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  Apparatus and process for cylindrically grinding workpiecesRelated Patent Categories: Abrading, Abrading Process, Combined AbradingThe Patent Description & Claims data below is from USPTO Patent Application 20060281394. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention generally relates to cylindrical grinding apparatuses and processes and, more particularly, to a holder for holding workpieces during a cylindrically grinding process and a holding method for such a process. [0003] 2. DISCUSSION OF THE RELATED ART [0004] Usually, optical elements such as camera lenses and spectacles are in used in cylindrical form. However, original optical workpieces (i.e. lens blanks) are most easily manufactured in the form of a square. Therefore, these original optical workpieces have to be cylindrically ground before use. [0005] A typical example of a contemporary cylindrical grinding apparatus is a centering apparatus. The centering apparatus typically includes a pair of holders for holding the original workpiece, where each holder has a hollow chamber communicating with a surface of the holder. The holder can hold the workpiece on its surface by using an air pump pumping the hollow chamber, a grinding wheel is then used to cylindrically grind the workpiece. However, the centering apparatus can only cylindrically grind one piece of workpiece at a time. [0006] FIGS. 6-7 show an apparatus for cylindrically grinding more than one workpiece at a time. The apparatus includes a first holding tool 30 and a second holding tool 40. The first holding tool 30 defines a holding groove 32, and the second holding tool 40 defines a semicircular groove 42. The holding groove 32 and the semicircular groove 42 are both for securing the workpieces 50 in the holding tools 30, 40. In use, firstly, a plurality of workpieces 50 are placed in the holding groove 32 of the first holding tool 30. Secondly, the workpieces 50 are bonded together using adhesive. Thirdly, a grinding wheel is used to grind a portion of the workpieces 50 projecting out of the holding groove 32 into a semicircular shape. Fourthly, the semicircular portion 51 of the workpieces 50 is transferred to the semicircular groove 42 of the second holding tool 40. Fifthly, the other portion of the workpieces 50 is also ground into a semicircular shape using the grinding wheel. The final result being that the workpieces 50 are ground to a cylindrical shape. [0007] When transferring the workpieces 50 from the first holding tool 30 to the second holding tool 40, the adhesive should be dissolved so that the workpieces 50 can be taken out of the first holding tool 30. However, the workpieces 50 will not be compact in the second holding tool 40 because the workpieces 50 will be disarrayed whilst the adhesive is dissolved. [0008] Therefore, an apparatus and a process for cylindrically grinding workpieces which can easily and compactly transfer the workpieces is desired. SUMMARY OF THE INVENTION [0009] In one aspect, an apparatus for cylindrically grinding workpieces includes a first holding tool for positioning pre-grinding workpieces and a second holding tool for positioning partially ground workpieces (i.e. workpieces which have been ground on one side only). The first holding tool defines a first groove for containing the pre-grinding workpieces to be partially ground and the second bonding defines a second groove for containing the partially ground workpieces. A stopping board connects one side of the second groove, and the stopping board has a projection for transferring the partially ground workpieces from the first groove to the second groove. [0010] In another aspect of the preferred embodiment, a process for grinding workpieces can be used wherein a plurality of pre-grinding workpieces are positioned in a first groove of a first holding tool with a first portion of the pre-grinding workpieces projecting out of the first groove. The first portion of the pre-grinding workpieces is partially ground into a first predetermined shape. A second holding tool is provided, the second holding tool defining a second groove and a stopping board connecting to one side of the second groove, the stopping board having a projection. The second holding tool is then placed on the partially ground workpieces with the first portion in the second groove. The second holding tool is then moved with the projection pushing the workpieces a predetermined distance. The position of the two holding tools is then reversed, with the first holding tool being placed on the second holding tool. The first holding tool is then moved until the partially ground workpieces completely leave the first groove, a second portion of the workpieces then projects out of the second groove, this second portion is then ground into a second predetermined shape thus completing the grinding process. [0011] Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS [0012] Many aspects of the apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. [0013] FIG. 1 is a schematic view of a first holding tool of an apparatus for cylindrically grinding workpieces in accordance with a preferred embodiment; [0014] FIG. 2 is a schematic view of a second holding tool of the apparatus for cylindrically grinding workpieces in accordance with a preferred embodiment; [0015] FIG. 3 is a schematic view of a step of the process for cylindrically grinding workpieces in accordance with a preferred embodiment; [0016] FIG. 4 is a schematic view of another step subsequent to the step in FIG. 3; [0017] FIG. 5 is a schematic view of a further step subsequent to the step in FIG.4; [0018] FIG. 6 is a schematic view of a first holding tool for cylindrically grinding workpieces from the prior art; and [0019] FIG. 7 is a schematic view of a second holding tool for cylindrically grinding workpieces from the prior art. DETAILED DESCRIPTION OF THE EMBODIMENT [0020] Referring to FIGS. 1-2, in a preferred embodiment, an apparatus for cylindrically grinding workpieces 60, includes a first holding tool 100, a second holding tool 200, and a grinding wheel 300. The holding tools 100, 200 are configured for bonding workpieces 60. Continue reading... Full patent description for Apparatus and process for cylindrically grinding workpieces Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Apparatus and process for cylindrically grinding workpieces patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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