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Apparatus for forming metal filmUSPTO Application #: 20070151845Title: Apparatus for forming metal film Abstract: An apparatus for metal plating on a substrate with through-holes includes a chamber that the substrate is disposed inside the chamber to be divided into two sections. A pressure generator and a pressure controller are connected to this and correspond to two sides of the substrate respectively. The pressure generator is used for pumping a electrolyte flowed parallel to the surface of the substrate into the chamber. The pressure controller is used for channeling the electrolyte off the chamber and controlling the pressure differences between the two sides of the substrate. So that the electrolyte flowed parallel to the surface of the substrate is pumped by the pressure generator and it passes several through-holes to control the thickness of metal plating on the.substrate and inner walls of the through-holes. (end of abstract) USPTO Applicaton #: 20070151845 - Class: 204237000 (USPTO) Related Patent Categories: Chemistry: Electrical And Wave Energy, Apparatus, Electrolytic, Cells With Electrolyte Treatment Means, Recirculation
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