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Abrading

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
08/28/2014 > 19 patent applications in 11 patent subcategories.

20140242881 - Feed forward parameter values for use in theoretically generating spectra: A method of controlling a polishing operation is described. A controller stores an optical model for a layer stack having a plurality of layers and a plurality of input parameters including a first parameter and a second parameter. The controller stores data defining a plurality of default values for the... Agent:

20140242882 - Grinding machine and grinding method: There are provided a grinding machine and a grinding method that make it possible to achieve a high degree of accuracy of the roundness of a workpiece. As at least one of a coolant dynamic pressure and a grinding efficiency varies depending on a phase of the workpiece, a pressing... Agent: Jtekt Corporation

20140242880 - Optical model with polarization direction effects for comparison to measured spectrum: A method of controlling a polishing operation includes storing an optical model for a layer stack having a plurality of layers. The optical model has a plurality of input parameters, the plurality of input parameters including a first parameter and a second parameter. The second parameter is a polarization angle... Agent: Applied Materials, Inc.

20140242879 - Path for probe of spectrographic metrology system: A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of... Agent: Applied Materials, Inc.

20140242877 - Spectrographic metrology with multiple measurements: A method of controlling a polishing system includes transporting a substrate to an in-line optical metrology system positioned in a chemical mechanical polishing system, at the in-line optical metrology system, moving a probe relative to the substrate to measure a plurality of spectra reflected from the substrate at a plurality... Agent: Applied Materials, Inc.

20140242878 - Weighted regression of thickness maps from spectral data: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For... Agent: Applied Materials, Inc.

20140242883 - Determination of wafer angular position for in-sequence metrology: A polishing apparatus includes a carrier head configured to hold a wafer in a first plane, the wafer having a perimeter and a fiducial, a drive shaft having an axis perpendicular to the first plane and configured to rotate the carrier head about the axis, a light source configured to... Agent: Applied Materials, Inc.

20140242884 - Synethetic quartz glass subtrate polishing slurry and manufacture of synethetic quartz glass substrate using the same: A polishing slurry comprising a collagen derivative and a colloidal solution is effective for polishing of synthetic quartz glass substrates. It prevents formation of defects having a size that can be detected by a high-sensitivity flaw detector.... Agent: Shin-etsu Chemical Co., Ltd.

20140242885 - Polishing apparatus and polishing method: A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system... Agent:

20140242886 - Polishing head in chemical mechanical polishing apparatus and chemical mechanical polishing apparatus including the same: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the... Agent: Samsung Electronics., Ltd.

20140242887 - Hand power tool: A hand power tool includes a drive unit, an electronic unit, and a cooling device configured to cool at least one of the drive unit and the electronic unit. The hand power tool also includes at least one of an open-loop control unit and a closed-loop control unit configured to... Agent: Robert Bosch Gmbh

20140242888 - Hand power tool: A hand power tool includes a drive unit, an electronic unit, and a switching unit. The switching unit includes at least one actuating element configured to activate and deactivate the drive unit. The switching unit also includes at least one switching element configured to be positioned in at least one... Agent: Robert Bosch Gmbh

20140242889 - Hand power tool: An angle grinder including at least one ECO mode unit configured to provide an ECO mode and at least one functional device configured to make available a function of the angle grinder that is at least partially essential for an operating state.... Agent: Robert Bosch Gmbh

20140242890 - Handheld power tool: An angle grinder including at least one boost mode unit configured to provide a boost mode, and a switching-over unit configured to switch over between a conventional mode and the boost mode.... Agent: Robert Bosch Gmbh

20140242891 - Tornado pad: A rotatory sander pad includes a rigid inner portion for attaching to a rotary sander tool and a flexible outer portion for accepting an abrasive medium. The flexible outer portion includes a substantially flat bottom surface for accepting the abrasive medium, a through-hole substantially in its center, and a multi-dimensional... Agent:

20140242892 - Rotary abrasive brush for deburring and method of manufacturing: A rotary tool containing a core hub with helical groove on its outer surface filled in with continuous abrasive filament formed by folding of a pre-cut abrasive sheet including multiple bristle like straps extending radially from the hub. The method of manufacturing includes the steps of providing a hub, and... Agent: Dburr Technologies

20140242893 - Abrasive device: An abrasive device including at least one substrate, provided as a carrier element of a binder layer at least partially accommodating at least one abrasive grain, and having at least one fastening element, configured to detachably fasten the at least one substrate to an abrasive handling device.... Agent: Robert Bosch Gmbh

20140242894 - Polishing pad and method for producing same: Provided are: a polishing pad which is capable of alleviating a scratch problem that occurs when a conventional hard (dry) polishing pad is used, and which is excellent in polishing rate and polishing uniformity and is usable not only for primary polishing but also for finish polishing; and a method... Agent:

20140242895 - Knife sharpener: A knife sharpener having an angled bolster for providing predetermined sharpening angles with respect to the sharpening surface is provided. The angled bolster of the knife sharpener preferably includes two different angled surfaces for establishing at least two different predetermined sharpening angles for a cutting implement to be sharpened. The... Agent: Lifetime Brands, Inc.

  
08/21/2014 > 10 patent applications in 9 patent subcategories.

20140235141 - Apparatuses and systems for finishing three-dimensional surfaces: A method and an apparatus for smart automation of robotic surface finishing of a three-dimensional surface of a work piece is described. A three-dimensional motion path is created along the surface of the work piece. A variable contact force profile is specified along the three-dimensional motion path. The three-dimensional motion... Agent:

20140235140 - Method for drilling at least one hole into a workpiece: The method is used to drill at least one hole into a front wall section of a workpiece (12) by way of a machining jet formed from liquid, to which abrasive material is admixed as needed. As seen looking in the drilling direction, the front wall section is located in... Agent: Waterjet Robotics Ag

20140235142 - Device for polishing optical lenses: The device for polishing optical lenses includes a lens holder; a device for positioning the lens holder; and a device for rotating the lens holder about an axis. There is also a polishing tool; a tool holder; a device for positioning the tool holder; and a device for rotating the... Agent:

20140235143 - Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers: A method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafer uses a double-side polishing device. The device has an annular lower polishing plate and an annular upper polishing plate, each covered with a polishing pad, as well as a rolling device for carrier disks. The method... Agent: Siltronic Ag

20140235144 - Chemical mechanical polishing machine and polishing head assembly: A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.... Agent: Samsung Electronics Co., Ltd.

20140235145 - Hand power tool: A hand power tool, in particular an angle grinder, includes a drive unit and an electronic unit. The hand power tool further includes an after-run cooling unit configured, at least partially, to cool the drive unit and/or the electronic unit substantially after an operating state of at least the drive... Agent: Robert Bosch Gmbh

20140235146 - Apparatus for treating a product: An apparatus (10) for treating a product (11) is provided, in particular for tumbling a surface of the product. The apparatus includes vibration elements designed to move the product treatment composition and product retaining elements in the form of magnetic anchoring elements (12a, 12b).... Agent:

20140235147 - Gas-liquid separator and polishing apparatus: A gas-liquid separator includes: a gas-liquid separation tank; a gas-liquid introduction pipe configured to introduce a gas-liquid two-phase flow into the gas-liquid separation tank, the gas-liquid introduction pipe extending in the gas-liquid separation tank; a spray nozzle configured to spray pure water toward a liquid that has been collected on... Agent:

20140235148 - Peripheral wheel for machining the edges of slabs: A peripheral wheel for machining the edges of slabs, comprising an internal wheel body, to be fixed to a spindle or other machine, and an external abrasive ring, which is adapted to work in contact with an edge of a slab, the abrasive ring being composed of at least two... Agent:

20140235149 - Sanding apparatus for removing runs and drips: A sanding apparatus for removing runs and drips in paint includes a base member, an oscillating member, and a connector bolt. The oscillating member is positioned within the base member where the base member and the oscillating member are movably connected to each other by the connector bolt. A sanding... Agent:

  
08/14/2014 > 9 patent applications in 9 patent subcategories.

20140227944 - Mass finishing apparatus and method: A finishing apparatus and method for surface finishing workpieces. A tub is rotatable about vertical axis and operable to hold and rotate abrasive media completely submerged in water or other liquid. One or more manipulators, each supporting a spindle operable for supporting and rotating a workpiece about a spindle axis... Agent:

20140227945 - Chemical mechanical planarization platen: A method and system for planarizing or polishing a semiconductor wafer. The system includes a carrier adaptable to hold a semiconductor wafer, a polishing pad, and a platen having a substantially planar surface in contact with the polishing pad, the planar surface having a distribution of holes. The distributed holes... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.

20140227946 - Method of machining opposite ends of rod members: A method of efficiently cutting and machining opposite ends of rod members in sequence is provided, which comprises steps of: abutting a grinding wheel (5) against the periphery of a long rod material (10a) placed at a predetermined work position; moving the grinding wheel towards and along the axis of... Agent: Nittan Valve Co., Ltd.

20140227947 - Setup platform apparatus for bench and pedestal grinders: A setup platform is provided for a grinder including a cutoff wheel. The setup platform includes an upper planar surface including a first edge, which may be shaped similar to the grinder housing, the first edge including a slot therein for receiving the cutoff wheel. An anchor bar is mounted... Agent: Motion Concepts, LLC

20140227948 - Power tool with interchangeable tool head: A power tool that includes a tool body housing, a drive system, a tool head and a connection system. The drive system is housed in the tool body housing. The tool head, which is configured to perform work on a work piece, includes a tool head housing and an input... Agent: Black & Decker Inc.

20140227949 - Floor grinding/polishing machine with gimbal-mounted grinding/polishing head: A floor grinding/polishing machine with a gimbal-mounted grinding/polishing head is disclosed. The floor grinding/polishing machine includes a wheeled carriage, a handle attached to the carriage for controlling the wheeled carriage, a grinding/polishing head attached to the wheeled carriage, and a motor supported on the grinding/polishing head for driving one or... Agent:

20140227950 - Arrangement for floor grinding: An arrangement for floor grinding with a floor conditioning device. A tool instrument is used in the floor conditioning device by rotating the floor conditioning device. The instrument is an essentially porous washing, polishing, waxing disk for carrying out basic functions of the floor conditioning device. A grinding instrument is... Agent:

20140227951 - Conductive chemical mechanical planarization polishing pad: A polishing pad for polishing a substrate. The pad comprises a layer of material having an upper polishing surface and a lower surface interfacing with a proximate platen, the material comprising a mixture of a conductive polymer distributed in a structure of a dielectric polymeric material using predetermined relationships. Additional... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.

20140227952 - Grinding tool for machining brittle materials and a method of making a grinding tool: The invention relates to a grinding tool for machining brittle materials. The grinding tool has a core and an abrasive rim. The abrasive rim has abrasive particles embedded in a matrix. The matrix has a metallic bonding agent and possibly also a polymeric bonding agent. The metallic bonding agent contains... Agent: Slipnaxos Aktiebolag

  
08/07/2014 > 12 patent applications in 11 patent subcategories.

20140220861 - Shot peening flow rate control: A shot peening flow rate control that is useful for non-ferrous shot peening media. The control has an inlet for receiving media and an orifice through which the media may pass that is in communication with the inlet. A valve selectively blocks the orifice. The valve has a spindle that... Agent: Electronics Inc.

20140220862 - Film thickness monitoring method, film thickness monitoring device, and polishing apparatus: In accordance with an embodiment, a film thickness monitoring method includes polishing an opaque film on a transparent film on a substrate, irradiating the substrate with light concurrently with the polishing of the substrate, obtaining a first signal by detecting reflected light from the substrate, acquiring first data from the... Agent: Kabushiki Kaisha Toshiba

20140220863 - High throughput cmp platform: A chemical-mechanical polishing system has a first polishing apparatus configured to perform a first chemical-mechanical polish on a workpiece and a second polishing apparatus configured to perform a second chemical-mechanical polish on the workpiece. A rework polishing apparatus comprising a rework platen and a rework CMP head is configured to... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.

20140220864 - Polishing apparatus: An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus 100 includes a polishing table 110 to which a polishing pad 108 for polishing a substrate 102 is attached, a liquid feeding section configured... Agent: Ebara Corporation

20140220865 - Apparatus, system, and method for sharpening a tool in a fixed geometry: A system for sharpening a tool bit in a fixed geometry has a base with a support platform and guide rod attached to and extending from the platform; a fixture including a longitudinal extending body with a plurality of linear bore holes extending through a transverse width of the fixture;... Agent: Glendo Corporation

20140220867 - Concrete cutting, polishing and coloring treatment solutions and methods: Systems and methods for treating concrete, which includes the steps of wetting a surface of concrete with a amorphous colloidal silica, allowing time for the colloidal silica to penetrate the concrete surface, and cutting the surface of the concrete with a bladed tool wherein the longitudinal blade portion is positioned... Agent: Global Polishing Systems LLC

20140220866 - Method of polishing back surface of substrate and substrate processing apparatus: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side... Agent:

20140220868 - System for dressing a centrifugal clutch: A system for dressing centrifugal clutches has a drum tool with an internal abrasive surface, and a flap tool with abrasive flaps. The drum tool can replace the clutch drum on the clutch driven shaft to dress the clutch shoes, or the flap tool can replace the clutch shoes and... Agent:

20140220869 - Subtle vortex polishing apparatus: A subtle vortex polishing apparatus includes a receiving unit; a stirring unit, movably provided in the receiving unit; and a transmission unit, connected to the stirring unit. The workpiece to be polished and the fluid abrasive are placed in the in the receiving unit. The stirring unit is driven by... Agent: Southern Taiwan University Of Science And Technology

20140220870 - Sanding devices and methods: The present disclosure describes a sanding device that has a motor coupled to a base plate for inducing vibration in the base plate. Further, the sanding device has a face plate that is coupled to the base plate, and the face plate has a plurality of sleeves for receiving a... Agent: Silhouette Sander, LLC

20140220871 - Machining tool: A machining tool includes a power transmission mechanism, a circular machining belt, a tightening mechanism and a contact mechanism for tool contact with an object to be machined. The power transmission mechanism of the machining tool has a mechanical connection with a rotational power source. The contact mechanism and the... Agent: Jot Automation Oy

20140220872 - Grindstone tool and method for manufacturing same: Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples (14) formed in the external peripheral surface (13a) of a base... Agent: Mitsubishi Heavy Industries, Ltd.

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