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Abrading

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
10/02/2014 > 8 patent applications in 7 patent subcategories.

20140295736 - Apparatus and method for blending added material with base material on a manufactured component: The present relates to an apparatus and method for blending added material with base material on manufactured components. The apparatus comprises an abrasive device having an abrasive surface for removing exceeding added material, and a guide fixed to the abrasive device. The method determines a trajectory of the abrasive surface... Agent:

20140295737 - Polishing apparatus and wear detection method: There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for... Agent:

20140295738 - Colloidal silica polishing composition and method for manufacturing synthetic quartz glass substrates using the same: A polishing composition comprising a colloidal dispersion of spherical silica particles and associated silica particles as abrasive is provided. When used in the step of polishing synthetic quartz glass substrates, the polishing composition ensures a higher polishing rate than conventional colloidal silica and is effective for preventing any microscopic defects... Agent: Shin-etsu Chemical Co., Ltd.

20140295739 - Method for polishing edge of glass substrate of display panel: The present invention provides a method for polishing edge of glass substrate of display panel, which includes (1) conveying a glass substrate of a display panel to be polished to a polishing device and positioning the glass substrate for being subsequently polished by a grindstone of the polishing device; (2)... Agent:

20140295740 - Ultra fine lapping substrate through use of hard coated material on lapping kinematics: A system according to one embodiment includes a substrate having one or more sacrificial row bars and one or more additional row bars, wherein the one or more sacrificial row bars comprise a wear resistant material and are adapted to be used in a lapping process to prepare a lapping... Agent: Hgst Netherlands B.v.

20140295741 - Polyurethane foam article: Herein are disclosed an apparatus and method for reaction injection molding of polyurethane foam. In the method, a recirculation loop containing polyols along with an effective amount of water, and a recirculation loop containing isocyanates, are each partially evacuated.... Agent:

20140295742 - Method and apparatus for cmp conditioning: A CMP system has a polishing table for supporting a CMP pad which a semiconductor wafer is polished. The CMP system has a laser source configured to regenerate the CMP pad through a conditioning process while the CMP pad is disposed on the polishing table.... Agent:

20140295743 - Dart tip restoration tool: A dart restoration tool includes a stator having a conical milling surface and a rotor mounted for rotation about a longitudinal axis of the stator. The rotor includes a guide adapted to accept a tip end portion of a game dart such that the tip end portion engages the conical... Agent:

  
09/25/2014 > 11 patent applications in 10 patent subcategories.

20140287653 - Method of adjusting profile of a polishing member used in a polishing apparatus, and polishing apparatus: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained... Agent:

20140287654 - Method of abrading a workpiece: A method of abrading a workpiece includes: contacting a metallic workpiece, having a bulk temperature of less than 500 degrees Celsius, with a stationary rotating bonded abrasive wheel having a diameter of at least 150 millimeters, wherein the bonded abrasive wheel comprises ceramic shaped abrasive particles retained in a binder,... Agent:

20140287655 - Slide grinding machine and method of gap setting: In a method for the automatic gap setting in slide grinding machines having a turntable, the gap width between the turntable and the work container is automatically set by a regulation, with a reference value for the gap width of zero being determined.... Agent: Roesler Holding Gmbh & Co. Kg

20140287657 - Cmp retaining ring with soft retaining ring insert: A method of polishing a wafer with a wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range... Agent: Strasbaugh

20140287656 - Method for polishing a semiconductor material wafer: A method for polishing at least one semiconductor wafer while supplying a polishing agent includes performing a first simultaneous double-side polishing of the front side and the back side of the at least one semiconductor wafer with first upper and lower polishing pads, edge-notch polishing the surface of the at... Agent: Siltronic Ag

20140287658 - Bonded abrasive article: The present invention relates to a bonded abrasive article comprising specific shaped abrasive particles and a bonding medium comprising a vitreous bond. The present invention also relates to the use of an article according to the present invention in grinding applications, in particular in high performance grinding applications and to... Agent:

20140287659 - Machining method and machining device of component: Machining of the present invention is machining of polishing work to be polished by movement of polishing sheet relative to work, in a state where polishing sheet is in contact with a surface of work to be polished. In the machining, work is arranged in contact with polishing sheet in... Agent: Panasonic Corporation

20140287660 - Apparatus having cup attaching unit: A system includes: a cup attaching unit configured to attach a cup to a surface of an eyeglass lens; a processing apparatus main body that includes a housing in which a lens processing mechanism with a processing tool configured to process the eyeglass lens held by a lens chuck shaft... Agent: Nidek Co., Ltd.

20140287661 - Prussure module and polishing fixture module for fiber optic polisher: A pressure module and two polishing fixture modules are herein disclosed for fiber optic polisher, or polishing machine. Said pressure module further includes an adjustable spring between a top turntable and a bottom turntable, which are kinematically connected and driven by at least three pair of drive-pins and drive-bushes. Said... Agent: Princetel Inc.

20140287662 - Retaining ring with attachable segments: A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of... Agent:

20140287663 - Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads: A method for making a multilayer polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a single polymer mixture that phase separates under centrifugal force. The method also includes forming the polishing pad from at least some of a polymer formed after... Agent:

  
09/18/2014 > 35 patent applications in 23 patent subcategories.
  
09/11/2014 > 32 patent applications in 12 patent subcategories.

20140256223 - Machining method for hard-fine machining of noise-optimized gears on a gear-cutting machine: The present invention relates to a method for hard-fine machining of tooth flanks with corrections and/or modifications on a gear-cutting machine, wherein respective toothed wheel pairings which mesh with one another within a transmission or a test device are machined while taking account of the respective mating flanks, and wherein... Agent: Liebherr-verzahntechnik Gmbh

20140256224 - Method for ascertaining topography deviations of a dressing tool in a grinding machine and correspondingly equipped grinding machine: The invention relates to a method for ascertaining topography deviations of a dressing tool. The method includes executing a predefined relative movement of a dressing tool in relation to a dressable grinding tool, wherein during the execution of the relative movement, at least one contour region of the dressing tool... Agent: Klingelnberg Ag

20140256226 - Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises an olefin copolymer; wherein... Agent:

20140256225 - Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises a cyclic olefin addition... Agent: Roham And Haas Electronic Materials Cmp Holdings Inc

20140256227 - Double-side polishing method: The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at... Agent: Shin-etsu Handotai Co., Ltd.

20140256228 - In-process compensation of machining operation and machine arrangement: The present invention relates to a method for performing in-process compensating a machining operation on a workpiece, wherein the compensation process includes generating a control signal representative of magnitude of a contact force exerted on a cutting tool in a normal direction in relation to a machining surface of the... Agent:

20140256229 - Method of improving bond strength of peek implants with bone cement: A method for improving the bond between a PEEK joint component and bone cement comprising roughening a surface of the PEEK component by air-blasting abrasive water-soluble particles against the component until an average surface roughness of 4 to 6 micrometers is attained and subsequently submerging the component in water to... Agent: Howmedica Osteonics Corp.

20140256232 - Broad spectrum, endpoint detection window multilayer chemical mechanical polishing pad: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and,... Agent: Rohm And Haas Electronic Materials Cmp Holdings Inc.

20140256230 - Multilayer chemical mechanical polishing pad: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and,... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20140256231 - Multilayer chemical mechanical polishing pad with broad spectrum, endpoint detection window: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and,... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20140256233 - Abrasive article and method of making the same: An abrasive article and method of making same wherein the abrasive article comprises a mounting assembly and an abrasive attachment assembly wherein the first interlock member of the mounting assembly and the second interlock member of the abrasive attachment assembly are configured to align the central axis of the abrasive... Agent: 3m Innovative Properties Company

20140256234 - System for dispensing abrasive particles in a liquid jet apparatus: A submersible liquid jet apparatus is provided for a system with a portable liquid jet tool that may be handled by human divers or remotely operated vehicles (ROV). The present apparatus facilitates the portability of a liquid jet tool with a support unit supplying high pressure working liquid and pressurized... Agent: Chukar Waterjet, Inc.

20140256235 - Surface flow finishing machine: A machine for the flow finishing of mechanical pieces is described. The machine has a rotary vat for containing finishing media and a unit for moving pieces having at least one mechanical arm for moving the pieces being machined, said mechanical arm being associated to means for rotating the pieces... Agent:

20140256236 - Pad conditioning tool and method of manufacturing the same: A pad conditioning tool includes a sapphire chip having a side surface defining a polishing surface and a plurality of sapphire grains formed on the polishing surface in an integral manner. Each of the sapphire grains had a three-dimensional geometric structure. The sapphire grains are arranged on the polishing surface... Agent: Tera Xtal Technology Corporation

20140256237 - Drywall sander: A sanding tool including a blade and a handle, the blade having first and second opposing faces. An attachment layer removably secures to the sanding tool at the opposing faces, thereby to provide opposing abrasive layers on opposing sides of the blade. The shape of the blade, with a wider... Agent: Hmb Products, LLC

20140256238 - Composite abrasive wheel: A composite abrasive wheel comprises primary and secondary abrasive portions. The primary abrasive portion comprises shaped ceramic abrasive particles retained in a first organic binder. The secondary abrasive portion is bonded to the primary abrasive portion, and comprises secondary crushed abrasive particles retained in a second organic binder. The primary... Agent: 3m Innovative Properties Company

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