or more additives, and [0016](e) an optional diluent therefore,wherein the resulting impregnated substrate has been subjected, if necessary, to conditions suitable to remove substantially all of the optionally present diluent therefrom. [0017]As employed herein, the term "assembly" refers to a structure comprising at least one reinforced thermoplastic layer and at least one non-reinforced thermoplastic layer for use in the preparation of a multilayer structure. [0018]As employed herein, the term "reinforced thermoplastic-containing layer" (or "prepreg") refers to a porous substrate which is impregnated with a composition which includes a thermoplastic and thermoset resin. Optionally, the thermoset resin is partially cured, and may also include fillers and/or additives. Exemplary reinforced thermoplastic containing layers are described, for example, in U.S. Ser. No. 11/006,211, filed Dec. 6, 2004, which is incorporated by reference herein in its entirety. [0019]As employed herein, the term "porous substrate" refers to a woven or non-woven substrate which can include, but is not limited to, woven glass, non-woven glass, woven aramid fibers, non-woven aramid fibers, woven liquid crystal polymer fibers, non-woven liquid crystal polymer fibers, woven synthetic polymer fibers, non-woven synthetic polymer fibers, randomly dispersed fiber reinforcements, expanded polytetrafluoroethylene (PTFE) structures and combinations of any two or more thereof. Specifically, materials contemplated for use as the "porous substrate" can include, but are not limited to, fiberglass, quartz, polyester fiber, polyamide fiber, polyphenylene sulfide fiber, polyetherimide fiber, cyclic olefin copolymer fiber, polyalkylene fiber, liquid crystalline polymer, poly(p-phenylene-2,6-benzobisoxazole), copolymers of polytetrafluoroethylene and perfluoromethylvinyl ether (MFA) and combinations of any two or more thereof. [0020]As employed herein, "combination," when used to refer to polymers, embraces blends, copolymers, coplanar layers, and the like, of any two or more of the polymer or resin materials. [0021]As employed herein, the term "non-reinforced thermoplastic-containing layer" refers to a substrate which includes a thermoplastic resin and does not include a porous substrate. [0022]As employed herein, the term "thermoplastic polymers" refers to polymers which will repeatedly soften when heated and harden when cooled. In addition, thermoplastic polymers may melt and possibly flow at elevated temperatures. Exemplary thermoplastic polymers suitable for use in the present invention can include, but are not limited to, cyclic olefin copolymers, terpolymers, block copolymers, or combinations of any two or more thereof. [0023]The thermoplastic polymer or resin employed for the reinforced and non-reinforced layers may be the same or may be different. Preferably, the thermoplastic polymers for the reinforced and non-reinforced layers have similar glass transition temperatures and coefficients of thermal expansion. In preferred embodiments, the thermoplastic resin is selected from cyclic olefin copolymers, polyetherimides, polyether ether ketones (PEEKs), liquid crystal polymers (LCPs), polytetrafluoroethlyene, polyphenylenesulfide, polyphenyleneoxide, polyphenylene ether, polymethylpentene (TPX), polypropylene, and polyethylene. [0024]The thickness of the non-reinforced thermoplastic layer can vary widely, typically falling in the range of about 10 up to about 3000 microns or higher. In preferred embodiments, the non-reinforced thermoplastic layer has a thickness of at least 25 microns, up to about 1300 microns. In especially preferred embodiments, the reinforced thermoplastic layer has a thickness of at least 25 microns up to about 400 microns. [0025]As readily recognized by those of skill in the art, the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer can interact to form a bond therebetween in a variety of ways. For example, the layers may interact as a result of having compatible melt solubility properties. Alternatively, the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer are capable of interacting to form an adhesive bond therebetween. As yet another alternative, the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer are capable of interacting to form a mechanical bond therebetween. As still another alternative, the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer interact sufficiently, regardless of the mechanism of interaction, to produce an interlayer peel strength of at least about four pounds per linear inch. Continue reading... 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