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Abrading February patent applications/inventions, industry category 02/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/25/2010 > patent applications in patent subcategories.
20100048100 - Method and system for endpoint detection: A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the processing tool upon detecting an end-point signal corresponding to a predetermined value of a desired parameter of the article... Agent: Greer, Burns & Crain
20100048099 - Probe polishing method, program therefor, and probe apparatus: A probe polishing method is provided for polishing probes by brining a polishing member into slide-contact with probes through a mounting table having thereon the polishing member transferred from a first receiving part. The probe polishing method includes transferring the polishing member from the first receiving part to the mounting... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100048101 - Multi-sander: A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool body. A first platen having a first attachment hub can be selectively... Agent: Harness Dickey & Pierce, P.L.C
20100048102 - Polishing pad: A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer... Agent: Morrison & Foerster LLP
20100048103 - Surface treatment method for coated cutting insert: A surface treatment method can perform coated surface treatment on a cutting edge R and a rake surface, while maintaining a radius of curvature of the cutting edge R and uniformly surface-treating the rake surface. The surface treatment method includes providing an opening chamfered at comers adjacent to an upper... Agent: Womble Carlyle Sandridge & Rice, PLLC
20100048104 - Method for grinding a machine part, and grinding machine for carrying out said method: Disclosed is a method for grinding a machine part that is used as a drive shaft, for example, rotates about the longitudinal axis thereof during the grinding process, and is provided with a journal at one axial end thereof and a recess at the opposite end thereof. The grinding process... Agent: Jordan And Hamburg LLP
20100048105 - Lapping carrier and method: Provided is a double-sided lapping carrier comprising a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece, said aperture extending from the first major surface through the base carrier to the second major surface, wherein the base carrier comprises... Agent: 3m Innovative Properties Company
20100048106 - Chemical mechanical polisher having movable slurry dispensers and method: A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an arm comprising a pivoting end and a distal end,... Agent: Ashok K. Janah
20100048107 - Device for rounding filament ends for a toothbrush head: The invention relates to a device (1) for rounding the filaments of a toothbrush head, comprising a rounding tool (2) and a means (3) for guiding the tool (2) on a path of movement that finishes the filaments. The invention provides that the guiding means is configured as a linear... Agent: The Procter & Gamble Company Global Legal Department - Ip
20100048108 - Extension pole apparatus for sander: Extension pole apparatus includes an attachment component (20,100) having an elongate body (22,105) that is adapted to receive a tubular or rod like component so that the latter extends generally parallel to the longitudinal direction of the body. A pair of plates (24,25;110a,110b) are mounted to and project laterally from... Agent: Christensen, O'connor, Johnson, Kindness, PLLC
20100048109 - Sander having removable platen: A tool for moving an abrasive media. The tool includes a tool body, a platen, a drive system and a retaining knob. The platen has an exterior platen surface and a knob aperture that is formed through the exterior platen surface. The drive system is housed in the tool body... Agent: Harness Dickey & Pierce, P.L.C
20100048110 - Dust-disposal assembly for machine tool: A dust-disposal assembly for a machine tool comprises a dust-collection chamber settled in a cutting area of the machine tool and a dust-block board settled on the dust-collection chamber for covering an opening of the dust-collection chamber, wherein the dust-block board serves to retain cutting dust in the dust-collection chamber.... Agent: Charles E. Baxley, Esquire
20100048111 - Sanding apparatus with molded elastomeric pad: A sander comprises a body member molded of polypropylene to which a soft pad member is integrally molded or directly bonded thereto. Preferably, the material comprising the pad member is of a thermoplastic elastomer material, such as Santoprene®. Significantly, when the pad member is molded directly to the body member,... Agent: Gottlieb Rackman & Reisman PC
20100048112 - Diamond tool and method of manufacturing the same: Disclosed herein is a diamond tool for cutting a workpiece and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank. The segment includes a tape having a plurality of inserting sections formed on a surface of the tape, and diamond... Agent: Seed Intellectual Property Law Group PLLC02/18/2010 > patent applications in patent subcategories.
20100041314 - Gear matching device and gear machining apparatus: Provided is a gear matching device capable of shortening time taken for the gear matching, and also to provide a gear machining apparatus using the gear matching device. For this purpose, provided is a gear matching device which performs gear matching to establish a rotational phase relationship between a grindstone... Agent: Birch Stewart Kolasch & Birch
20100041315 - Self-sharpening grits and associated methods: Polycrystalline grits and methods of making grits which allow for self-sharpening are provided. In one aspect, for example, a method of sharpening a superabrasive cutting element during cutting can include abrading a self-sharpening superabrasive particle against a work piece to facilitate dulling of a cutting surface of the superabrasive particle,... Agent: Thorpe North & Western, LLP.
20100041316 - Method for an improved chemical mechanical polishing system: A method for polishing a substrate on a pad large enough to accommodate polishing at least two substrates simultaneously The method includes simultaneously pressing a first substrate and a second substrate against a single polishing surface of a polishing module, providing polishing fluid from a first fluid delivery arm in... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100041317 - Workpiece processing method: A method of processing a workpiece having a plurality of multi-crystal silicon columns embedded in single-crystal silicon includes a grinding step for grinding only the single-crystal silicon by use of a grinding tool and an abrasive step for concurrently polishing the single-crystal silicon and the multi-crystal silicon columns by use... Agent: Greer, Burns & Crain
20100041318 - Method for producing a spectacle lens: A method for producing a semi-finished product for a plus or minus power lens having a toroidal or atoroidal back that is configured as a prescription surface. According to the method, a blank having a diameter DR and a front having a radius of curvature rV is fixed on its... Agent: Hudak, Shunk & Farine, Co., L.p.a.
20100041319 - Grinding wheel and method: A grinding wheel for grinding features into a work-piece and a corresponding method for grinding the features into the work-piece are disclosed herein. The grinding wheel includes an outer periphery with a first axial end having a first diameter. The grinding wheel also includes a second axial end spaced from... Agent: Macmillan, Sobanski & Todd, LLC
20100041320 - Method and apparatus for honing a workpiece and a workpiece: A method for honing a workpiece by passing a workpiece through a hone tool having a plurality of abrasive surfaces configured to remove a portion of all exterior machining surfaces of the workpiece as it is passed through the hone tool, the exterior machining surfaces being non-uniform and wherein the... Agent: Cantor Colburn, LLP
20100041321 - Coolant dynamic pressure releasing method in grinding operation, grinding method using the releasing method, and grinding wheel for use in the grinding method: A dynamic pressure in the coolant supplied between a rotating grinding wheel and a rotating workpiece is released by making at least one of oblique grooves on the grinding wheel pass vertically through a contact surface on which a grinding surface of the grinding wheel contacts the workpiece. Where one... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100041322 - Method and device for pin removal in a confined space: A method for drilling or cutting a pin surrounded by solid material includes the use of a water jet tool having a nozzle that is arranged at an angle with respect to a main body of the water jet tool. The water jet is directed over a portion of the... Agent: Buchanan, Ingersoll & Rooney PC
20100041323 - Cmp retaining ring: An improved chemical mechanical polishing retaining ring. A representative embodiment comprises a base portion made from a wear-resistant plastic material, and an upper portion, or backbone portion, made from a stiffer and more wear resistant material. One of the base or backbone portion is preferably overmolded onto the other. The... Agent: Patterson, Thuente, Skaar & Christensen, P.A.
20100041324 - Brush-like grindstone: A brush-like grindstone (1) has threadlike grinding elements (2) each being a thread that is a collection of long inorganic fibers and is impregnated with resin and solidified. To grind work (W), the grindstone (1) is moved relative to the work (W) with the forward ends of the threadlike grinding... Agent: Flynn Thiel Boutell & Tanis, P.C.02/11/2010 > patent applications in patent subcategories.
20100035515 - Chemical mechanical polisher with heater and method: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal... Agent: Ashok K. Janah
20100035517 - O.d. centerless grinding machine: In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel which is adapted to press a cylindrical workpiece into the grinding wheel as the regulating wheel rotates. Electronic equipment... Agent: Tyson J. Wilde Novatek International, Inc.
20100035516 - Polishing method and apparatus: The present invention relates to a polishing method and apparatus for polishing and planarizing an object to be polished (substrate) such as a semiconductor wafer. The substrate as an object to be polished is pressed against a polishing surface on a rotating polishing table in the polishing method. During polishing... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100035518 - Closed loop control of pad profile based on metrology feedback: A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100035519 - Removable optical monitoring system for chemical mechanical polishing: A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a surface of a substrate against the polishing pad on the platen, a monitoring... Agent: Fish & Richardson P.C.
20100035520 - Polishing apparatus, method of manufacturing semiconductor device employing this polishing apparatus, and semiconductor device manufactured by this method of manufacturing semiconductor device: While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft 11 of a polishing pad 13 and a rotating shaft 31 of a dresser 30 and shape change of the polishing pad 13 based on input of a target shape of... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20100035521 - Metal film polishing pad and method for polishing metal film using the same: The invention provides a polishing pad to polish a metal layer. The polishing pad has a storage elastic modulus at 80° C. of 200 to 900 MPa and a storage elastic modulus at 110° C. of 40 MPa or less. The invention also provides a method of polishing a metal... Agent: Leydig Voit & Mayer, Ltd
20100035522 - Blasting method and apparatus having abrasive recovery system, processing method of thin-film solar cell panel, and thin-film solar cell panel processed by the method: A negative pressure space (20) and an opposing negative pressure space (40) having openings (22, 42) are opposed by being spaced at a movement allowable interval of the workpiece such as a thin-film solar cell panel or the like and so as to face one side edge in the same... Agent: Mathews, Shepherd, Mckay, & Bruneau, P.A.
20100035523 - Semiconductor device fabricating method, and semiconductor fabricating device: A method for fabricating a semiconductor device includes: supporting a semiconductor substrate formed with a polishing target film by a polishing head; and polishing the polishing target film while restricting movement in a radial direction of the semiconductor substrate by a retainer formed on the polishing head with a tilted... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20100035524 - Method of producing optical element, and optical element: m
20100035525 - In-situ performance prediction of pad conditioning disk by closed loop torque monitoring: Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough... Agent: Patterson & Sheridan, LLP - - Appm/tx
20100035526 - Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is... Agent: Fish & Richardson P.C.
20100035527 - Polishing with enhanced uniformity: A polishing head is presented. The polishing head includes a housing having top and bottom surfaces. The housing is formed from a single piece of material. The polishing head includes grooves disposed on the bottom surface and an inlet in communication with the grooves for coupling to a pressure medium... Agent: HorizonIPPte Ltd
20100035528 - Handheld sander: A handheld sander having an abrasive roller and a flexible drive shaft that is connected at the outer end thereof to the roller and is connected at the inner end thereof to an electric motor. A handle encloses the motor. An extension arm extends from the handle and encloses the... Agent: Stephen R. Greiner, Esquire Greiner Law Offices, P.C.
20100035529 - Chemical mechanical polishing pad: where densitya equals an average density of 60 g/l, where densityb is an average density of 5 g/l to 500 g/l, where wt %a is 3.25 to 4.25 wt %. The polishing pad has a porosity of 30 to 60 percent by volume; and a closed cell structure within the... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20100035530 - Abrasive tools having a continuous metal phase for bonding an abrasive component to a carrier: An abrasive article includes a carrier element, an abrasive component, and a bonding region between the abrasive component and the carrier element. The abrasive component includes abrasive particles bound in a metal matrix. The abrasive component further includes a network of interconnected pores substantially filled with an infiltrant. The infiltrant... Agent: Larson Newman & Abel, LLP02/04/2010 > patent applications in patent subcategories.
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