Abrading inventions

20080108280 - Initial position setting method of grinding wheel in vertical double disc surface grinding machine: The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously by rotation-driving a pair of grinding wheels by a grinding wheel rotation... Agent: Crowell & Moring LLP Intellectual Property Group

20080108281 - Slurry blasting apparatus for removing scale from sheet metal: An apparatus and method of removing scale from the surfaces of processed sheet metal employs a scale removing medium propelled by counter-rotating pairs of wheels positioned in close proximity to the sheet metal surfaces.... Agent: Thompson Coburn, LLP

20080108279 - Control system and method for processing jewelry and the like: A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated with each translational and rotational degree... Agent: Gordon & Rees LLP

20080108282 - Method for manufacturing fuel cell metallic separator: A metallic separator according to a first embodiment is formed by obtaining a blank by rolling a metallic material having conductive inclusions, and removing a surface of the blank by 2% or more of the thickness of the blank. A metallic separator according to a second embodiment is formed by... Agent: Arent Fox LLP

20080108283 - Tire uniformity machine grinding assembly: A grinding assembly contacts a tire supported by a frame relative to the tire. The grinding assembly includes at least one section, and an axial positioning assembly supporting the at least one section. The axial positioning assembly enables the at least one section to be axially repositioned relative to the... Agent: Edward G. Greive, Esq. Renner, Kenner, Greive, Bobak, Taylor & Weber

20080108284 - Assembly for grinding electrodes: A device for grinding welding electrodes comprises a driving motor, a shaft driven by said driving motor and a grinding wheel driven by said driving motor through said shaft, said grinding wheel having a first and a second grinding surface. A first guiding block is provided having at least one... Agent: Law Offices Silber & Fridman

20080108285 - Multi-bladed razor cartridge sharpener with aloe vera gel lubricant: Apparatus for sharpening and or honing a multi-bladed razor cartridge including a sharpening member, a housing to secure the sharpening member. An aloe Vera or soap solution dispenser provides a lubricant to the sharpening member to lubricate the razor and a housing to limit the travel of the razor on... Agent: Buhler Associates Buhler, Kirk A.

20080108286 - Carrier plate holding an abrading element and abrading plate: The invention concerns a carrier plate (2) holding an abrading element, for detachable mounting on a rotatably mounted abrading plate (1) driven during use, for abrading stone or concrete floors, which carrier plate (2) has sides (2a, 2b) which form an acute angle with each other. The sides (2a, 2b)... Agent: Merchant & Gould Pc

20080108287 - Fixture for grinding machines: A fixture for grinding machines includes a first base (10), a second base (20) and a driving component (40). The first base defines a first working groove (11) therein. The second base defines a second working groove (21) corresponding to the first working groove therein. The driving component is configured... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080108288 - Conductive polishing article for electrochemical mechanical polishing: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080102732 - Carrier head for workpiece planarization/polishing: An edge control system for deployment on a CMP carrier head comprising a bladder and a carrier head housing having a passage extending therethrough. The bladder includes a flexible diaphragm and is coupled to the carrier head housing. The edge control system comprises first and second annular ribs, each of... Agent: Ingrassia Fisher & Lorenz, P.C.

20080102736 - Method for machining rotary parts: In a method for machining rotation pieces, including at least one working step, and wherein at least one surface of the workpiece which is clamped in the device is subjected to a grinding step, at least one front-sided boring is carried out in the workpiece in the same clamping device... Agent: Jordan And Hamburg LLP

20080102737 - Pad conditioning device with flexible media mount: A method and apparatus for conditioning is provided. In one embodiment, a conditioning disk includes a plurality of conditioning elements each having an abrasive working surface, and a flexible foundation having the conditioning elements coupled thereto. The flexible foundation has physical properties that retain the working surfaces in a substantially... Agent: Patterson & Sheridan, LLP

20080102733 - Apparatus for grinding and/or finishing a workpiece: The invention relates to a device (2) for grinding and/or finishing a workpiece (8) mounted on and/or in a workpiece mounting (22, 28). The workpiece (8) and the workpiece mounting (22, 28) may be set in an oscillating movement (86) by means of a drive device (60, 108) and form... Agent: Brinks Hofer Gilson & Lione

20080102734 - Polishing pad assembly with glass or crystalline window: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a... Agent: Fish & Richardson P.C.

20080102735 - Concentrated abrasive slurry compositions, methods of production, and methods of use thereof: Concentrated slurry compositions for use in loose-abrasive machining processes, particularly concentrated abrasive slurries for use in wire saw processes. These concentrated slurry compositions comprise abrasive particles uniformly and stably dispersed in a vehicle. The concentrated slurry compositions are easily converted to working slurry compositions by simple dilution and mixing with... Agent: Edwards Angell Palmer & Dodge LLP

20080102738 - Method and system of using offset gage for cmp polishing pad alignment and adjustment: A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a... Agent: Hitt Gaines, PC Lsi Corporation

20080102739 - Pneumatic grinder with improved handle structure: A pneumatic grinder with improved handle structure comprising a driving portion, a connecting portion, and a grinding portion wherein the connecting portion has a handle fixing portion at one side thereof that has an accommodating space to receive a pivot element wherein the handle fixing portion has a slot on... Agent: Rosenberg, Klein & Lee

20080102740 - Pad for preventing axial shift for use in grinding of eyeglass lens coated with fluorine: The problem is solved by a pad for preventing axial shift for use in grinding of a eyeglass lens coated with fluorine comprising a laminate containing a first pressure-sensitive adhesive layer, an elastic material layer, an adhesive layer, a resin film and a second pressure-sensitive adhesive layer, the elastic material... Agent: Birch Stewart Kolasch & Birch

20080102741 - Single-layer polishing pad: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities... Agent: Pai Patent & Trademark Law Firm

20080096466 - Method and apparatus for cooling lens edge during dry processing: A method and apparatus for processing a periphery of a lens includes holding the lens to be processed, providing at least one edge processing system, disposing the at least one edge processing system and the periphery of the lens proximal one another in a processing position, dry edging the periphery... Agent: Buchanan, Ingersoll & Rooney PC

20080096467 - Stepped retaining ring: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion... Agent: Fish & Richardson P.C.

20080096470 - Chemical mechanical polishing slurry, its preparation method, and use for the same: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have... Agent: Davidson Berquist Jackson & Gowdey LLP

20080096471 - Concrete block splitting and pitching apparatus and method: An apparatus for splitting a concrete block and pitching at least one edge of the split concrete block is provided. The apparatus includes a splitting blade have a blade edge, such as a sharpened edge or a dull edge. The splitting blade is configured to move in a first direction... Agent: Mr. Christopher John Rourk Jackson Walker LLP

20080096473 - Grinding machine and coolant supplying method therefor: In a rough grinding step the large quantity of coolant supplied to cool the grinding point enables the flow to pass through a wheel-following air layer and reach the grinding point while the supply of an air jet is stopped during this step. At a fine grinding step, the grinding... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080096475 - Polishing composition and polishing method:

20080096476 - Portable, flexible abrasive blasting container: A portable, flexible abrasive blasting container that is easily transportable and accommodates larger work pieces has a frameless, flexible containment assembly, and a support member to support the assembly and work piece. The blasting container is under positive pressure relative to the outside atmosphere. The containment assembly may be located... Agent: Michael L. Leetzow, Esq. Michael L. Leetzow, P.A.

20080096468 - Single-step fiber grinding process and apparatus: A fiber grinding process includes: contacting an end of the optical fiber with a grinding surface in such a manner that a central axis of the optical fiber at the end is inclined to the grinding surface; rotating the optical fiber about the central axis; and changing a contact pressure... Agent: Darby & Darby P.C.

20080096469 - Method and device for strip and flat-shaping machining surfaces of glass panes: The removal of partial areas of a coating (11, 12) on at least one surface (37, 38) of a glass pane (2) takes place by means of a plasma jet (14, 15) which emerges from a plasma nozzle (5, 6). The plasma nozzle (5, 6) is part of a plasma... Agent: Notaro And Michalos

20080096472 - Elastic roller and method of grinding the same: An elastic roller comprises an elastic layer 1 carried on the outer circumference of a shaft 2 via adhesive agent, and an unapplied area of adhesive agent at one end of the elastic layer in the longitudinal direction of the roller. The surface of the elastic layer is ground by... Agent: Sughrue Mion, PLLC

20080096474 - Method for producing semiconductor wafer and semiconductor wafer: The present invention is a method for producing a semiconductor wafer, comprising: at least a double-side polishing step; and a chamfered-portion polishing step; wherein as a first chamfered-portion polishing step, at least, a chamfered portion of the wafer is polished so that a chamfered surface of each of main surface... Agent: Oliff & Berridge, PLC

20080096477 - Blade sharpening device with blade contour copying device: The present invention provides a blade sharpening device designed for sharpening a blade for a uniform sharpening of the edge thereof. The blade sharpening device contains a base having a guide slidably movable relative to the base. The guide includes a material that receives an impression of a blade defining... Agent: Barlow, Josephs & Holmes, Ltd.

20080096478 - Polishing tool comprising a drive plate and a removable pad for finishing an ophthalmic lens: A polishing tool (1) for finishing an ophthalmic lens includes a drive plate (4) which is equipped with elements (2) for mounting same to the spindle of a polishing machine; a removable polishing pad (5) designed to be rotated by the drive plate (4); positioning elements to block the radial... Agent: Young & Thompson

20080096479 - Low-melting point superabrasive tools and associated methods: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method for making a low-melting point superabrasive tool having a plurality of superabrasive particles is provided. Such a method may include coating each of the plurality of superabrasive particles with a reactive element that chemically bonds to... Agent: Thorpe North & Western, LLP.

20080090492 - Adjustment device for adjusting a level difference between rollers of a roller belt sander: An adjustment device for adjusting a level difference between rollers of a roller belt sander includes a base, an eccentric shaft and a restricting knob. The base is fixed on an interior wall edge of a main body corresponding to two ends of a roller. The eccentric shaft inserted pivotally... Agent: Sinorica, LLC

20080090493 - Grinding machine having universal joint bearing with constant-speed inner wheel: A grinding machine having a universal joint bearing comprises a movable-mount module, a universal-joint module, a mount control module, a grinding-wheel module and a milling-stone module. The movable-mount module further comprises a plurality of movable mounts. The universal-joint module consists of a plurality of servo-motors, each being provided with a... Agent: Min-fang Yu

20080090494 - Abrading tool and method for refurbishing electrical connector pin contacts: An abrading tool for refurbishing pin contacts in situ in an electrical connector is provided. The abrading tool includes a bore defined in a first end for receiving the pin contacts therein and a transverse slot which intersects the bore. A removable abrading element is received within the slot and... Agent: Ogilvy Renault LLP (pwc)

20080090496 - Mirror image pair sanding blocks: A right handed or left handed sanding block can be provided individually or as a mirror image pair. Each block includes a grasp handle and a fastening surface engaging a replaceable sanding pad. Each handle includes a pair of cove box channels to fit the fingers of the user. These... Agent: Alfred M. Walker

20080090495 - Trimming composite skin stiffener ends: A tool for trimming the ends of stiffeners on aircraft composite skin panels accurately, rapidly and without damaging the underlying skins includes an expandable guide frame adapted to straddle and clamp to the stiffener at a selected longitudinal position thereon. The frame includes a pair of planar guide faces disposed... Agent: Macpherson Kwok Chen & Heid, LLP

20080090497 - Substrate retaining ring for cmp: The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include... Agent: Ditthavong Mori & Steiner, P.C.

20080090498 - Customized polish pads for chemical mechanical planarization: A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include... Agent: Morrison & Foerster LLP

20080090499 - Pad conditioner, pad conditioning method, and polishing apparatus: A pad conditioning apparatus and method for conditioning a surface of a polishing pad which is used in a polishing apparatus for polishing works, having a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflecting or elastic member, wherein... Agent: Roberts, Mlotkowski & Hobbes

20080090501 - Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080090500 - Process for reducing dishing and erosion during chemical mechanical planarization: This invention is directed to a slurry system and process of metal removal from a substrate. This invention is useful for polishing a microelectronic device. This invention is especially useful for chemical mechanical planarization of a semiconductor wafer for removal of an overburden thereof. The slurry system of the present... Agent: Deborah M. Altman Ppg Industries, Inc.

20080090502 - Machine for removing the sharp edge in plates in general and in particular in glass plates: A machine for removing sharp edge in plates in general and in glass plates in particular, comprising a frame for the support and advancement of a plate on which there is at least one station for arrissing an edge of the plate, the arrissing station comprising an upper tangential grinding... Agent: Modiano & Associati

20080090503 - Polishing pad and chemical mechanical polishing apparatus comprising the same: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper... Agent: Volentine & Whitt PLLC

20080090504 - Large angle grinder: An angle grinder is provided including a radial fan assembly. The radial fan assembly is configured to direct exhaust radially outwardly and axially away from a user of the angle grinder. Brush card assemblies for an angle grinder are also provided. The brush card assemblies provide for the securing of... Agent: Harness, Dickey & Pierce, P.L.C

20080090505 - Wafer grinding method: A recessed portion is formed in an area, of a rear surface of a wafer, corresponding to a device formation area is formed by a rough grinding wheel of a rough grinding unit and an annular protruding portion is concurrently formed around the recessed portion. The inner circumferential lateral surface... Agent: Greer, Burns & Crain

20080090506 - Sanding system: An abrasive sanding work glove (12) has a fabric (13) with an inner first elastomeric cushion coat (18) and an harder cured coat (21) cured on the palm and finger fronts. Abrasive particles (22) are bonded to the cured coat (21) to provide for a sanding or gripping work tool.... Agent: Reising, Ethington, Barnes, Kisselle, P.C.