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Abrading October categorized by USPTO classification 10/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 10/28/2010 > patent applications in patent subcategories. categorized by USPTO classification
20100273396 - Polishing method, polishing apparatus and method of monitoring a substrate: A method of polishing a substrate is described. The method includes rotating a polishing table having a polishing surface, holding a substrate by a top ring, bringing the substrate into contact with the polishing surface while swinging and rotating the top ring to polish the substrate, and monitoring a surface... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100273397 - Servo stroking method and system for producing special shapes: A servo stroking method and system for honing wherein the cam stroking motion is controlled via combined acceleration and deceleration cam profiles to produce a finite jerk profile, a precision positioning capability for the honing element or elements, and accurate position feedback. The stroking motion is synchronized with one or... Agent: Matthews Edwards LLC
20100273398 - Customized polish pads for chemical mechanical planarization: A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include... Agent: Blakely Sokoloff Taylor & Zafman LLP
20100273399 - Cmp porous pad with particles in a polymeric matrix: The invention provides a chemical-mechanical polishing pad comprising a polymeric matrix and 0.1-15 wt. % of metal oxide particles. The polymeric matrix has pores, the metal oxide particles are uniformly distributed throughout the pores, and the metal oxide particles have a specific surface area of about 25 m2/g to about... Agent: Steven Weseman Associate General Counsel, I.p.
20100273400 - Method and device for removing a secondary burr on an end-cut work piece wheel: A method and a device for removing secondary burrs raised on the tooth flanks of a work piece wheel by a chamfering of the end tooth edges of said work piece wheel provides a tool wheel that rotationally meshes with the work piece wheel. Said tool wheel has cutting edges... Agent: The Gleason Works
20100273402 - Cmp conditioner and method of manufacturing the same: A chemical mechanical polishing (CMP) conditioner has diamond abrasive grits adhered to a conditioning surface which faces and makes contact with an abrasive pad of a CMP machine. The diamond abrasive grit is adhered to the CMP conditioner body by a metal plating layer, and the CMP conditioner body is... Agent: Edwards Angell Palmer & Dodge LLP
20100273401 - Polishing apparatus and polishing method: A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc to a standby position above the polishing... Agent: Mcginn Intellectual Property Law Group, PLLC
20100273403 - Contour guide for ice skate sharpener: A guide assembly for an ice skate sharpener cooperates with a template of a desired contour of a skate blade to control the relative disposition of a sharpening wheel and a skate blade. The guide assembly comprises a base and a carriage slidably mounted on the base so as to... Agent: Blake, Cassels & Graydon LLP
20100273405 - Polishing apparatus: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100273404 - Polishing pad and polishing device: A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing... Agent: Sinorica, LLC10/21/2010 > patent applications in patent subcategories. categorized by USPTO classification
20100267314 - Arrangement of devices and a method for empirically for determining efficiency index in abrasive waterjet cutting and application thereof in a device for simultaneous control of abrasive waterjet cutting: An arrangement of devices for determining an efficiency index in abrasive waterjet cutting, i.e. the index unambiguously defining for a certain material the shape of a cut, roughness of surfaces created by cutting, their conical nature depending on the incidence angle of the abrasive waterjet. The arrangement of the invention... Agent: Jacobson Holman PLLC
20100267315 - Polishing composition: (In the formula (1), Ra, Rb, and Rc represent H or an alkyl group of 1 to 4 carbon atoms, and Rd represents a group selected from the group consisting of a benzyl group, a vinyl group, an alkyl group of 1 to 4 carbon atoms, and a group in... Agent: Sughrue Mion, PLLC
20100267316 - Floor grinding apparatus: A grinding apparatus for grinding a surface includes a plurality of satellites, a carrier for supporting the plurality of satellites, a plurality of primary gears rotatably mounted within the carrier and disposed about a motor output, a static gear which is fixed with respect to the motor and co-axial with... Agent: Merchant & Gould PC
20100267317 - Substrate holder and substrate holding method: A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100267318 - Polishing pad with projecting portion: A polishing pad include a polishing layer having a polishing surface and a backing layer on a side of the polishing layer opposite the polishing surface. An outer edge of the polishing layer overhangs an outer edge of the backing layer.... Agent: Fish & Richardson P.C.
20100267319 - System for connecting a disc to a disc holder, as well as a disc for such system: A system for connecting a disc to a disc holder, e.g. for grinding or polishing purposes, has a disc with an operating surface, an opposite connection surface and a protrusion which is mounted to the connection surface. The disc holder has a supporting surface for supporting the connection surface of... Agent: Young & Thompson- None available for 10/01/2010
- None available for 10/7/2010
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