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Andreas Huber patents

Recent bibliographic sampling of Andreas Huber patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):



04/03/14 - 20140095121 - Transferring heat through an optical layer of integrated circuitry
A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional...
Inventors: Harry Barowski, Thomas Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, Jonas R. Weiss (International Business Machines Corporation)

11/15/12 - 20120290999 - Optimized semiconductor packaging in a three-dimensional stack
A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery...
Inventors: Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper (International Business Machines Corporation)

07/26/12 - 20120189243 - Transferring heat through an optical layer of integrated circuitry
An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink....
Inventors: Harry Barowski, Thomas Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, Jonas R. Weiss (International Business Machines Corporation)

05/03/12 - 20120106074 - Heat sink integrated power delivery and distribution for integrated circuits
A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling...
Inventors: Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper (International Business Machines Corporation)

05/03/12 - 20120105145 - Thermal power plane for integrated circuits
A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling...
Inventors: Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper (International Business Machines Corporation)

05/03/12 - 20120105144 - Optimized semiconductor packaging in a three-dimensional stack
A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery...
Inventors: Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper (International Business Machines Corporation)

04/09/09 - 20090091401 - Method and apparatus for facilitating signal transmission using differential transmission lines
The illustrative embodiments described herein provide an apparatus and method for facilitating signal transmission using differential transmission lines. The apparatus includes a first differential transmission line. The first differential transmission line includes a first plurality of conductors. The first plurality of conductors includes a set of conductors. The apparatus also...
Inventors: Daniel Douriet, Anand Haridass, Andreas Huber, Colm Brian O'reilly, Roger Donell Weekly

International Business Machines Corporation

Archived*
(*May have duplicates - we are upgrading our archive.)

20120290999 - Optimized semiconductor packaging in a three-dimensional stack


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The bibliographic references displayed about Andreas Huber's patents are for a recent sample of Andreas Huber's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Andreas Huber filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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