|Abrading patents - Monitor Patents|
USPTO Class 451 | Browse by Industry: Previous - Next | All
05/2010 | Recent | 14: Jul | Jun | May | Apr | Mar | Feb | Jan | 13: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn | | 2008 | 2007 |
Abrading May archived by USPTO category 05/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 05/27/2010 > patent applications in patent subcategories. archived by USPTO category
20100130099 - Retread tire buffing with multiple response curves: A method and apparatus for buffing tread from a tire carcass, the method comprising the steps of: receiving a signal from a sensor, the signal generated as a function of a distance between the sensor and a belt in the tire and a tire characteristic; selecting a signal response curve... Agent: Hahn Loeser & Parks, LLP
20100130100 - Using optical metrology for wafer to wafer feed back process control: A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences... Agent: Fish & Richardson P.C.
20100130101 - Two-line mixing of chemical and abrasive particles with endpoint control for chemical mechanical polishing: Embodiments described herein provide a method for polishing a substrate surface. The methods generally include storing processing components in multiple storage units during processing, and combining the processing components to create a slurry while flowing the processing components to a polishing pad. A substrate is polished using the slurry, and... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100130102 - Load cup substrate sensing: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100130104 - Carboxylic acid ester color-stabilized phenolic bound abrasive products and methods for making same: Described is a color-stable abrasive article that includes a phenolic resin binder; a color stabilizer, a colorant, and abrasive grains. The color stabilizer includes at least one carboxylic acid ester. The color-stable abrasive article is formed by a method including the steps of blending a resole and a color stabilizer... Agent: Hamilton, Brook, Smith & Reynolds, P.C.
20100130103 - Polishing apparatus and program thereof: A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d)... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100130105 - Substrate supporting unit, and apparatus and method for polishing substrate using the same: Provided are a substrate supporting unit and an apparatus and method for polishing a substrate using the same. The substrate supporting unit vacuum-absorbs a bottom surface of the substrate during a polishing process, and supports the substrate in a state where the substrate is upwardly spaced from the substrate supporting... Agent: Harness, Dickey & Pierce, P.L.C
20100130106 - Machine tool with cooling nozzle and method for applying cooling fluid: Disclosed in one embodiment is a computer numerically controlled machine having a coolant nozzle that is mounted on a turret of the machine and that is rotatable relative to the turret under the control of a computer control system. The nozzle is fluidically connected to a source of a coolant.... Agent: Miller, Matthias & Hull
20100130107 - Method and apparatus for linear pad conditioning: A method and apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base, and a second arm member having a first end pivotably coupled to a second end of the first... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100130108 - Aviram: A stabilized suspended platform comprises a platform suspended from a support unit by a cable. The support unit includes traction means for releasing or pulling part of the cable so as to set the platform at a desired height, and the platform includes propellers for fine movements or stabilizing the... Agent: Aviram Mann
20100130109 - System and method for restoring water supply pipes in buildings: A system and method for restoring water supply pipes in buildings is provided. Compressed air is blown through one end of a cold water supply pipe, such as a cold water riser, and elsewhere on the pipe the cold water supply pipe is connected to the hot water supply pipe... Agent: Dimock Stratton LLP
20100130110 - Shot-blasting machine for surface treatment of procucts: The shot-blasting machine for surface treatment of products comprises a base frame, a containing chamber for containing at least a product to be treated associated to the base frame and provided with at least an access opening, one or more projecting organs associated internally of the chamber for projecting a... Agent: Collard & Roe, P.C.
20100130111 - Double side polishing method and apparatus: To provide a technique for rotating a plurality of carriers 500 between an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works 400. The work 400 is merged with the carrier 500 outside a polishing apparatus main body 110. The work 400... Agent: Morrison & Foerster LLP
20100130112 - Polishing pad with endpoint window and systems and method using the same: A polishing pad includes a guide plate, a compressible foam under layer disposed adjacent to a lower surface of the guide plate, and a plurality of polishing elements that extend in a first direction substantially normal to a plane defined by the guide plate and through the guide plate. The... Agent: Sonnenschein Nath & Rosenthal LLP
20100130113 - Flexible grinding product and method of producing the same: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The... Agent: Altera Law Group, LLC05/20/2010 > patent applications in patent subcategories. archived by USPTO category
20100124870 - Semi-quantitative thickness determination: While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter... Agent: Fish & Richardson P.C.
20100124871 - Polish pad conditioning in mechanical polishing systems: A mechanical polishing apparatus includes a polishing pad, at least one carrier head positioned over and off center relative to the polishing pad and configured for holding at least one substrate against the polishing pad within a first annular region of the polishing pad when the polishing pad is rotating.... Agent: Texas Instruments Incorporated
20100124872 - Processes and apparatuses for enhanced cutting using blends of abrasive materials: A waterjet system selectively produces fluid jets for water jet cutting or abrasive jets for abrasive-waterjet-cutting. The abrasive materials in the abrasive jet are determined based on the properties of the workpiece. The waterjet system includes an abrasive delivery system that is capable of delivering either a single abrasive or... Agent: Seed Intellectual Property Law Group PLLC
20100124873 - Multi-faceted sanding/finishing tool: A sanding and finishing tool is constructed from a number of interlocking sanding members configured such that the sanding and finishing tool is equipped for sanding and/or finishing jobs of varying sizes and degrees, and is further able to easily sand and/or finish in and around various sized edges, crevices... Agent: Andrus, Sceales, Starke & Sawall, LLP05/13/2010 > patent applications in patent subcategories. archived by USPTO category
20100120334 - Automated chemical polishing system adapted for soft semiconductor materials: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against... Agent: Momkus Mccluskey, LLC
20100120330 - Endpoint control of multiple-wafer chemical mechanical polishing: A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring... Agent: Fish & Richardson P.C.
20100120331 - Endpoint control of multiple-wafer chemical mechanical polishing: A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring... Agent: Fish & Richardson P.C.
20100120333 - In-line wafer thickness sensing: A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An... Agent: Fish & Richardson P.C.
20100120332 - Waterjet device: An abrasive waterjet apparatus comprising a water jet fluid flow circuit, a positive displacement pump connected to the water jet fluid flow circuit, a pressure fluctuation equalising device (24) for said circuit, and an abrasive cutting nozzle assembly. The pressure fluctuation equalising device (24) comprises a high pressure chamber (27′)... Agent: Alston & Bird LLP
20100120335 - Partial contact wafer retaining ring apparatus: The partial contact wafer retaining ring apparatus is disclosed. For example, one disclosed embodiment provides a wafer retaining ring comprising a ring for retaining the wafer, the ring having an inner diameter surface configured to restrict lateral wafer motion, and at least one interface surface configured to interface with a... Agent: Alleman Hall Mccoy Russell & Tuttle LLP
20100120336 - Polishing method and polishing apparatus: In order to achieve the above object, the present invention provides a polishing method where a mechanism that suspends a member 15a on a pad 19 surface to bring the member in contact with or cause the member to approach the pad 19 surface and supplies the slurry along the... Agent: Paul A. Fattibene Fattibene & Fattibene
20100120337 - Cutting method and cutting device for hard material: A method of cutting a workpiece made of a highly-hard material is provided. The workpiece is cut by a machining device including a workpiece holder that holds the workpiece, a spindle device that rotates the workpiece holder, a tool holder that holds a tool, and a relative moving mechanism that... Agent: Dla Piper LLP Us
20100120338 - Paper feeding apparatus and image forming apparatus: A paper feeding apparatus includes a rack that stores sheets in a vertically placed state, a first conveying roller that conveys a sheet extracted from the rack in a first direction in an erected state, a scraper that scrapes a surface of the sheet conveyed in the erected state by... Agent: Patterson & Sheridan, L.L.P.
20100120339 - Dust collection device for sanding machine: A dust collection device for a sanding machine includes a casing located at the lower end of the upright sanding belt and the casing includes a bottom hole which communicates with the open top of the dust collection part. The dust collection part communicates with an exterior collection area defined... Agent: Phillip Liu
20100120340 - Sander with a balance means: A sander according to the present invention comprising a housing, a motor and a transmission mounted within the housing, a sanding plate mounted below the housing, a battery pack mounted at the rear end of the housing and a balance means mounted on either the housing or the sanding plate.... Agent: Mcdermott, Will & Emery LLP Attn:IPDepartment
20100120342 - Method, system, and apparatus for modifying surfaces: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.... Agent: 3m Innovative Properties Company
20100120341 - Portable grinder: The invention relates to a portable grinder comprising a grinding head (5) that can be placed against a workpiece (7) in a grinding contact zone (26). According to the invention, a stop (18-21) is disposed at a distance from the grinding contact zone (26). Said stop (18-21) forms an axis... Agent: Friedrich Kueffner
20100120343 - Cushion for polishing pad and polishing pad using the cushion: The invention provides a cushion for a polishing pad, wherein, when a dynamic compression viscoelasticity measurement is performed under conditions of 23° C., a static load of 27.6 kPa, a frequency of 11 Hz and an amplitude of 1 μm, (1) a phase difference between dynamic stress and deformation is... Agent: Leydig Voit & Mayer, Ltd05/06/2010 > patent applications in patent subcategories. archived by USPTO category
20100112900 - Predictive method to improve within wafer cmp uniformity through optimized pad conditioning: A method of conditioning a CMP polishing pad to attain a desired thickness profile in a polished layer on a wafer is disclosed. The incoming thickness profile of the layer to be polished, the thickness profile of the polishing pad, a polish rate of layer as a function of pressure... Agent: Texas Instruments Incorporated
20100112901 - Substrate polishing apparatus and substrate polishing method: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100112899 - Visual feedback for airfoil polishing: A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system there is a model having a representation of a desired shape of the workpiece. A scanning system generates... Agent: Hoffman Warnick LLC
20100112902 - Method and apparatus for precision polishing of optical components: A method of polishing objects using an apparatus comprised of a rotary positioning device comprising a turret; a base mounted on the turret; a drive wheel connected to a rotatable shaft, the drive wheel having a perimeter, and the rotatable shaft disposed in a housing. The polishing wheel assembly may... Agent: John M. Hammond Patent Innovations LLC
20100112903 - Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery: A method and apparatus for polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment a method of processing a semiconductor substrate is provided. The method comprises positioning a substrate on a polishing apparatus comprising a polishing pad assembly, delivering a polishing slurry to a surface... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100112904 - Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig: In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20100112906 - Chemical mechanical polishing composition and methods relating thereto: A method for chemical mechanical polishing of a substrate comprising a germanium-antimony-tellurium chalcogenide phase change alloy using a chemical mechanical polishing composition comprising water; 1 to 40 wt % colloidal silica abrasive particles having an average particle size of ≦50 nm; and 0 to 5 wt % quarternary ammonium compound;... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20100112905 - Wafer head template for chemical mechanical polishing and a method for its use: The present invention is a planar template for a CMP tool polishing head possessing a means of securing a wafer in CMP polishing where the back surface of the template is held to the polishing head by retaining means and a method for using the planar template.... Agent: Sughrue Mion, PLLC
20100112907 - Method and device for processing lens: The optical surface of a lens (21) held and rotated by the rotating shaft (12) of a lathe is cut or ground into an aspherical surface from a direction perpendicular to the axis of the rotating shaft (12) and the axial direction of the rotating shaft (12) while a processing... Agent: Blakely Sokoloff Taylor & Zafman LLP
20100112908 - Method of shaping an ophthalmic lens: A method of shaping an ophthalmic lens includes machining the edge face of the lens by at least one rotary tool having an axis of rotation movable relative to the lens axis, both in rotation and radial and axial translation. These movements are controlled so that the edge face of... Agent: Young & Thompson
20100112910 - Linear pressure feed grinding with voice coil: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal... Agent: Corning Incorporated
20100112909 - Method of and apparatus for abrading outer peripheral parts of a semiconductor wafer: The invention provides a method of and an apparatus for abrading outer peripheral parts of a semiconductor wafer having a protective sheet adhesively attached to its surface where semiconductor elements are formed. The semiconductor wafer is held horizontally and an abrading tape held inside an abrading head is run and... Agent: Weaver Austin Villeneuve & Sampson LLP
20100112911 - Method and device for the injection of cmp slurry: The present invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of the leading edge of the polishing head with... Agent: Sughrue Mion, PLLC
20100112912 - Retainer ring: A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a semiconductor wafer is placed... Agent: Slater & Matsil, L.L.P.
20100112913 - Finishing machine with stone rotating unit: A finishing machine with at least two finishing stones and a stone turning unit is proposed, in which the stone turning unit may be coupled to a rotary drive of the workpiece holder. A separate drive for the stone turning unit may thus be omitted, which results in a reduced... Agent: Brinks Hofer Gilson & Lione/ann Arbor
20100112914 - Retaining ring with tapered inner surface: A retaining ring has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The outer diameter surface includes an outwardly projecting flange having a lower surface, and the bottom surface includes a plurality of channels.... Agent: Fish & Richardson P.C.
20100112915 - Lens holder: A lens holder (8) includes a metal holder main body (12) and an elastic member (14) which holds the processing center portion (13) of a processing target lens (7). The holder main body (12) has a fitting hole (20) formed at a front surface center. The elastic member (14) includes... Agent: Blakely Sokoloff Taylor & Zafman LLP
20100112916 - Indexing vacuum-packaging machine using a video camera for film- registration: An improved indexing vacuum-packaging machine more accurately positions and aligns the upper film relative to the lower film at the sealing station. A video camera replaces a conventional photocell, whereby the braking and concomitant stretching of the upper film at the sealing station need only be performed only every few... Agent: Milton S. Gerstein
20100112917 - Self cleaning and adjustable slurry delivery arm: Embodiments of the invention provide a slurry delivery and rinse system for a chemical mechanical polishing (CMP) apparatus which is capable of self-cleaning, and which can adjustably deliver the slurry agent and rinse agent over a polishing pad. In one embodiment, the fluid delivery system has a distributed slurry delivery... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100112918 - Jewelry bench dust shield: A jewelry bench dust shield including a base attachable to a jewelry bench, an arm pivotally attached to said base, and a dust shield attached to said arm. A jewelry bench dust shield including a vacuum triggering pivoting arm, a trigger holding arm pivot base attachable to a jewelry bench,... Agent: Rylander & Associates PC
20100112919 - Monolithic linear polishing sheet: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving... Agent: Fish & Richardson P.C.
20100112920 - Abrasive article: Provided is a durable abrasive article which can conform even to a surface of a complicated shape and has an excellent abrasive power and which does not give any deep flaw to become a problem at a subsequent step and is not broken even when used in sanding the surface... Agent: Studebaker & Brackett PC
20100112921 - Sharpening device for knife blades: A sharpening device (1) with a guiding slot (6) for knife blade to be sharpened and main sharpening rods (10a, 10b) arranged on both sides of the guiding slot (6) that cross each other at a crossing point (11) in the area of the guiding slot (6) and that execute... Agent: Walter A. Hackler Patent Law OfficePrevious industry: Foundation garments
Next industry: Butchering
RSS FEED for 20140710:
Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.
Thank you for viewing Abrading patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Abrading patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Abrading patents we recommend signing up for free keyword monitoring by email.
Results in 0.32778 seconds