| Apparatus and method of cleaning a sustrate -> Monitor Keywords |
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Apparatus and method of cleaning a sustrateRelated Patent Categories: Cleaning And Liquid Contact With Solids, Liquid Treating Forms And Mandrels, Including Application Of Electrical Radiant Or Wave Energy To Work, Semiconductor CleaningApparatus and method of cleaning a sustrate description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060207631, Apparatus and method of cleaning a sustrate. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a Divisional Application of U.S. Ser. No. 11/078,728, filed on Mar. 14, 2005, which is in turn a Divisional Application of U.S. Ser. No. 10/050,161, filed on Jan. 18, 2002, which claims priority from Japanese Patent Applications 2001-016964, filed on Jan. 25, 2001. The entire contents of each of the aforementioned applications are incorporated herein by reference FIELD OF THE INVENTION [0002] The present invention relates to a method and apparatus for cleaning a substrate, such as a semiconductor substrate. BACKGROUND ART [0003] When an interconnection pattern is formed on a semiconductor substrate during the course of manufacture of a semiconductor device, a resist pattern is formed on a metal film; e.g., Al or Cu. The semiconductor substrate is subjected to plasma etching via the resist pattern, thus forming an interconnection pattern. [0004] In association with an increase in the packing density of a device, a sidewall protection film for protecting sidewalls of a pattern during plasma etching is formed thickly, thus improving a geometry into which the metal film is to be etched. In this case, an altered resist layer resulting from plasma etching of a pattern, such as an Al or Cu interconnection, tends to become more difficult to remove during a removal process subsequent to the plasma etching process. [0005] FIG. 7 is a conceptual drawing of a cross section of a pattern for describing the tendency. A resist layer 73 adhering to the side surfaces of an aluminum interconnection pattern 72 on a substrate 71 acts as a sidewall protection film. Concurrently, an altered resist layer 75 adheres also to the sidewalls of a resist pattern 74. [0006] In order to eliminate the resist after etching, the altered resist layer 75 has hitherto been removed by means of a wet etching method. However, there still remain residues of the altered layer that cannot be removed by the solubility of the resist in a chemical. [0007] Alternatively, a single wafer processing cleaner has hitherto been employed. FIG. 8 is a conceptual drawing of an example of such a processing cleaner. In the cleaner, a substrate 82 to be cleaned is placed on top of a rotary stage 81, and chemicals are dropped from a chemical drop nozzle 83 onto the substrate 82. In the case of such a rotary method, structural limitations are imposed on introduction of ultrasonic cleaner for improving the removal. [0008] The present invention has been conceived to solve the drawbacks of the related-art cleaning technology as described above. To this end, there is adopted a dipping method of introducing a chemical into a processing bath. A substrate to be cleaned is immersed in the chemical and exposed to ultrasonic waves, thereby improving a cleaning effect and promoting removal of an altered resist layer adhering to the substrate. SUMMARY OF THE INVENTION [0009] According to one aspect of the present invention, a substrate cleaning apparatus comprises: a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator disposed in the processing bath and immersed in the cleaning chemical, and a retainer for retaining a substrate to be immersed in the cleaning chemical such that ultrasonic waves originating from the ultrasonic oscillator are radiated onto a back surface of the substrate. [0010] In another aspect, the ultrasonic oscillator has a plurality of oscillation sources disposed in a dispersed manner. [0011] In another aspect, the substrate cleaning apparatus further comprises a rotary mechanism for rotating the substrate retained by the retainer. [0012] In another aspect, the substrate cleaning apparatus further comprises propagation control apparatus for scattering or damping ultrasonic waves originating from the ultrasonic oscillator. [0013] In another aspect, in the substrate cleaning apparatus, the propagation control apparatus is constituted by means of placing, in a propagation path of ultrasonic waves, a plate-like member having a plurality of openings selectively formed therein. [0014] In another aspect, the propagation control apparatus includes jet nozzles for squirting a chemical in the propagation path of ultrasonic waves, thus circulating a flow of chemical. [0015] According to another aspect of the present invention, in a substrate cleaning method, a substrate whose surface has been processed is immersed in a cleaning chemical filled in a processing bath, and ultrasonic waves are radiated onto a back surface of the substrate, thereby cleaning a front surface of the substrate. [0016] Other and further objects, features and advantages of the invention will appear more fully from the following description. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1 is a cross-sectional view schematically showing a configuration of a substrate cleaning apparatus according to a first embodiment of the present invention. [0018] FIG. 2 depicts a preferred example of the ultrasonic oscillator, showing an example layout in which the radiators are arranged on the surface of the ultrasonic oscillator. [0019] FIG. 3 is a cross-sectional view schematically showing a construction of a substrate cleaning apparatus according to a second embodiment of the present invention. [0020] FIG. 4 is a cross-sectional view schematically showing a construction of a substrate cleaning apparatus according to a third embodiment of the present invention. Continue reading about Apparatus and method of cleaning a sustrate... Full patent description for Apparatus and method of cleaning a sustrate Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Apparatus and method of cleaning a sustrate patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Apparatus and method of cleaning a sustrate or other areas of interest. ### Previous Patent Application: Device for cleaning cvd device and method of cleaning cvd device Next Patent Application: Dishwasher and controlling method thereof Industry Class: Cleaning and liquid contact with solids ### FreshPatents.com Support Thank you for viewing the Apparatus and method of cleaning a sustrate patent info. 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