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  Apparatus for electroprocessing a substrate with edge profile controlUSPTO Application #: 20080035474Title: Apparatus for electroprocessing a substrate with edge profile control Abstract: Embodiments of the invention generally provide methods and apparatuses for electroprocessing a substrate. In one embodiment, an apparatus for electrochemically processing the substrate includes a conductive processing surface adapted for processing a substrate thereon, and a polishing head for retaining the substrate against the processing surface. At least one drive mechanism provides relative motion between the conductive processing surface and the substrate. A first electrode is disposed below the conductive processing surface and is comprised of a first material. A second electrode is disposed radially inward of the first electrode and comprised of a second material. (end of abstract) Agent: Patterson & Sheridan, LLP - Houston, TX, US Inventors: You Wang, Jie DIAO, Stan D. TSAI, Lakshmanan Karuppiah USPTO Applicaton #: 20080035474 - Class: 204242000 (USPTO) Related Patent Categories: Chemistry: Electrical And Wave Energy, Apparatus, Electrolytic, Cells The Patent Description & Claims data below is from USPTO Patent Application 20080035474. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional of U.S. patent application Ser. No. 11/483,843 filed on Jul. 7, 2006, which is incorporated by reference herein. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] Embodiments of the invention generally relate to profile control for electroprocessing substrates. [0004] 2. Description of the Related Art [0005] Electrochemical Mechanical Polishing (ECMP) is a technique used to remove conductive materials from a substrate surface by electrochemical dissolution while concurrently polishing the substrate with reduced mechanical abrasion as compared to conventional Chemical Mechanical Polishing (CMP) processes. Electrochemical dissolution is performed by applying a bias between a cathode and a substrate surface to remove conductive materials from the substrate surface into a surrounding electrolyte. The bias may be applied to the substrate surface by a conductive contact disposed on or through a polishing material upon which the substrate is processed. A mechanical component of the polishing process is performed by providing relative motion between the substrate and the polishing material that enhances the removal of the conductive material from the substrate. [0006] Profile control in some electroprocessing apparatuses has been generally realized by creating a plurality of process cells or zones across the width of the substrate being processed. By controlling the electrical bias or current flow between the individual cells, the rate of removal or deposition of conductive material on the substrate may be controlled. [0007] However, control of the processing rate at the edge of the substrate has presented a significant challenge. As the electric potential of the electrolyte adjacent to the substrate has a greater (more negative) potential relative to the electrolyte located between the substrate and the electrode that defines a process cell, the voltage gradient is high at the edge of the substrate. The high voltage gradient may cause greater current densities, and thus faster processing at the edge of the substrate. Uncontrolled fast edge processing is generally undesirable because of the resulting reduction in the usable substrate area for device fabrication. Thus, it would be desirable to improve profile control of an electroprocess such that the area near the edge of the substrate would have material removal rates that could be controlled for fast edge polishing, as well as for slow edge polishing where desirable. [0008] Thus, there is a need for an improved method and apparatus for electroprocessing. SUMMARY OF THE INVENTION [0009] Embodiments of the invention generally provide methods and apparatuses for electroprocessing a substrate. In one embodiment, an apparatus for electrochemically processing the substrate includes a conductive processing surface adapted for processing a substrate thereon, and a polishing head for retaining the substrate against the processing surface. At least one drive mechanism provides relative motion between the conductive processing surface and the substrate. A first electrode is disposed below the conductive processing surface and is comprised of a first material. A second electrode is disposed radially inward of the first electrode and comprised of a second material. [0010] In another embodiment, a method of electroprocessing a substrate includes biasing a conductive processing surface, contacting a substrate to the biased conductive processing surface, biasing a first electrode to establish a first electroprocessing zone between the first electrode and the substrate and biasing a second electrode to establish a second electroprocessing zone, wherein the second electrode is radially disposed inward of the first electrode, fabricated from a different material and biased at different potentials. [0011] In another embodiment, a method of electroprocessing a substrate includes detecting an incoming thickness profile of a substrate, selecting a polishing rate profile in response to the incoming thickness profile, biasing a first electrode to establish a first electroprocessing zone between the first electrode and the substrate based on the incoming profile, and biasing a second electrode disposed radially inward of the first electrode with a potential different than the first electrode to establish a second electroprocessing zone between the second electrode and the substrate, wherein the first electrode and the second electrode are comprised of different materials. BRIEF DESCRIPTION OF THE DRAWINGS [0012] So that the manner in which the above recited features, advantages and objects of the present invention are attained and can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. [0013] It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments. [0014] FIG. 1 illustrates a plan view of a substrate processing system; [0015] FIG. 2 illustrates a vertical sectional view of an embodiment of an ECMP station; [0016] FIG. 3A illustrates a bottom view of an electrode assembly; [0017] FIG. 3B illustrates a bottom view of another electrode assembly; and [0018] FIG. 4 illustrates an embodiment of a method for electroprocessing substrates. [0019] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is also contemplated that features from one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION Continue reading... Full patent description for Apparatus for electroprocessing a substrate with edge profile control Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Apparatus for electroprocessing a substrate with edge profile control patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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