| Additive for copper plating and process for producing electronic circiut substrate therewith -> Monitor Keywords |
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  Additive for copper plating and process for producing electronic circiut substrate therewithUSPTO Application #: 20080087549Title: Additive for copper plating and process for producing electronic circiut substrate therewith Abstract: The additive for copper plating can fill through holes or via holes at a micron or sub-micron level even in a case where it consists of one component, and the copper plating solution using the additive for copper plating can be prepared and handled extremely easily and can stably fill the through holes or via holes for a long time. (wherein R′ represents a lower alkyl group)], a copper plating solution formed by adding the additive for copper plating to a copper plating solution containing a copper ion ingredient and an anion ingredient, and a method of manufacturing on an electronic circuit substrate having a fine copper wiring circuit, which comprises electroplating in the copper plating solution using as the cathode an electronic circuit substrate in which fine microholes or microgrooves in the shape of an electronic circuit are formed on the surface. and Y represents a lower alkyl group, lower alkoxy group, nitro group, amino group, sulfonyl group, cyano group, carbonyl group, 1-pyridyl group, or the formula (VIII): [wherein X represents a group selected from the following groups (II)-(VII): An additive for copper plating comprising, as an effective ingredient, a nitrogen-containing biphenyl derivative represented by the following formula (I): (end of abstract) Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. - Alexandria, VA, US Inventors: Hiroshi Ishizuka, Nobuo Sakagawa, Ryoichi Kimizuka, Wei-ping Dow USPTO Applicaton #: 20080087549 - Class: 205125 (USPTO)
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