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Abrading April category listing, related patent applications 04/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 04/29/2010 > patent applications in patent subcategories.
20100105287 - Compact electric grinding machine: The present invention particularly relates to a hand-held sanding machine with an outer housing (1), a tool shaft (2) and a brushless electric drive motor. In the present invention, the rotor of the drive motor is fastened to the tool shaft (2) of the sanding machine, and the stator (6)... Agent: Altera Law Group, LLC
20100105289 - Grinding machine and grinding method: A grinding machine includes: a workhead (22) that rotatably supports a solid cylindrical or hollow cylindrical workpiece (W); a grinding wheel (43) that moves relative to the workhead (22) in a direction that intersects with a rotation axis of the workhead (22) to grind an outer peripheral surface of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100105288 - Multiple libraries for spectrographic monitoring of zones of a substrate during processing: Methods, systems, and apparatus, including computer program products, for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes receiving a first sequence of current spectra of reflected light from a first zone of a substrate. A second sequence of current spectra... Agent: Fish & Richardson P.C.
20100105290 - Methods and apparatus for indicating a polishing tape end: Apparatus and methods are provided for polishing a substrate with a polishing tape. The polishing tape includes a first surface adapted to contact a substrate; and a second surface, wherein at least one of the first and second surfaces include a feature adapted to indicate an end condition. Numerous other... Agent: Dugan & Dugan, PC
20100105292 - Method for machining that combines fine boring and honing and machining equipment for the execution of the method: According to a method for the fine machining of internal surfaces of bore holes in tools by fine boring and subsequent honing, the following steps are executed: Fine boring of at least one bore hole (131) in a tool (130) by means of a fine boring tool (128) of a... Agent: Akerman Senterfitt
20100105291 - Methods and apparatus for polishing a notch of a substrate: Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing... Agent: Dugan & Dugan, PC
20100105293 - Spectacle lens edging method: A lens holder (16) is attached to a processing target lens (2) such that a holder center (O) coincides with a processing center position (21) of the lens. An axial deviation measuring mark (81a, 81b) is displayed on the processing target lens (2) to coincide with a reference position mark... Agent: Blakely Sokoloff Taylor & Zafman LLP
20100105294 - Methods and apparatus to minimize the effect of tape tension in electronic device polishing: Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension... Agent: Dugan & Dugan, PC
20100105295 - Polishing pad seasoning method, seasoning plate, and semiconductor polishing device: A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached... Agent: Greenblum & Bernstein, P.L.C
20100105296 - Ultra smooth face sputter targets and methods of producing same: A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium.... Agent: Wegman, Hessler & Vanderburg
20100105297 - Polishing apparatus: A polishing apparatus includes a cyclic mechanism moving cyclically in a certain direction, a holder moving cyclically by the cyclic mechanism in a direction parallel to an object to be polished, a plurality of polishing pins held on the holder, a magnet member including a first part which is exposed... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20100105298 - Apparatus and method for spiral polishing with electromagnetic abrasive: An apparatus and method for spiral polishing with electromagnetic abrasive has adopted the principle of electromagnetic and magnetic abrasive along with a lead screw to polish the inner or outer surface of a precise screw or a complicated part. The apparatus includes a clamp, a lead screw, a first electromagnet,... Agent: Rosenberg, Klein & Lee
20100105299 - Methods and apparatus for polishing an edge and/or notch of a substrate: Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head,... Agent: Dugan & Dugan, PC
20100105300 - Guard hood torsion preventer: The invention is based on a guard hood torsion preventer for a handheld power tool, in particular for a right-angle power sander. The invention is for preventing torsion of a guard hood on the handheld power tool, in particular in the event of damage to a tool. The guard hood... Agent: Ronald E. Greigg Greigg & Greigg P.l.l.c.
20100105301 - Inline handheld power tool: A powerhead for a hand held power tool includes a powerhead assembly, the powerhead assembly being operably couplable to a hand held motive source, the powerhead assembly having a rotatable implement, the implement being selectively rotated by the motive source when the motive source is operably coupled to the powerhead... Agent: Marger Johnson & Mccollom, P.C.
20100105302 - Polishing pad conditioner: Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100105303 - Polishing pad: The present invention provides a polishing pad, and more particularly, a polishing pad with two kinds of groove patterns. The polishing pad includes a polishing surface, on which is formed with at least a first groove and at least a second groove, wherein the characteristic of the polishing pad is... Agent: Sinorica, LLC04/22/2010 > patent applications in patent subcategories.
20100099334 - Eddy current gain compensation: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion... Agent: Fish & Richardson P.C.
20100099333 - Method and apparatus for determining shear force between the wafer head and polishing pad in chemical mechanical polishing: A method for (a) determining the shear force between a wafer head and a polishing pad in a polishing tool using a CMP polishing tool with a plate above the wafer head which hangs or rests on the plate. The plate is connected to the CMP polishing tool by (b)... Agent: Sughrue Mion, PLLC
20100099335 - Channel inlet edge deburring for gas diffuser cases: A method of deburring channel inlet edges inside a cavity of a gas diffuser case is disclosed. The diffuser case has a plurality of channels each having an inner surface and an inlet edge defining an inlet of the channel. The surfaces of adjacent channels co-operate to provide said inlet... Agent: Ogilvy Renault LLP (pwc)
20100099336 - Chemical mechanical polishing pad having integral identification feature: Chemical mechanical polishing pads having a polishing layer with a polishing surface adapted for polishing a substrate are provided, wherein the polishing layer has a unique integral identification feature; wherein the unique integral identification feature is non-polish active, wherein the unique integral identification feature comprises at least two visually distinct... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20100099337 - Device for the double-sided processing of flat workpieces and method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers: A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin... Agent: Brooks Kushman P.C.
20100099338 - Knife sharpener: A knife sharpener comprises a base, a motor, a grinding wheel assembly, a rotary shaft and two springs. The working channel between the edge of the grinding disc and the grinding awl is automatically adjustable to accommodate different blade of different thickness. When the knife sharpener performs grinding operation, the... Agent: Dr. Banger Shia Patent Office Of Bang Shia
20100099339 - Polishing pad edge extension: A method and apparatus for providing a substantially uniform pressure to a polishing surface from a conditioning element is provided. The method includes urging a conditioning disk against a polishing surface of a rotating polishing pad, moving the conditioning disk across the polishing surface in a sweep pattern that includes... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100099340 - Textured platen: Embodiments described herein generally relate to the planarization of substrates. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus comprises a rotatable platen having a textured upper surface, at least one groove formed in the upper surface, and a pad disposed on the textured upper surface... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100099341 - Ergonomic throttle lever control and hand support: A lever longer than wide and bent across its length producing an angle of <180° between an upper surface of a longer first and a shorter second lever end to control the throttle switch of a hand-held tool by hand-rocking the lever about its vertex to exert pressure on or... Agent: Patricia M. Costanzo Pats Pending
20100099342 - Pad conditioner auto disk change: A method and apparatus for replacing a polishing pad conditioning disk is a chemical mechanical polishing system is provided. The apparatus comprises a disk load/unload station for unloading used conditioning disks from a pad conditioning assembly and loading unused conditioning disks onto the pad conditioning assembly, on or more disk... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100099343 - Polishing pad having abrasive grains and method for making the same: The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive... Agent: Wpat, PC Intellectual Property Attorneys
20100099344 - Chemical mechanical polishing pad having sealed window: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.04/15/2010 > patent applications in patent subcategories.
04/08/2010 > patent applications in patent subcategories.
20100087123 - Method for assessing workpiece nanotopology using a double side wafer grinder: A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining... Agent: Richard A. Schuth (memc) Armstrong Teasdale LLP
20100087124 - Cd repair apparatus: An apparatus for repairing a surface of a media storage disc is disclosed. The apparatus comprises an exterior housing having an upper lid rendered with an upper lid shaft and a base portion that includes a platform for holding the media storage disc. The disc is placed on the platform... Agent: Law Office Of Michael N. Cohen, P.C.
20100087125 - Polishing tool and polishing device: A grinding machine (10) composed of a support table (12) for supporting an object (11) to be ground, a rotating shaft (13a) vertically arranged above the support table, and a grinding tool (40) connected to a lower end of the rotating shaft in parallel with the support table, in which... Agent: Nixon Peabody, LLP
20100087126 - Small test piece polishing apparatus: A small test piece polishing apparatus is provided which is less likely to bend or damage a small test piece, which is superior in working efficiency, and which ensures uniform quality for the small test pieces produced. The small test piece polishing apparatus 1 for polishing a surface of a... Agent: Bacon & Thomas, PLLC
20100087127 - Accumulator driven angle grinder: An angle grinder for driving a cutting or grinding tool (12), includes a housing (11) having a first housing section (14) extending along a first axis (A1), and in which a motor (18) is arranged, and a second housing section (15) extending along a second axis (A2) and in which... Agent: Abelman, Frayne & Schwab
20100087128 - Polishing pad, and method for manufacturing polishing pad: It is an object of the present invention to provide a polishing pad that is resistant to scratching and also has excellent flattening performance. One aspect of the present invention is a polishing pad, comprising a fiber-entangled body formed from fiber bundles made up of ultrafine fibers in which the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.04/01/2010 > patent applications in patent subcategories.
20100081362 - Apparatus and methods for testing the polishability of materials: A method and apparatus for measuring the polishability of a solid material such as a dental restorative material includes using a series of apparatus to perform the steps of forming the material into a desired specimen with a generally planar surface, conditioning the surface by abrasion, measuring the abraded surface... Agent: Banner & Witcoff, Ltd.
20100081361 - Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus: A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100081360 - Use of pad conditioning in temperature controlled cmp: A method and apparatus for temperature control for a chemical mechanical polishing process is provided. In one embodiment, the method comprises polishing the substrate with a surface of a polishing pad assembly, measuring a real-time temperature of the surface of the polishing pad assembly, determining whether the real-time temperature of... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100081363 - Device for machining a die plate of an extruder: Methods and devices for machining a die plate of an extruder for pelletization are provided. The device can include a grinding wheel with a grinding surface rotatably disposed on a drive mechanism of a cutter head associated with the extruder. The grinding surface can include a hard coating aligned with... Agent: Buskop Law Group, P.C.
20100081364 - Process for surface preparation of parts to be coated: A process for surface preparation of parts to be coated using Thermal Spray or Cold Spray technologies, which is the result of a step in which the relevant surface is abraded by steel-based abrasive material, and later washing off of any residue thereof.... Agent: Young & Thompson
20100081365 - Grinding surfaces of workpieces: A method of grinding a workpiece with a grinding wheel is provided wherein the shape of the wheel is distorted in a predetermined manner during grinding by changing the speed of rotation of the wheel. This deformation of the wheel during grinding is employed to impart a desired shape to... Agent: Barnes & Thornburg LLPPrevious industry: Foundation garments
Next industry: Butchering
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