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  Agitated wet process machineUSPTO Application #: 20070221330Title: Agitated wet process machine Abstract: An agitated wet process machine comprises a delivery system and many jets. The delivery system comprises a delivery belt and many rollers, wherein the rollers on the upper side or the lower side of the delivery belt are used to deliver workpieces. Many blades are added on each of the rollers to agitate a chemical solution. The jets above and below the delivery belt are used to spray or supply the chemical solution to the workpieces. (end of abstract) Agent: Rosenberg, Klein & Lee - Ellicott City, MD, US Inventor: Shih-Chang Chang USPTO Applicaton #: 20070221330 - Class: 15634517 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20070221330. Brief Patent Description - Full Patent Description - Patent Application Claims
RELATED APPLICATIONS [0001]The present application is based on, and claims priority from, Taiwan Application Serial Number 95109941, filed Mar. 22, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety. BACKGROUND [0002]1. Field of Invention [0003]The present invention relates to a machine for wet process. More particularly, the present invention relates to an agitated wet process machine. [0004]2. Description of Related Art [0005]Because of the rapid development in high technology and an increased demand for light and easy to use products, light, thin, small and portable electronic products are becoming the most popular products. Because electronic products are getting smaller, the internal volume of electronic products containing printed the circuit boards is also getting smaller. Therefore, there is a need to develop high-density printed circuit boards containing more circuits in a smaller area. [0006]Line widths and line spaces on general printed circuit boards are about 4-6 mil. (1 mil.=0.025 nm). On high-density printed circuit boards, line widths and line spaces are about 1 mil. Because the line widths and the line spaces on high-density printed circuit boards are narrower than those on general printed circuit boards, the process quality requirement for high-density printed circuit boards is stricter than that for general printed circuit boards. [0007]In the printed circuit wet processes, both the developing process and the etching process are important for the line widths and the line spaces of printed circuit boards. However, there is a serious water-retention problem, which limits recent manufacturing processes to manufacture high-density printed circuit boards which have narrower line widths and line spaces than general printed circuit boards. SUMMARY [0008]It is therefore an aspect of the present invention to provide an agitated wet process machine, which can eliminate the problem of water-retention in the wet process and thus increase the quality of wet processes, including the developing and etching processes. [0009]In accordance with the foregoing and other aspects of the present invention, an agitated wet process machine is provided. The agitated wet process machine comprises a delivery system and many jets. The delivery system comprises a delivery belt, many rollers and many blades. The rollers are located on the upper side or the lower side of the delivery belt to deliver workpieces on the delivery belt. The blades are on each roller to agitate a chemical solution. The jets are located above and below the delivery belt and are used to spray or supply the chemical solution to the workpieces. [0010]In accordance with the foregoing and other aspects of the present invention, an agitated wet process machine is provided. The agitated wet process machine comprises a delivery system and many jets. The delivery system comprises a delivery belt, many rollers and many blades. The rollers are located on the upper side or the lower side of the delivery belt to deliver workpieces on the delivery belt. The blades are on each roller to agitate a chemical solution. There is a distance between the blades and fringes of the rollers. The jets are located above and below the delivery belt and are used to spray or supply the chemical solution to the workpieces. [0011]In accordance with the foregoing and other aspects of the present invention, a process employing the agitated wet process machine is provided. Firstly, many workpieces below many jets are delivered. Then, a chemical solution is sprayed to the workpieces to process them. Finally, the chemical solution is agitated to increase the processing efficiency. [0012]In conclusion, the invention adds blades on the rollers in the traditional wet process machine. When the roller rotates, the blades on the rollers can bring a fresh chemical solution into the processing region and bring the processed chemical solution out of the processing region. The blades on the rollers thus can increase the mobility of the chemical solution. The chemical solution no longer accumulates around the rollers. Therefore, the invention not only solves the problem of water-retention but also increases the quality and the efficiency of the wet process. The number of the blades, the shape of the blades, the distance between the blades and fringes of the rollers and the position of the jets in the invention all can be adjusted to meet any special requirements for different processes. Moreover, the invention not only can be employed in the developing and etching processes of printed circuit boards to increase the manufacturing precision but can also be employed in other chemical processes which have requirements to increase the process precision. BRIEF DESCRIPTION OF THE DRAWINGS [0013]The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings, [0014]FIG. 1 is a cross-sectional side view of a printed circuit board; [0015]FIG. 2 is a structural diagram of traditional wet process machine; [0016]FIG. 3 is a diagram to indicate the chemical solution-discharging route; [0017]FIG. 4 is a structural diagram of an agitated wet process machine according to one preferred embodiment of this invention; [0018]FIG. 5 is a diagram to explain the function and movement of the rollers; [0019]FIG. 6 is a structural diagram of a roller according to one preferred embodiment of this invention; and [0020]FIG. 7 is a structural diagram of a roller according to another preferred embodiment of this invention. Continue reading... Full patent description for Agitated wet process machine Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Agitated wet process machine patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Agitated wet process machine or other areas of interest. ### Previous Patent Application: Apparatus and method for distributing a liquid onto a surface of an item Next Patent Application: Hybrid plasma reactor Industry Class: Adhesive bonding and miscellaneous chemical manufacture ### FreshPatents.com Support Thank you for viewing the Agitated wet process machine patent info. IP-related news and info Results in 0.73088 seconds Other interesting Feshpatents.com categories: Canon USA , Celera Genomics , Cephalon, Inc. , Cingular Wireless , Clorox , Colgate-Palmolive , Corning , Cymer , |
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