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Abrading July category listing 07/12

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
07/26/2012 > 10 patent applications in 8 patent subcategories.

20120190272 - Automatic airfoil root prep machine and associated method: An apparatus for polishing an airfoil root includes a fixture for holding the airfoil, an actuation cylinder assembly for moving the fixture holding the airfoil, a brush, a motor for rotating the brush, a switch, and control circuitry. The actuation cylinder assembly is configured to move the fixture holding the... Agent: United Technologies Corporation

20120190273 - Polishing method and polishing apparatus: A polishing method polishes a surface (surface to be polished) of a substrate at a sufficient polishing rate and obtains a desired polishing profile while preventing an unpolished portion from remaining on the surface of the substrate after polishing. The polishing method polishes a surface to be polished with a... Agent:

20120190274 - Apparatus and method for measuring tooth surface deviation, apparatus and method for forming grinding tool, and gear meshing method for gear grinding apparatus: A device for measuring tooth surface deviation includes a contact detector that measures the deviation at the tooth surface of a dresser with respect to a grinding tooth surface formed on a helical grinding tooth of a grinding tool when the grinding tool and a dresser toothed wheel are rotated... Agent: Honda Motor Co., Ltd.

20120190275 - Device with a displaceable carriage and a linear guide: A displaceable carriage (10) and a linear guide for guiding the carriage, which includes a first guide path slideway (13, 31) and a second guide path slideway (32). To form the first slideway (13, 31), the carriage (10) includes at least one pocket (13), which slides along the first guide... Agent:

20120190277 - Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers: An insert carrier is configured to receive at least one semiconductor wafer for double-side processing of the wafer between two working disks of a lapping, grinding or polishing process. The insert carrier includes a core of a first material that has a first surface and a second surface, and at... Agent: Siltronic Ag

20120190276 - Polishing pad and methods for manufacturing and using the same: This invention provides a polishing pad, which includes a substrate and a plurality of discrete abrasive blocks fixed on the substrate, wherein the abrasive blocks are of at least two kinds of heights. This invention would not reduce the polishing rate dramatically during the process for polishing a wafer by... Agent: Semiconductor Manufacturing International (shanghai) Corporation

20120190278 - Polishing method and polishing device: A polishing method includes: mounting a wafer on a fixed abrasive polishing pad located on a polishing platen; delivering a polishing slurry to the fixed abrasive polishing pad to polish the wafer; and adsorbing abrasive particles generated during the polishing process with an electrode. The electrode has a polarity opposite... Agent: Semiconductor Manufacturing International (shanghai) Corporation

20120190279 - Ventilating insert for abrasive tools: p

20120190280 - Machine tool having a protective cover: A machine tool having a protective hood is disclosed. The machine tool has a protective cover which has a clamping joint that can be attached in a flange on the machine with a clamping device. The machine tool also includes a stop device which is configured to limit the relative... Agent: Robert Bosch Gmbh

20120190281 - Polishing pad with concentric or approximately concentric polygon groove pattern: Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.... Agent:

07/19/2012 > 13 patent applications in 12 patent subcategories.

20120184182 - Method for combined fine boring and honing machining, and machining plant for executing the method: A method for fine boring of internal surfaces of bore holes in work pieces as well as a machining plant for executing this method. The fine machining, fine boring, and honing include fine boring of a bore hole of a work piece using a fine boring tool; transferring the work... Agent: Grob-werke Gmbh & Co. Kg

20120184183 - Internal gear machining method and internal gear machining device: An internal gear machining method and an internal gear machining device, are provided for grinding of a tooth profile of an internal gear using a barrel-shaped threaded grinding wheel. An NC device functions as a tooth profile error correction means and reduces a measured pressure angle error of a workpiece... Agent: Mitsubishi Heavy Industries, Ltd.

20120184184 - Tool for machining a cmc by milling and ultrasonic abrasion: The invention relates to a tool for machining hard materials such as metal-matrix or organic-matrix composite materials, comprising a cylindrical sonotrode (22) connected, along the axis (A) of said cylinder, to an assembly vibrating at a predetermined ultrasonic frequency and rotated about said axis, and at least one nozzle (3),... Agent: Snecma

20120184185 - Stringer manufacturing method: An object is to enhance the productivity, to improve the working environment of workers, and to reduce manufacturing costs. Disclosed is a stringer manufacturing method for machining one end portion of an elongated member that is provided with a cap flange, a web, and a base flange and that has... Agent:

20120184186 - Blade sharpening system and method: A system for sharpening circular, knife edged blades operates to bias an infeed grinding wheel into contact with the first edge of the blade and an outfeed grinding wheel into contact with the second edge of the blade. The grinding wheels are spaced so that they contact the respective edges... Agent:

20120184187 - Method for machining internally toothed gear and method for dressing tool used for same: A method is disclosed for dressing a tool used for machining an internally toothed gear. The method includes meshing an internally toothed gear-like dressing gear, which is rotatable about the dressing gear rotation axis, with a barrel-shaped, screw-like grindstone. For machining an internally toothed gear, the outer diameter of the... Agent: Mitsubishi Heavy Industries, Ltd.

20120184188 - Disc sander: A disc sander includes a housing having an operation platform for holding a workpiece on a work surface at the operation platform for sanding, a sanding mechanism pivotally mounted on the housing and having a sanding surface for sanding the workpiece, and an angle adjustment unit set between the housing... Agent:

20120184189 - Carrier head and carrier head unit: Provided are a carrier head and a carrier head unit for sucking and securely supporting a substrate during a chemical mechanical polishing process. The carrier head using sucking force to fix a substrate includes a head main body that includes a receiving space in a central portion thereof, the receiving... Agent:

20120184190 - Double-side polishing apparatus: In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry... Agent:

20120184191 - Electric power tool, in particular a grinding or polishing machine: An electric power tool is described, and which includes a housing in which a drive, a fan unit and an electronics device are accommodated, and wherein an air stream for cooling the drive to be generated with the aid of the fan unit through at least one air inlet opening... Agent:

20120184192 - Dust collection adapter and power tool including dust collection adapter: To a power tool main body to which a main body spindle rotationally driving a tip tool is provided, a dust collection adapter for collecting dusts generated when a material to be ground is processed by the tip tool is held thereto. The dust collection adapter includes: a dust collection... Agent: Hitachi Koki Co., Ltd.

20120184193 - Dust collection cover of disk grinder: A dust collection cover may be made from resin for achieving a reduction in its typical weight. In such a configuration, a disk-shaped grinding stone for grinding a steel material is preferably not attachable due to interference of an attachment-restricting portion. It is preferred that only a cup-shaped diamond wheel... Agent: Makita Corporation

20120184194 - Cmp polishing pad and method for manufacturing same: The present invention relates to a CMP polishing pad and to a method for manufacturing same. The CMP polishing pad is manufactured by means of a method in which a light-absorbing material is dispersed in or on the surface of the pad, and a laser beam is absorbed by the... Agent: Industry-university Cooperation Foundation Sogang University

07/12/2012 > 5 patent applications in 4 patent subcategories.

20120178345 - Abrasive wheel with closed profiles in cutting surface: Ophthalmic abrasive wheel including a plurality of swarf clearing grooves formed across the cutting surface and having closed profiles such that the swarf clearing grooves do not open to or exit the side of the abrasive wheel. The swarf clearing grooves are spaced around the cutting surface of the wheel... Agent: Inland Diamond Products Company

20120178346 - Method for cooling a workpiece made of semiconductor material during wire sawing: A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including... Agent: Siltronic Ag

20120178347 - Form transfer grinding method: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly... Agent:

20120178348 - Polishing pad having micro-grooves on the pad surface: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the... Agent: Innopad, Inc.

20120178349 - Cmp polishing pad having pores formed therein, and method for manufacturing same: The present invention relates to a CMP polishing pad and to a method for manufacturing same, characterized in that a light-absorbing material for forming pores is dispersed in the pad. Pores formed in the CMP polishing pad of the present invention are formed by means of the breakdown of the... Agent: Industry-university Cooperation Foundation Sogang

07/05/2012 > 10 patent applications in 9 patent subcategories.

20120171931 - Polishing method, polishing apparatus, and method for manufacturing semiconductor device: A polishing method includes a first polishing step of halfway polishing a film to be polished formed on a substrate, and a second polishing step of further polishing the polished film, wherein a first film thickness profile showing an in-plane distribution of a film thickness of the polished film after... Agent: Fujitsu Semiconductor Limited

20120171933 - Pressure controlled polishing platen: A method and apparatus for controlling pressure or forces applied to a substrate in a polishing process is described. In one embodiment, a polishing system is described. The system includes a platen rotatably disposed on a base, the platen having a sidewall and a polishing pad disposed thereon forming an... Agent: Applied Materials, Inc.

20120171932 - Residue removal apparatus and process: A method and apparatus for removing residue from an edge of an item are disclosed. The method and apparatus are well-suited to assist in reconditioning used shelving units or deck units for store displays. In various embodiments, ticket holders are removed from the ticket edges of the units. Each unit... Agent:

20120171934 - Cryogenic fluid stream dispensing device with polymer joint having given expansion coefficient: The invention relates to a device for dispensing at least one high-pressure cryogenic fluid stream, said device including a movable tool, comprising one or more fluid-dispensing nozzles for dispensing one or more high-pressure cryogenic fluid streams, and a line for supplying high-pressure cryogenic fluid from the movable tool, said line... Agent: L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude

20120171935 - Cmp pad conditioning tool: The present disclosure provides a CMP pad conditioning tool with at least one integral abrasive protrusion. The present disclosure further provides a method for preparing this CMP pad conditioning tool, along with a method for using said tool to condition a CMP pad.... Agent: Diamond Innovations, Inc.

20120171936 - Polishing slurry including zirconia particles and a method of using the polishing slurry: A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the... Agent: Saint-gobain Ceramics & Plastics, Inc.

20120171937 - Solar panel edge deletion machine: A solar panel edge deletion machine includes a machine base, a feeding mechanism extending through the machine base for feeding a solar panel for treating, a positioning mechanism installed in the machine base for holding the fed solar panel in position, and a plurality of spray gun sets arranged in... Agent:

20120171938 - Power tool: The present invention provides a power tool in which the permanent set of an elastic member is suppressed and the vibration reduction effect is maintained over a long period of time. A rubber ring is disposed as the elastic member between a wheel washer mounted on a spindle and a... Agent:

20120171939 - Chemical mechanical polishing device and polishing element: A polishing element used in chemical mechanical polishing device includes a polishing plate for holding a wafer that is provided; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving... Agent: Semiconductor Manufacturing International (shanghai) Corporation

20120171940 - Dual-pore structure polishing pad: The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. A porous polishing layer includes a dual porosity structure within a polyurethane matrix. The dual porosity structure has a primary set of pores having pore walls with a thickness of 15 to 55 μm... Agent: Rohm And Haas Electronic Materials Cmp Holdings Inc.

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