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Apparatus to use vapor compression refrigeration in a mobile computing deviceRelated Patent Categories: Refrigeration, Structural Installation, With Electrical Component CoolingApparatus to use vapor compression refrigeration in a mobile computing device description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20050284166, Apparatus to use vapor compression refrigeration in a mobile computing device. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF INVENTION [0001] The field of invention relates generally to heat management and more particularly to heat management using vapor compression refrigeration in a mobile computing device. BACKGROUND [0002] Heat management can be critical in many applications. Excessive heat can cause damage to or degrade the performance of mechanical, chemical, electric, and other types of devices. Heat management becomes more critical as technology advances and newer devices continue to become smaller and more complex, and as a result run at higher power levels and/or power densities. [0003] Modern electronic circuits, because of their high density and small size, often generate a substantial amount of heat. Complex integrated circuits (ICs), especially microprocessors, generate so much heat that they are often unable to operate without some sort of cooling system. Further, even if an IC is able to operate, excess heat can degrade an IC's performance and can adversely affect its reliability over time. Inadequate cooling can cause problems in central processing units (CPUs) used in personal computers (PCs), which can result in system crashes, lockups, surprise reboots, and other errors. The risk of such problems can become especially acute in the tight confines found inside mobile computers and other portable computing and electronic devices. [0004] Prior methods for dealing with such cooling problems have included using heat sinks, fans, and combinations of heat sinks and fans attached to ICs and other circuitry in order to cool them. However, in many applications, including portable and handheld computers, computers with powerful processors, and other devices that are small or have limited space, these methods may provide inadequate cooling. BRIEF DESCRIPTION OF THE DRAWINGS [0005] FIG. 1 presents a diagram of a thermal management cycle, in accordance with one embodiment. [0006] FIG. 2 presents a diagram of a thermal management cycle, in accordance with an alternative embodiment. [0007] FIG. 3 presents an illustration of a vapor compression refrigeration in a mobile computing device, in accordance with an one embodiment. [0008] FIG. 4 presents an illustration of a vapor compression refrigeration in a mobile computing device, in accordance with an alternative embodiment. [0009] FIG. 5 presents an illustration of a vapor compression refrigeration in a mobile computing device, in accordance with an alternative embodiment. [0010] FIG. 6 presents a flow diagram describing a process of using vapor compression refrigeration in a mobile computing device for thermal management, in accordance with one embodiment. DETAILED DESCRIPTION [0011] A method and apparatus to use a compressor in a mobile computing device to increase a pressure and temperature of a working fluid used to absorb heat generated by a heat generating unit of the mobile computer, is described. In one embodiment, the apparatus includes a working fluid loop with the fluid of the loop being in thermal contact with the heat generating device, and the fluid is to pass through a heat exchanger to dissipate heat from the fluid. [0012] In the following description, numerous specific details are set forth. However, it is understood that embodiments may be practiced without these specific details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description. [0013] Reference throughout this specification to "one embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In addition, as described herein, a trusted platform, components, units, or subunits thereof, are interchangeably referenced as a protected or secured. [0014] In one embodiment, as described herein, a refrigerator using a vapor-compression cycle (otherwise known as an inverse Rankine cycle) is used to provide thermal management of a heat generating component within a mobile computer system. FIG. 1, illustrates a cycle diagram in accordance with one embodiment. At the lower pressure 1, the refrigerant passes across/through a cold plate (in contact with a heat generating component) and absorbs heat. The absorption of the heat will take the fluid to that state shown as #2. Although state #2 is shown to be at the saturation point, it can also be within the vapor dome 101 or superheated. [0015] After leaving the cold plate, the vapor is compressed to a higher pressure (to achieve a higher temperature) to state #3. This higher temperature and higher pressure fluid (which can either be vapor and/or liquid) is then passed through a heat exchanger which dissipates heat from the fluid. This lowers the temperature to state #4. Note, state #4 is at the same pressure as state #3, but it is also possible that P4 would be less than P3. The fluid then passes through a throttling device to go back to state #1 and restart the cycle. [0016] Although the cycle shown in FIG. 1 takes place primarily within the vapor dome 101, it is also possible for the cycle to be contained outside of the vapor dome 101 as illustrated in FIG. 2. It is also possible for the cycle to operate entirely above the vapor dome 101 (i.e., super critical condition.) [0017] FIG. 3 illustrates a working fluid loop 114 within a computing device 100 used in conjunction with vapor compression refrigeration to absorb heat of the component 108, in accordance with one embodiment. As illustrated, the fluid of the loop 114 is passed across the component 108, to absorb heat from the component. In one embodiment, working fluid loop 114 passes across or through a cold plate 109 thermally attached to the component 108 to absorb and transfer heat from the cold plate, which may include channels. The heat generating component 108 may include a processor, a chipset, a graphics controller, a memory controller, and other alternative heat generating components. The working fluid may be one of several different types of fluid refrigerant, such as freon, CO.sub.2, etc. [0018] Thereafter, the working fluid and/or vapor are passed through a compressor 102. The compressor increases the pressure of the working fluid and thereby also increases the temperature of the working fluid. The compressor may be any one of a compressor, including a reciprocating compressor, a linear compressor, a Scroll compressor, a WANKEL compressor, a diaphragm compressor, or another type. [0019] The working fluid, which may be vapor after passing through the compressor, is then passed through heat exchanger 116 to dissipate heat. In one embodiment, the fluid vapor passes through a thermally conductive tube of the heat exchanger 116 that may include fins attached to the tube to dissipate the heat from the working fluid and/or the vapor. A heat exchanger fan 110 may be used to blow across the fins to dissipate the heat. The working fluid of the loop 114 returns across the heat generating component 108, as described above. [0020] In one embodiment, after passing through the heat exchanger 116, the working fluid passes through a unit to decrease the pressure of the working fluid. As illustrated in FIG. 4, in one embodiment, the working fluid passes through a throttle device 118 to decrease the pressure of the working fluid prior to the working fluid passing across or through the cold plate 109 thermally attached to the component 108 to absorb and transfer heat from the cold plate. In an alternative embodiment, as illustrated in FIG. 5, a throttle bypass valve 120 may be included along the working fluid loop 114, to bypass the throttle device in the case of the compressor operating at a lower speed, and thereby not increasing the pressure of the working fluid as much as when operating at higher speeds. 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