Abrading patents - Monitor Patents
FreshPatents.com Logo    FreshPatents.com icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents



USPTO Class 451  |  Browse by Industry: Previous - Next | All     monitor keywords
12/2011 | Recent  |  14: Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 13: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan |  | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn |  | 2008 | 2007 |

Abrading December patent applications/inventions, industry category 12/11

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
12/29/2011 > 11 patent applications in 9 patent subcategories. patent applications/inventions, industry category

20110318991 - Method and device for honing metal strips of arbitrary width in continuous motion: A method and device for honing a metal strip of arbitrary width in continuous motion, allow honing of a suspended portion of at least one side of a metal strip, being free of artifacts and automated. The device includes a device for vertically positioning an abrasive element at the surface... Agent: Siemens Vai Metals Technologies Sas

20110318992 - Adaptively tracking spectrum features for endpoint detection: A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a... Agent:

20110318993 - Abrading device and method of abrading a floor structure utilizing the same: An abrading device for abrading a floor structure comprises a first abrading assembly and a second abrading assembly. The first and second abrading assemblies each have a rotationally driven contact roll provided with a sleeve having a plurality of cutouts formed in a pattern thereon. An abrading belt is trained... Agent:

20110318995 - Method for manufacturing electronic grade synthetic quartz glass substrate: An electronic grade synthetic quartz glass substrate is manufactured by machining a synthetic quartz glass substrate to form a recess, channel or step and polishing the bottom and side surfaces of the recess, channel or step to mirror finish by a working portion of a rotary polishing tool while keeping... Agent: Shin-etsu Chemical Co., Ltd.

20110318996 - Method for manufacturing electronic grade synthetic quartz glass substrate: An electronic grade synthetic quartz glass substrate having a recess, channel or step is manufactured by machining at least one surface of a synthetic quartz glass substrate having a maximum birefringence of up to 3 nm/cm in its entirety to form a recess, channel or step, and removing the residual... Agent: Shin-etsu Chemical Co., Ltd.

20110318994 - Method of preparing an edge-strengthened article: A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the article has a second edge strength and the second edge strength is greater than the first edge strength.... Agent:

20110318997 - Apparatus and methods for conditioning a polishing pad: Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the... Agent: Applied Materials, Inc.

20110318998 - Polishing device: A polishing device includes an outer barrel, an inner barrel, polishing members, and an actuator. The outer barrel defines a chamber and includes inner surfaces substantially parallel to a central axis of the outer barrel. Each of the inner surfaces defines a holding groove for holding a workpiece. The inner... Agent: Hon Hai Precision Industry Co., Ltd.

20110318999 - Hand tool protection device: A hand tool protection device with a protective hood which at least partially surrounds a reception region for a tool is disclosed. The hand tool protection device has at least one stabilizing bar which is arranged on the protective hood in at least one operationally ready state and which directly... Agent: Robert Bosch Gmbh

20110319000 - Polishing pad sub plate: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling... Agent: Toho Engineering

20110319001 - Grinding wheel: A grinding wheel for treatment of a cutting edge, the grinding wheel arranged mountable on a rotatable shaft to be brought in rotation by the driven rotation of the shaft, and including two grinding discs (1≧2) opposing each other and arranged movable relative to each other in the shaft's longitudinal... Agent:

  
12/22/2011 > 13 patent applications in 11 patent subcategories. patent applications/inventions, industry category

20110312246 - Multiple airfoil vanes: A vane for a turbine assembly of a turbocharger includes a first airfoil that includes a length between a leading edge and a trailing edge, a second airfoil that includes a length between a leading edge and a trailing edge where the length of the first airfoil optionally differs from... Agent:

20110312247 - Apparatus for polishing rear surface of substrate, system for polishing rear surface of substrate, method for polishing rear surface of substrate and recording medium having program for polishing rear surface of substrate: Provided are a rear substrate surface polishing device polishing a rear surface of a substrate, a rear substrate surface polishing system including the rear substrate surface polishing device, a rear substrate surface polishing method used in the rear substrate surface polishing device, and a storage medium for storing a program... Agent: Tokyo Electron Limited

20110312248 - System for magnetorheological finishing of a substrate: A system for magnetorheological finishing of a substrate. A spherical wheel meant for carrying a magnetorheological finishing fluid houses a variable-field permanent magnet system having north and south iron pole pieces separated by primary and secondary gaps with a cylindrical cavity bored through the center. A cylindrical permanent magnet magnetized... Agent: Qed Technologies International, Inc.

20110312249 - Optical fiber polishing apparatus and method: A hand-held polishing apparatus is provided for polishing an optical fiber connector. The optical fiber connector mounted on the end of an optical fiber includes a connector housing and a ferrule. The polishing apparatus includes a connector mount to receive and hold the optical connector to position the end face... Agent: 3m Innovative Properties Company

20110312250 - Speed sand 90 systems: Speed Sand 90 is a device designed to quickly and efficiently create accurate ninety-degree angles while sanding new drywall. The device may be modular and/or a non-modular. The non-modular version may comprise two main parts: a replacement pad and a tool portion (a perpendicularly-angled mounting beam and manipulator securer). The... Agent:

20110312251 - Abrasive, method of polishing target member and process for producing semiconductor device: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and... Agent:

20110312252 - Sandblasting apparatus and method for shaping product with same: A sandblasting apparatus includes a processing chamber, a sandblasting nozzle positioned on a top of the processing chamber, a support mechanism, an elevation mechanism, a worktable, and a cutting mechanism. The support mechanism is positioned in the processing chamber and opposite to the sandblasting nozzle. The support mechanism is used... Agent: Hon Hai Precision Industry Co., Ltd.

20110312253 - Method of manufacturing formed cutter and grinding tool for formed cutter: A formed cutter 1 has on its tip side a blade 2 having a spiral cutting part 6 and a spiral flute 8 alternately disposed and rotating around a rotation axis O to perform cutting. The formed cutter 1 is manufactured by forming a depression 6B and a projection 6A... Agent:

20110312254 - Method and apparatus for dressing polishing pad: The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of... Agent:

20110312255 - Method for multiple cutoff machining of rare earth magnet: A rare earth magnet block is cutoff machined into pieces by rotating a plurality of cutoff abrasive blades. Improvements are made by starting the machining operation from the upper surface of the magnet block downward, interrupting the machining operation, turning the magnet block upside down, placing the magnet block such... Agent: Shin-etsu Chemical Co., Ltd.

20110312256 - Finishing device for finishing a surface of a workpiece: A finishing device for finishing a surface of a workpiece includes a finishing belt, and a guide unit for guiding the finishing belt. The guide unit has a cup-shaped guide surface which bounds a receiving zone for the workpiece and along which the finishing belt is guided or guidable between... Agent: Supfina Grieshaber Gmbh & Co. Kg

20110312257 - Abrasive belt and device for polishing surfaces provided with such belt: An abrasive belt (100) for surface polishing machines of the type having a flexible ring provided with a substantially inextensible internal layer (18) onto which an external abrasive layer (11) is fixed, wherein the external abrasive layer (11) is made up of a plurality of sectors (13) adjacent and at... Agent: Mangusta S.r.l

20110312258 - Device for sharpening and polishing needles, pins, and miscellaneous pointed articles: A sharpening device with an abrasive material, a polishing coat encapsulating the abrasive material and an instruction card coupled to the polishing coat. The abrasive material having a property of conforming to the shape of a pointed article penetrating the abrasive material and a property of applying resistance pressure to... Agent: Afab Innovations, Inc.

  
12/15/2011 > 11 patent applications in 7 patent subcategories. patent applications/inventions, industry category

20110306273 - Centerless cylindrical grinding machine and centerless grinding method with height-adjustable regulating wheel: The present invention pertains to a centerless cylindrical grinding machine with a grinding wheel and a regulating wheel that can be laterally displaced toward a work piece that can be held between these wheels, and with a rest blade for supporting the work piece that is realized rigid in the... Agent: Urs Tschudin

20110306274 - Polishing apparatus and polishing method: A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a... Agent:

20110306277 - Complex apparatus and method for polishing an ingot block: A compound chamfering device that manufactures prism-shaped ingot blocks of excellent surface smoothness is disclosed. The four-corner round surfaces and the four sides of a prism-shaped ingot obtained by using a pair of rotary blades of a slicer to perform four-side peeloff of a cylindrical ingot block are chamfered by... Agent: Okamoto Machine Tool Works, Ltd.

20110306275 - Component finishing tool: An example finishing tool form assembly includes a base and a superabrasive bonded to a surface of the base. The superabrasive is configured to be reciprocated with the base relative to a longitudinally extending recess of a component to finish at least one surface of the component.... Agent:

20110306276 - Splicing technique for fixed abrasives used in chemical mechanical planarization: An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and... Agent: 3m Innovative Properties Company

20110306278 - wall polishing machine: A wall polishing machine comprises a handle. The handle comprises at least two longitudinally arranged rod components. Each of the rod components is disposed with a dust guiding pipe therein. In any pair of adjacent rod components, the dust guiding pipe of a first rod component is exposed from the... Agent:

20110306279 - Blasting nozzle for a device for blast-machining or abrasive blasting objects: A device (33) for blast-machining or abrasive blasting objects such as structural elements, tools, household objects, pots, pans or the like, has a blast pot (3) for holding a blasting abrasive (35) which is connected via at least one line (21) to a blasting nozzle (24) which extends into a... Agent:

20110306280 - Rotatable disc head as well as floor treatment machine comprising such disc head: A rotatable disc head for a floor treatment device includes a pair of coupling members which are pivotably connected to each other according to pivot axes which are transversely oriented with respect to each other. A rotation axis is defined which is transversely oriented with respect to the pivot axes.... Agent: Design Technologies LLC

20110306282 - Adjustable belt sander: The invention relates to an adjustable belt sander, comprising a continuous sanding belt (11) and a sanding module (4), which supports the sanding belt in the sanding region and has a profiled guide surface which faces the sanding belt back and represents a rounding radius to be sanded, wherein the... Agent:

20110306281 - Finishing apparatus: The disclosure relates to a finishing apparatus for finish machining of rotationally symmetric workpiece surfaces having a finish belt guide which has a guiding body for guiding the finish belt, wherein the guiding body comprises a shell-like guiding surface along which the finish belt can be guided or is guided... Agent: Supfina Grieshaber Gmbh & Co.kg

20110306283 - Multi-purpose extended reach tool: An apparatus adapted to be coupled to a power source having a rotary drive shaft is provided. The apparatus comprises an adapter, an extension pole, and a tool head. The adapter has a drive shaft and a fluid passage. A first end of the adapter drive shaft is adapted to... Agent:

  
12/08/2011 > 11 patent applications in 9 patent subcategories. patent applications/inventions, industry category

20110300775 - Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing: A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system further determines a first polishing endpoint time and a second polishing... Agent: Applied Materials, Inc.

20110300777 - Grinding method of multifunction grinding machine: The grinding method of the multifunction grinding machine includes the steps of a step holding a workpiece W by a pair of centering members 21, 31 of a pair of spindle equipments, a step shifting two centering members 21, 31 to one side of a spindle rotational axis ZW, a... Agent: Jtekt Corporation

20110300776 - Tuning of polishing process in multi-carrier head per platen polishing station: An apparatus and method for simulating a substrate being polished in a multiple carrier head per platen station when no substrate is provided in one or more of the multiple carrier heads is described. In one embodiment, a method for processing a substrate includes providing a single substrate to a... Agent: Applied Materials, Inc.

20110300778 - Abrading agent and abrading method: A polishing agent which comprises a composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water, adjusted to a pH of 1.5-4, wherein the amount of potassium hydroxide required to raise the pH of the composition without the... Agent: Hitachi Chemical Company, Ltd.

20110300779 - Abrasive blast contour machining to remove surface and near-surface crack initiation: A multi-axis machine includes a controller operable to control a nozzle which ejects a particulate material relative to a part surface to maintain a compound angle and predetermined stand off distance to remove surface and near-surface crack initiation sites.... Agent:

20110300780 - Device for blast-machining or abrasive blasting objects: A device (33) for blast-machining or abrasive blasting objects such as structural elements, tools, household objects, pots, pans or the like, has a blast pot (3) for holding a blasting abrasive (35) which is connected via at least one line (21) to a blasting nozzle (24) which extends into a... Agent:

20110300781 - Method of manufacturing liquid crystal display device: In one embodiment, a first substrate including first and second array regions are prepared. The first and second array regions respectively include first and second active areas. A peripheral seal material having an air intake opening is arranged outside the first and second array regions. A second substrate is arranged... Agent: Toshiba Mobile Display Co., Ltd.

20110300782 - Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces: Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements projecting from the first surface. The member also includes a plurality... Agent: Micron Technology, Inc.

20110300783 - Machine for grinding dies: The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate (2.1) in which the die (1) to be machined is anchored is controlled at all the points of its angular movement, allowing the interpolation of the movements of this work... Agent: Danobat, S. Coop.

20110300784 - Flexible and interchangeable multi-head floor polishing disk assembly: A disk assembly for use with floor grinding and/or polishing machines. The disk assembly includes multiple cutting heads attached to a flexible rubber disk, and a layer of hook and loop type fastener material for attaching the disk assembly to the drive plate of the floor grinding and/or polishing machine.... Agent:

20110300785 - Apparatus for double-sided, grinding machining of flat workpieces: The invention relates to an apparatus for the double-sided, grinding machining of flat workpieces with an upper and a lower work disk, each of which has a work surface with a grinding layer, wherein the work surfaces form a work gap amongst themselves, in which workpieces can be ground, wherein... Agent: Peter Wolters Gmbh

  
12/01/2011 > 10 patent applications in 6 patent subcategories. patent applications/inventions, industry category

20110294399 - Advanced finishing control: Methods of using in situ finishing information for finishing workpieces and semiconductor wafers are described. Methods of using yield information at least in part related to cost of manufacture for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process... Agent:

20110294400 - Determining physical property of substrate: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded... Agent:

20110294402 - Eddy current system for in-situ profile measurement: An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide... Agent:

20110294398 - Method and system for providing an electronic lapping guide corresponding to a near-field transducer of an energy assisted magnetic recording transducer: A method and system for fabricating transducer having an air-bearing surface (ABS) is described. The method and system include providing at least one near-field transducer (NFT) film and providing an electronic lapping guide (ELG) film substantially coplanar with a portion of the at least one NFT film. The method and... Agent: Western Digital (fremont), LLC

20110294401 - Method of compensation for a fluid cutting apparatus: A system and method for positioning a fluid stream for cutting a double contour workpiece includes a compensation module configured to receive information regarding a contour path in at least five degrees of freedom for cutting the double contour workpiece and a velocity of movement of the fluid stream during... Agent: Par Systems, Inc.

20110294403 - Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus: In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion... Agent: Denso Corporation

20110294404 - Tunable polish rates by varying dissolved oxygen content: A method and system for tunable removal rates and selectivity of materials during chemical-mechanical polishing using a chemical slurry or solution with increased dissolved oxygen content. The slurry can optionally include additives to improve removal rate and/or selectivity. Further selectivity can be obtained by varying the concentration and type of... Agent: Clarkson University

20110294405 - Workpiece spindles supported floating abrasive platen: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a flat surface of an abrading machine base where the spindle surfaces are in a common plane. Three... Agent:

20110294406 - Wafer polishing apparatus: Provided is a wafer polishing apparatus. The wafer polishing apparatus comprises a first polishing part and a second polishing part. The first part is disposed at a position higher than a top surface of a wafer and configured to be rotated on a first rotation axis. The second polishing part... Agent:

20110294407 - Manual operated detail sander: A manually operated detail sander comprises a first plate, a second plate and a sheet of sanding material. The first plate has uniform thickness and includes first and second sides that define a sculpting profile. The second plate has the thickness of the first plate and has an ergonomic profile... Agent:

Previous industry: Foundation garments
Next industry: Butchering


######

RSS FEED for 20140807: xml
Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.

######

Thank you for viewing Abrading patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Abrading patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Abrading patents we recommend signing up for free keyword monitoring by email.



Results in 0.48006 seconds

PATENT INFO