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AbradingBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 05/16/2013 > 11 patent applications in 11 patent subcategories.
20130122781 - Abrasive blasting method and control device for such a method: Abrasive blasting control method in which a control device (10) is used including at least a swing-arm (13) and in which the movement of the swing-arm (13) is controlled from the exterior of the casing of the wheel from its rest position to its second position in which said swing... Agent: Rosler Holding Gmbh & Co. Kg
20130122782 - Systems and methods for substrate polishing end point detection using improved friction measurement: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In... Agent: Applied Materials, Inc.
20130122783 - Pad conditioning force modeling to achieve constant removal rate: A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the... Agent: Applied Materials, Inc
20130122784 - Pad conditioner dresser: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle... Agent:
20130122785 - Method of preparing substrate: A substrate is prepared by polishing a surface of the substrate using a polishing pad while feeding a slurry. The polishing pad has a porous nap layer which comes in contact with the substrate surface and is made of a base resin comprising at least three resins, typically an ether... Agent: Shin-etsu Chemical Co., Ltd.
20130122786 - Rinsing agent, and method for production of hard disk substrate: s
20130122787 - Method for generating of non-straight gear teeth: A gear teeth generation method carried out on multi-axis machines, using a disk tool. The tool travels along the gear tooth where its motion along a gap adjacent to the gear tooth is synchronized with the roll motion performed by said multi-axis machine so that the pressure line is on... Agent: Klingelnberg Ag
20130122788 - Systems and methods for substrate polishing end point detection using improved friction measurement: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In... Agent: Applied Materials, Inc.
20130122790 - Contrast device for the grinding of products held between centres: A contrast device for the grinding of products, particularly but not exclusively cylinders, held between centres, wherein a grinding machines (21) comprise a holding structure (20) equipped with a grinding wheel (24) to which a cylinder to be processed (22) is opposed, and the contrast device (23) is situated on... Agent: Tenova S.p.a.
20130122791 - Apparatus and process for formation of laterally directed fluid jets: A processing apparatus is provided to process a workpiece. The processing apparatus can have a low-profile nozzle system capable of navigating through spaces in order to process target regions with relatively small clearances. A fluid jet outputted from the nozzle system is used to cut, mill, or otherwise process the... Agent: Flow International Corporation05/09/2013 > 13 patent applications in 12 patent subcategories.
20130115853 - Surface treatment machine: Disclosed herein is a surface treatment machine that enables the inhibition or reduction of residual abrasives that remain on a workpiece that has been surface treated. An H steel (a workpiece to be treated) 12 is conveyed by means of a conveying device 20. Blasting devices 24A, 24B are then... Agent:
20130115854 - End point detection in grinding: A method for performing grinding includes selecting a target wheel loading for wafer grinding processes, and performing a grinding process on a wafer. With the proceeding of the grinding process, wheel loadings of the grinding process are measured. The grinding process is stopped after the target wheel loading is reached.... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20130115855 - Polishing method and polishing apparatus: According to one embodiment, a polishing method comprises pressing a substrate being rotated against a polishing pad being rotated and supplying slurry on the polishing pad, measuring a surface temperature of the polishing pad, and when the surface temperature is not less than a predetermined temperature, jetting jet stream containing... Agent:
20130115856 - Gear grinding method: Provided is a gear grinding method wherein an initial cutting position by a grindstone is appropriately set, resulting in an improvement being able to be made in machining accuracy. For this purpose, the gear grinding method is such that rotation of a workpiece (W) about a workpiece rotation axis (C),... Agent: Mitsubishi Heavy Industries, Ltd.
20130115857 - Translocation-simulating loading apparatus for gear grinding machine with shaped grinding wheel and detection method for stiffness distribution: A translocation-simulating loading apparatus for gear grinding machine with shaped grinding wheel is provided. The apparatus comprises a load-receiving test piece (25) disposed on the gear grinding machine with shaped grinding wheel and a load-exerting component for use in loading simulation. The gear grinding machine with shaped grinding wheel enables... Agent:
20130115858 - Substrate retainer: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward... Agent:
20130115859 - Surface treatment method of polishing pad and polishing method of wafer using the same: Provided is a surface treatment method of a polishing pad. The surface treatment method of the polishing pad includes locating a wafer on the polishing pad including a polishing material, supplying a polishing pad polishing material between the polishing pad and the wafer to expose the polishing material included in... Agent:
20130115860 - Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials: A linear, automated apparatus and method for clean, cost-effective, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials is presented, constructed principally from corrosion resistant stainless steel or nickel, enabling utilization of high purity water based abrasive slurry. The circular stainless steel or nickel lapping plate of the apparatus... Agent:
20130115861 - Processing method for wafer having chamfered portion along the outer circumference thereof: A wafer processing method for reducing the thickness of a wafer to a predetermined thickness, the wafer having a chamfered portion along the outer circumference thereof. The wafer processing method includes a stacked wafer forming step of attaching a support substrate to the front side of the wafer to thereby... Agent: Disco Corporation
20130115862 - Chemical mechanical polishing platform architecture: Embodiments of the invention provide polishing systems for increasing production efficiency, maximizing substrate throughput, and reducing production costs. The polishing systems generally include one or more polishing stations for performing a CMP process and one or more cleaning stations at which post-polishing cleaning is performed. The number of cleaning stations... Agent: Applied Materials, Inc.
20130115863 - Dust collecting attachment for electric power tool and electric power tool: A dust collecting attachment that is mounted on a sander includes a suction portion mounted on a portion of a front housing where an output shaft projects, a flexible hose having a front end of the flexible hose connected to the suction portion, a discharge portion connected to a rear... Agent:
20130115864 - Flap wheel and a method for producing a flap wheel having a plate-shaped carrier: “The invention relates to a method for producing a flap wheel (4) having a plate-shaped carrier, wherein a plurality of grinding flaps (7) overlapping in a shingle-like manner are glued to an annular carrier section (3, 5) that is centered on a rotational axis A of the flap wheel (4),... Agent:
20130115865 - Honing tool for honing blind bores: The invention relates to a honing tool (1) that is suitable in particular for honing blind bores (5), comprising a stone carrier (3), a first honing stone segment (16) and a second honing stone segment (17). The first honing stone segment (16) and the second honing stone segment (17) are... Agent: Robert Bosch Gmbh05/02/2013 > 8 patent applications in 7 patent subcategories.
20130109278 - Polishing method and polishing apparatus: A polishing method capable of obtaining an accurate thickness of a silicon layer during polishing of a substrate and determining an accurate polishing end point of the substrate based on the thickness of the silicon layer obtained. The method includes: calculating relative reflectance by dividing the measured intensity of the... Agent: Ebara Corporation
20130109277 - Robotic end effector including multiple abrasion tools: A robot system comprises a robotic end effector including first, second and third abrasion tools having backing pads in a triangular arrangement.... Agent: The Boeing Company
20130109279 - Self-bonded foamed abrasive articles and machining with such articles: A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains... Agent:
20130109280 - Methods and systems for marring fiber optic substrates: A method of marring a fiber optic substrate by supporting a length of the substrate on a tapered surface of an elongate support and causing relative movement between at least one roller and the support lengthwise of the support with the roller pressing the substrate against the tapered surface and... Agent:
20130109281 - Bumper paint removing apparatus: In order to be able to easily and sufficiently remove paint from the surface of a bumper, grooves or projections are provided on the surface of one roller, from among a pair of rollers on a roller apparatus (1), that comes into contact with the surface of the paint, and... Agent: Takaroku Shoji Co., Ltd.
20130109282 - Devices and methods for removing a coating on a surface of a submerged pipeline: Devices for removing a coating on a pipe are provided. In one aspect, a device for removing a coating on a pipe includes a sleeve, an arm coupled to the sleeve, and a wheel coupled to the arm. The sleeve includes a wall and an aperture defined through the wall.... Agent: Illinois Tool Works Inc.
20130109283 - Deburring machine: A deburring machine for removing burrs from workpieces includes a framework, a deburring mechanism and a transport mechanism. The deburring mechanism mounted on the framework, includes deburring units positioned on the framework. The transport mechanism is positioned on the framework adjacent to the deburring units. The transport mechanism includes a... Agent: Hon Hai Precision Industry Co., Ltd.
20130109284 - Adjustable curve hand sander: A hand-held sander for sanding a curved surface includes a structurally rigid frame having a left hand hold and left channel oppositely disposed from a right hand hold and right channel. An open-ended concave recess is formed between and perpendicular to the channels. A flexibly resilient and flat substrate has... Agent:04/25/2013 > 9 patent applications in 7 patent subcategories.
20130102226 - Slit blade polishing procedure: A procedure for polishing slit blades to ensure proper flatness and blade angle. This task is incredibly difficult. The number of strokes, series of and type of abrasive papers used, direction of polishing lapping strokes, as well as other practices to promote flatness and minimize human and manufacturing error in... Agent:
20130102227 - Systems and methods of wafer grinding: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with... Agent: Strasbaugh
20130102228 - Glass plate, glass plate polishing method, method of producing the same, and apparatus for producing the same: A disclosed glass plate is formed by converging flow streams of molten glass, which have a same composition and are caused to flow downward along left and right surfaces respectively of a forming body, in a vicinity of a root of the forming body, wherein neither front nor back surface... Agent: Asahi Glass Company, Limited
20130102230 - Method of manufacturing glass substrate for information recording medium, and suction instrument: An object of the invention is to provide a method of manufacturing a glass substrate for an information recording medium, which suppresses an increase in the number of foreign matter adhering to the surface of the glass substrate or damages on the surface of the glass substrate in suckingly holding... Agent:
20130102229 - Process for producing glass substrate for information recording medium: According to the process for producing a glass substrate for an information-recording medium of the present invention, a glass plate 10 is roughly polished by a polishing machine 1 using a polishing liquid 7 containing a polishing agent containing cerium oxide as a main component in the rough polishing step,... Agent:
20130102231 - Organic particulate loaded polishing pads and method of making and using the same: Polishing pads including organic particulates in a continuous polymer phase, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to... Agent: 3m Innovative Properties Company
20130102232 - System and method for removing a coating from a substrate: A system and a method for removing a coating from a substrate. The system provides a compressed air source, a heated water source, a particulate cleaning medium source, and a mixing valve including an air input, a water input, and a particulate cleaning medium input. The inputs are positioned on... Agent: All Coatings Elimination System Corporation
20130102233 - Apparatus for deburring workpiece: Disclosed is a deburring apparatus. The deburring apparatus includes a transfer module installed on a base to form a transfer path of transferring a workpiece to be deburred, a deburring module provided on the transfer path of the workpiece installed on the base to deburr the workpiece, and a blocking... Agent: Korea Aerospace Industries, Ltd.
20130102234 - Polishing device: The invention describes a polishing device (100) for polishing a component (200), comprising an elongated polishing element (110), which is directed against the surface (205) of the component (200) parallel to the longitudinal axis (z) of the component (200). In this case, the polishing element (110) is formed in adjustment... Agent: Sms Siemag AktiengesellschaftPrevious industry: Foundation garments
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