Abrasive tool making process, material, or composition inventions 02/06

20060037251 - Polishing medium for chemical-mechanical polishing, and method of polishing substrate member: This invention provides a polishing medium for chemical-mechanical polishing, comprising an oxidizing agent for a conductor, a protective-film-forming agent for protecting a metal surface, an acid, and water; (1) the polishing medium having a pH of 3 or less, and the oxidizing agent being in a concentration of from 0.01...

20060032146 - Polmer-coated particles for chemical mechanical polishing: The polishing composition is suitable for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. The polishing composition includes abrasive particles in a liquid media. The abrasive particles have a particle core, the particle core having a hardness and a polymeric shell physisorbed to and encapsulating the particle core. The...

20060032148 - Method of manufacturing polishing slurry for use in precise polishing process: An abrasive and a dispersion medium are introduced into a dispersing machine to uniformly disperse the abrasive. The liquid to be processed after dispersion is centrifugally classified by a centrifugal classifier to remove heavy particles which will cause scratches. Chemicals are added to the liquid to be processed after classification...

20060032147 - Method of preparing slurry composition for chemical mechanical polishing: A method of preparing polishing particles by baking unmilled cerium compound in an environment having a temperature in a range between about 400-700° C., and without dropping the temperature in the environment, applying thermal stress to the resultant cerium oxide in-situ by heating the environment to a temperature in a...

20060032149 - Polishing slurry, method of producing same, and method of polishing substrate: Disclosed is a polishing slurry, particularly, a slurry for chemical mechanical polishing, which is used in a chemical mechanical polishing process for flattening a semiconductor laminate. More particularly, the present invention provides a method of producing a slurry which has high removal selectivity to a nitride layer used as a...

20060032150 - Method for producing improved cerium oxide abrasive particles and compositions including such particles: Provided are methods for manufacturing improved cerium oxide abrasives suitable for forming slurry compositions suitable for CMP processes. The cerium oxide abrasives are produced by the heat treatment of a mixture of a cerium precursor compound and an impurity metal compound under conditions that produce primary cerium oxide particles that...

20060026904 - Composition, coated abrasive article, and methods of making the same: A composition is made by a method in which a composition comprising a polymerizable compound, a curative, and a hydrolyzable silane coupling agent is combined with water, and the composition is allowed to age. The composition is useful in the manufacture of coated abrasive articles....

20060026905 - Preparation of coated abrasive disk: A coated abrasive disk having an improved dimensional stability, high adhesion strength and high breaking strength is prepared by combining together (A) a nonwoven fabric, (B) at least one textile made of microfibers in a pre-dried state after impregnation-treatment with an adhesive resin, and (C) a coated abrasive body comprised...

20060026906 - Versatile system for conditioning slurry in cmp process: The present invention provides a system (100) for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (140). The system provides a first slurry component (108), and a second slurry component (120). A conditioning component (102) has first and second inlets, and an outlet operatively coupled to...

20060021285 - Ceramics, and methods of making and using the same: Ceramics (including glasses and glass-ceramics) comprising nitrogen, and methods of making the same....