Abrading inventions

20090264048 - Machine and process for grinding dies: The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate (2.1) in which the die (1) to be machined is anchored is controlled at all the points of its angular movement, allowing the interpolation of the movements of this work... Agent: The Nath Law Group

20090264050 - High porosity abrasive articles and methods of manufacturing same: An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized from a monomer including at least one double bond.... Agent: Larson Newman & Abel, LLP

20090264049 - Platen exhaust for chemical mechanical polishing system: The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090264051 - Self-sharpening tool blade and method: A self-sharpening tool blade is to be used on shovels, spades, cultivating tools, garden hand tools, and other tools and mechanical equipment which need to have consistently sharp cutting edges in order to penetrate into and dig in the ground. The blade utilizes the concept of differential surface wear for... Agent: Hollstein Keating Cattell Johnson & Goldstein, P.C.

20090264052 - Polishing method and polishing apparatus, and program for controlling polishing apparatus: A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method comprises: carrying out a stand-by operation during a polishing-resting time period; carrying... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090264053 - Apparatus and methods for using a polishing tape cassette: Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the... Agent: Dugan & Dugan, PC

20090264054 - Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device: A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090264055 - Rolling machine: A rolling machine includes a first clipping component, a second clipping component, a lifting component, and a holding assembly. The first clipping component has a first surface and a second surface opposite to the first surface. The second clipping component has a third surface configured to contact the first surface... Agent: PCe Industry, Inc. Att. Steven Reiss

20090264056 - Substrate holder with liquid supporting surface: Embodiments of the present invention generally relate to a substrate transferring system. One embodiment of the present invention provides a substrate holder comprising a pedestal plate, a basin wall extending from a top surface of the pedestal plate, wherein the basin wall has a substantially leveled top surface, the basin... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090264057 - Dresser feeding device: A dresser supply device of a grinding tool which supplies powdery dresser to a grinding tool having an abrasive grain layer on cutting blade tips, the dresser supply device comprising: an air supply source which supplies air; a dresser supply air pipe including a base end which is connected to... Agent: Darby & Darby P.C.

20090264058 - Sanding apparatus: Embodiments of the present invention generally relate to an improved sanding apparatus for minimizing scoring of drywall and other sensitive finishes. In one embodiment of the present invention, a sanding apparatus comprises a flexible, resilient core having a top and bottom sanding surface, a first and second side sanding surface,... Agent: Maldjian & Fallon LLC

20090264059 - Stain applicator: A stain applicator and finishing pad is defined by a specialized flexible applicator pad that has on one side an absorbent applicator material that absorbs liquid stain so that the stain may be applied to a the prepared surface, and on the opposite side an abrasive coating that allows for... Agent: Hancock Hughey LLP

20090258573 - Chemical mechanical polishing method: Shape memory chemical mechanical polishing methods are provided that use shape memory chemical mechanical polishing pads having a polishing layer in a densified state, wherein the polishing pad thickness and/or groove depth is monitored and the polishing layer is selectively exposed to an activating stimulus causing a transition from the... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20090258574 - Polishing system having a track: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090258575 - Chemical mechanical polishing pad and methods of making and using same: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20090258576 - Grinding machine and grinding method: A grinding machine is provided with first and second grinding wheels selectively used in dependence on the steps of machining operations. The second grinding wheel is grooved so that at least one oblique groove vertically crosses a contact surface on which a grinding surface of the second grinding wheel contacts... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090258577 - Method for trimming molds of automotive metal sheets: The present invention provides a method for trimming molds of automotive metal sheets, which comprise a top mold and a bottom mold. The top mold has a concave mold surface, and the bottom mold has a corresponding convex mold surface. The method comprises: 1. Use the top mold as the... Agent: Sinorica, LLC

20090258578 - Polishing pad and method for making the same: The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has... Agent: Volentine & Whitt PLLC

20090258579 - Form transfer grinding method: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly... Agent: Carlson, Gaskey & Olds/pratt & Whitney

20090258580 - Aqueous abrasives dispersion medium composition: An aqueous abrasives dispersion medium composition comprising: glycols; glycolethers represented by a general formula (1): R2O—(CHR1CH2O)m—R3 (1); and water. (In the general formula (1), R1 represents a hydrogen atom or a methyl group, R2 represents an alkyl group or an alkenyl group of carbon number 1 to 18 , R3... Agent: Ladas & Parry LLP

20090258581 - Double concentric solid wheel diamond dressers: A dresser for dressing a grind stone including two concentric solid wheel dressing elements. The dressing elements include an abrasive material within a matrix material. The grind stones dressed with the dressers of the invention operate at high removal rates thereby grinding substrates quickly and at low cost. The grind... Agent: Shumaker & Sieffert, P.A.

20090258582 - Cutting heads: A nozzle assembly (1) generates a jet (9) of water, or abrasive particles suspended in water, for use in an abrasive waterjet-cutting head. The nozzle assembly (1) comprises a nozzle element (5, 80, 84, 86, 91) with a tapering bore (7) therethrough, mounted to a carrier (2, 52) so that... Agent: Schwegman, Lundberg & Woessner, P.A.

20090258583 - Device and process for applying and/or detaching a wafer to/from a carrier: n

20090258584 - Multi-shell air-tight compartmentalized casings: A molded tool casing of at least two sections for air-tightly encasing a tool is taught. A seal is inserted into a groove molded into the sealing perimeter of one section. A protruding ridge is molded into the sealing perimeter of a second section that is to be joined to... Agent: Patricia M. Costanzo Pats Pending

20090258585 - Sanding surfaces having high abrasive loading: Abrasive articles are disclosed that may be used in dry sanding applications. The abrasive articles disclosed may be made entirely from abrasive materials or alternatively may be made by fastening abrasive surfaces to handles or tools. The abrasive articles of the present invention have abrasive surfaces with controlled wear rates... Agent: Denis Khoo Suite 120

20090258586 - Buffing ball: A buffing ball is formed by compressing a stack of generally circular buffing pads along a central axis. The individual pads have a generally wave-like outer peripheral surface having valleys and mounds. When compressed together, the mounds form small knobs that are ideal for buffing or cleaning intricate surfaces.... Agent: Wood, Herron & Evans, LLP

20090258588 - Chemical mechanical planarization pad with void network: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing... Agent: Innopad /gtpp

20090258587 - Polishing pad having groove structure for avoiding the polishing surface stripping: The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the... Agent: Volentine & Whitt PLLC

20090253351 - Friction sensor for polishing system: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of... Agent: Fish & Richardson P.C.

20090253352 - Slicing method: The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a cooling speed of... Agent: Oliff & Berridge, PLC

20090253355 - Cmp abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive: The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090253354 - Polishing compositions and use thereof: Slurry compositions comprising abrasive particles and solid lubricant particles are useful for planiarizing surfaces, and preventing delamination and scratches.... Agent: Connolly Bove Lodge & Hutz LLP

20090253353 - Polishing pad: It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been... Agent: Knobbe Martens Olson & Bear LLP

20090253356 - Apparatus and method for polishing drill bits: A finishing device for finishing the exterior, flutes and tip of a drill bit is disclosed. The finishing device includes a containment vessel which houses an abrasive media which may have a visco-elastic component and an abrasive component. The drill bit is inserted into or through the abrasive media and... Agent: Kennametal Inc. Intellectual Property Department

20090253357 - Hand carrier for grinding material: The invention describes a hand carrier for grinding material with a grinding area (2) and a bail (4), the hand carrier (1) being extruded or molded in one piece from solid material of elastic synthetics and the grinding area (2) being bordered by a flange (3).... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090253358 - Polishing article with integrated window stripe: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality... Agent: Fish & Richardson P.C.