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Abrading January recently filed with US Patent Office 01/10

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
01/28/2010 > patent applications in patent subcategories.

20100022166 - Substrate processing apparatus: A substrate processing apparatus having a polishing unit for polishing a periphery of a substrate. The substrate processing apparatus includes: a polishing unit configured to polish a periphery of a substrate; an imaging module configured to take an image of the periphery of the substrate polished by the polishing unit;... Agent: Wenderoth, Lind & Ponack, L.L.P.

20100022167 - Superfinish machine with an endless polishing band and method for operating a superfinish machine: A superfinish machine and a method for operating a superfinish machine are proposed, wherein monitoring an endless polishing band of the superfinish machine is possible.... Agent: Brinks Hofer Gilson & Lione/ann Arbor

20100022168 - System, device and method for levelling floors: The present invention relates to a system, a device and a method for leveling floor surfaces by means of a floor grinding machine (10), in which the device comprises a lifting device (90) for adjusting the height of the floor grinding machine above the floor surface during leveling thereof. The... Agent: Merchant & Gould PC

20100022169 - Base for a rotating grinding or cutting tool, and grinding or cutting tool produced therefrom: In a rotating grinding- or cutting tool, in particular a grinding wheel or grinding roller, on one body, a coating of abrasive material, e.g. cubic boron nitride (CBN) or diamond is applied. The body (2, 12, 22, 32, 42) has two side walls (2a, 12a, 22a, 32a, 42a; 2a, 12a,... Agent: Michael L. Dunn

20100022170 - Coated abrasive products containing aggregates: A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles and a nanoparticle binder. Free abrasive products, bonded abrasive products, and the particulate material also contain aggregates.... Agent: Larson Newman & Abel, LLP

20100022171 - Glass polishing compositions and methods: The present invention provides glass polishing compositions and methods suitable for polishing a glass substrate at a down force of about 110 g/cm2 or less. One preferred polishing composition comprises a particulate cerium oxide abrasive (e.g., about 1 to about 15 percent by weight) suspended in an aqueous carrier containing... Agent: Steven Weseman Associate General Counsel, I.p.

20100022172 - Post shaving orbital system for blind bolt fasteners: The system comprises a headstock (1) in which is established a rotary shaft (10) driven via a cone (8) that can be coupled to a drive means, for example a robot, the shaft (10) being linked to a spring (11) which permits axial displacement of the shaft (10) in the... Agent: Wenderoth, Lind & Ponack, L.L.P.

20100022173 - Reciprocating drive mechanism of abrasive band grinding machine: The present invention provides a reciprocating lifting motion of abrasive band grinding machine, wherein two control boxes are arranged correspondingly at lower part of the grinding mechanism of the grinding machine; the grinding mechanism is driven by the drive axle of the control box; a motor is coupled below the... Agent: Tian Wang Wang

20100022174 - Grinding tool and method for fabricating the same: The present invention relates to a grinding tool and a method for fabricating the same. The method comprises: (A) providing a grinding plate having a working surface and a non-working surface, a mold having an adjustment surface, and a backplane; (B) getting the working surface of the grinding plate to... Agent: Bacon & Thomas, PLLC

01/21/2010 > patent applications in patent subcategories.

20100015889 - Processing end point detection method, polishing method,and polishing apparatus: The present invention relates to a processing end point detection method for detecting a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing... Agent: Wenderoth, Lind & Ponack, L.L.P.

20100015890 - Polishing method, polishing apparatus, and program for controlling polishing apparatus: A polishing method can reduce the waiting time of a substrate after polishing, standing by for measurement of a thickness of a polishing film, thereby increasing the throughput of an entire apparatus, and which can securely perform feedback control. The polishing method includes: a pre-polishing film thickness measurement step of... Agent: Wenderoth, Lind & Ponack, L.L.P.

20100015892 - Method and apparatus for prepping surfaces with a high-frequency forced pulsed waterjet: A method of prepping a surface using a high-frequency forced pulsed waterjet entails generating a high-frequency signal having a frequency f using a high-frequency signal generator, applying the high-frequency signal to a transducer having a microtip to cause the microtip of the transducer to vibrate to thereby generate a forced... Agent: O''shea Getz P.C.

20100015891 - Method of descaling metal wire rod and apparatus therefor: An apparatus for removing scales from metal wires including: a liquid container tank 12 through which the metal wires 10 pass, mixing nozzles 14 disposed to allow the metal wirings to pass through the liquid container tank for injecting a high-pressure liquid toward the metal wires 10; a high-pressure pump... Agent: Kubovcik & Kubovcik Crystal Gateway 3

20100015893 - Polishing pad: An object of the invention is to provide a polishing pad having excellent planarization performance and wear resistance and to provide a method for manufacture thereof. The invention is directed to a polishing pad including a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam is... Agent: Morrison & Foerster LLP

20100015894 - Cmp by controlling polish temperature: A method for manufacturing integrated circuits on a wafer includes providing a facility-supplied room temperature solution; controlling the temperature of the facility-supplied room temperature solution to a desired temperature set point to generate a rinse solution; and rinsing a polishing pad using the rinse solution. The wafer is then polished... Agent: Slater & Matsil, L.L.P.

20100015895 - Chemical mechanical polishing pad having electrospun polishing layer: Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical polishing pads and for using them to polish semiconductor substrates.... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20100015896 - Device for driving a grinding machine: The invention relates to a device (1) at a mobile grinding machine (2) for stone materials and that comprises a rotatably driven disc-shaped housing (3), which is arranged to support a plurality of grinding disc holders (6) rotatably driven by a belt (5) or chain driven by a motor (4),... Agent: Potomac Patent Group PLLC

20100015897 - Spindle with draw rod and current conductor: The invention relates to a spindle (1) for a machine tool, in particular a motor spindle, with a housing (2) for accommodating an electric motor (3) and a shaft (4) that can be driven by the latter, and with a tool holder (5) for a tool (6) that can be... Agent: Collard & Roe, P.C.

20100015898 - Conditioner for chemical mechanical planarization pad: The present invention provides a conditioner for CMP pad required for global planarization of wafer to achieve high integration of a semiconductor element. The conditioner for CMP pad includes a metal substrate having abrasive particles fixed thereto, a plurality of abrasive particles fixed to the metal substrate, and a layer... Agent: Wells St. John P.s.

20100015899 - Surface abrasion of objects: A chamber for an abrading apparatus comprising an inlet, an outlet, a main body and an insert, the main body comprising a recess on an inner surface thereof between the inlet and the outlet, whereby, in use, the insert is removably retained in the recess. The apparatus also comprises a... Agent: Indiano Vaughan LLP

20100015900 - Pad for machining surfaces with curved aspiration channels: A pad is disclosed comprising a monobloc body (10, 11), traversed by a plurality of peripheral through holes (3) for aspirating dust, wherein channels (4) are formed that extend parallel to the lower surface of the pad connecting a lower central aspiration hole (33) of the pad with peripheral holes... Agent: J. Rodman Steele Novak Druce & Quigg LLP

20100015901 - Backup assembly for a sanding device: A back-up assembly for a sanding device, where the back-up assembly includes a driving disk rotating around a rotational axis, rigid segment plates, a flexible pad layer positioned between the rigid segment plates and the driving disk, and semi-flexible wedges located at the bottom of each rigid segment plate. Rigid... Agent: Ostrolenk Faber Gerb & Soffen

20100015902 - Chemical mechanical polishing pad manufacturing assembly: A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

01/14/2010 > patent applications in patent subcategories.

20100009599 - Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces: An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured... Agent: Wilson & Ham

20100009600 - Grinding apparatus for a pin for use in power transmission chain and manufacture method of a pin for use: A disc-like grinding wheel 5 is formed with a circumferential groove 5a, the opposite walls of which define grinding surfaces 5b. A rotated carrier 3 brings a load pin 55 into rotary movement relative to the grinding wheel 5 rotated about an axis 5z, so as to pass the load... Agent: Birch Stewart Kolasch & Birch

20100009601 - Polishing pad, polishing method and method of forming polishing pad: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one... Agent: J C Patents

20100009602 - Portable optical fiber polisher: A polisher has an offset axis and a friction cam useful in a method of polishing that comprises a more random, elongated polishing pattern than known orbital polishers and is capable of portable use using a 9 volt battery. The method is capable of using lower contact pressures between fiber... Agent: Christopher Paradies, Ph.d.

20100009603 - Machine for shaping an eyeglass lens, the machine being provided with a turnable tool-carrier having a plurality of working tools mounted thereon: The machine includes: elements for supporting the lens and for driving it in rotation about a first axis of rotation, the rotation of the lens being driven by first driver element, a tool-carrier mounted to turn about a second axis of rotation, turning of the tool-carrier being driven by second... Agent: Young & Thompson

20100009604 - Laminated flexible resilient abrasive article: A sheet-like abrasive article includes a resilient backing sheet having opposed major surfaces and a continuous abrasive sheet affixed to the backing sheet. The abrasive sheet includes an abrasive support layer with abrasive particles arranged thereon, thereby defining an abrasive surface. A sanding tool assembly including such a sheet-like abrasive... Agent: 3m Innovative Properties Company

20100009605 - Method of manufacturing semiconductor wafer: A method of manufacturing a semiconductor wafer, including a step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by holding the semiconductor wafer in a wafer holding hole formed in a carrier plate, and simultaneously polishing a front and back surface... Agent: Kubovcik & Kubovcik

20100009606 - Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof: The disclosure is directed to a conversion assemblage adapted for use in converting a surface modifying mechanism, such as a pole sander, having an attaching member. The surface modifying assemblage and method facilitate converting the pole sander with anyone of several different surface treating assemblages in an easy and reliable... Agent: 3m Innovative Properties Company

20100009607 - Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof: The disclosure is directed to a conversion assemblage adapted for use in converting a surface modifying mechanism, such as a pole sander, having an attaching member. The surface modifying assemblage and method facilitate converting the pole sander with anyone of several different surface treating assemblages in an easy and reliable... Agent: 3m Innovative Properties Company

20100009608 - Electric polishing gun: An electric polishing gun has a body, a rechargeable battery, a drive motor, a transmitting device and an actuating device. The body has a battery seat, a handle section, a circuit board, a switch, a trigger and a holding cap. The rechargeable battery is attached detachably to the battery seat... Agent: Hershkovitz & Associates, LLC

20100009609 - Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof: The disclosure is directed to conversion assemblages adapted for use in converting a surface modifying apparatus, such as a pole sander, whereby the conversion assemblage includes a generally rigid body assembly including first and second major surfaces opposing each other, the first major surface is adapted for receiving the supporting... Agent: 3m Innovative Properties Company

20100009610 - Non-motorized hand manipulatable surface modifying tool and method of converting the same: Disclosed is a non-motorized hand manipulatable surface modifying tool and method that facilitates improved surface modifying efficiency and ease of conversion to any one of several different surface treating assemblies. Included is a generally lightweight, low density supporting body assembly made of a block of generally rigid plastic foam material... Agent: 3m Innovative Properties Company

20100009611 - Method for manufacturing a polishing pad: A method for inexpensively and easily manufacturing a polishing pad of excellent durability and polishing speed stability includes preparing a cell dispersed urethane composition by mechanical foaming, applying the cell dispersed urethane composition onto a base material layer, forming a polyurethane foamed layer having roughly spherical interconnected cells by curing... Agent: Morrison & Foerster LLP

20100009612 - Polishing pad: The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surface 1a of a polishing pad 1 is subjected to a mechanical process, such as buffing, so that the flatness of the surface is... Agent: Mcdermott Will & Emery LLP

20100009613 - Tool having a mounting opening for positive connection to different drive shafts: A tool is disclosed having a mounting opening for positive connection to a drive shaft that can be driven oscillatingly, the mounting opening comprising a plurality of outwardly extending projections each having an outer convex section that ends on both sides in concave lateral flanks, with neighboring lateral flanks joining... Agent: St. Onge Steward Johnston & Reens, LLC

01/07/2010 > patent applications in patent subcategories.

20100003894 - Method and apparatus for selectively removing portions of an abradable coating using a water jet: A method and apparatus for forming raised ridges on the surface of a turbine component having an abradable coating formed on an outer surface thereof which includes a mask having a predetermined pattern of openings therein adjacent the abradable coating on a surface of the turbine component; and a high... Agent: K&l Gates LLP

20100003895 - Orbital grinding aggregate: The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one... Agent: Harness, Dickey & Pierce, P.L.C

20100003897 - Methods of polishing an object using slurry compositions: In a slurry composition for chemical mechanical polishing, a method of preparing the slurry composition and a method of polishing an object using the slurry composition, the slurry composition includes a cerium oxide abrasive particle having a rare earth element other than cerium as a dopant, and an aqueous medium... Agent: Myers Bigel Sibley & Sajovec

20100003896 - Polishing pad: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a... Agent: Morrison & Foerster LLP

20100003898 - Substrate retaining ring for cmp: The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include... Agent: Ditthavong Mori & Steiner, P.C.

20100003899 - Device and method for positioning and blocking steady rests for rolling mill cylinders in grinding machines and grinding machines employing the same: A device and method for positioning and blocking steady rests for rolling milly cylinders in grinding machines and grinding machines employing the same. A positioning and blocking device for steady rests includes a substantially flat carriage including a translation mechanism and a blocking mechanism, wherein the blocking mechanism is magnetic.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100003900 - Abrasive tape, method for producing abrasive tape, and varnishing process: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an... Agent: Sughrue Mion, PLLC

20100003901 - Burnishing tape and method of manufacturing the same, and method of burnishing magnetic disk: Disclosed is a burnishing tape, a method of producing the same and a method of burnishing a magnetic disk with which a surface of the magnetic disk may be smoothed while contamination of a magnetic disk caused by crushed abrasive grains is prevented. A burnishing tape (1) manufactured by the... Agent: Sughrue Mion, PLLC

20100003902 - Modular base-plate semiconductor polisher architecture: The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system.... Agent: Patterson & Sheridan, LLP - - Appm/tx

20100003903 - Device for processing the surface of spherical shells: This disclosure concerns a device for machining surfaces, e.g., superfinishing, polishing, grinding or lapping spherical shells or flattened domes of a workpiece, or, for example, a ball joint, using a tool having a machining stone with a workpiece receiver, a first drive for an oscillating motion about a first axis... Agent: Brinks Hofer Gilson & Lione/ann Arbor

20100003904 - High speed flat lapping platen, raised islands and abrasive beads: i

20100003905 - Portable belt grinder: The portable belt grinder 201 comprises; a main body 202 with an electric motor 203 built therein; a drive pulley disposed in the lower portion of the main body 202 and rotationally drivable by the electric motor 203; an idle pulley disposed as the companion to the drive pulley; and,... Agent: Kimble Intellectual Property Law, PLLC

20100003906 - Motor-driven machine tool: A motor-driven machine tool (1) with a tool (7) that can be rotatably driven comprises a drive shaft (5) and a driven shaft (6) on which the tool (7) is received, the rotational movement of the drive shaft (5) being transmissible onto the driven shaft (6) via a coupling device... Agent: Michael J. Striker

20100003907 - Inclination angle adjusting device and workpiece attaching device: The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a... Agent: Kratz, Quintos & Hanson, LLP

20100003908 - Inclination angle adjusting device and workpiece attaching device: To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment. Provided are a workpiece attaching body 24 having a workpiece attaching surface 4 and a rotating body 7 for rotatably supporting the workpiece attaching body... Agent: Kratz, Quintos & Hanson, LLP

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