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Abrading October categorized by USPTO classification 10/09

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
10/30/2009 > patent applications in patent subcategories. categorized by USPTO classification
  
10/23/2009 > patent applications in patent subcategories. categorized by USPTO classification
  
10/15/2009 > patent applications in patent subcategories. categorized by USPTO classification

20090258573 - Chemical mechanical polishing method: Shape memory chemical mechanical polishing methods are provided that use shape memory chemical mechanical polishing pads having a polishing layer in a densified state, wherein the polishing pad thickness and/or groove depth is monitored and the polishing layer is selectively exposed to an activating stimulus causing a transition from the... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20090258574 - Polishing system having a track: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090258575 - Chemical mechanical polishing pad and methods of making and using same: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20090258576 - Grinding machine and grinding method: A grinding machine is provided with first and second grinding wheels selectively used in dependence on the steps of machining operations. The second grinding wheel is grooved so that at least one oblique groove vertically crosses a contact surface on which a grinding surface of the second grinding wheel contacts... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090258577 - Method for trimming molds of automotive metal sheets: The present invention provides a method for trimming molds of automotive metal sheets, which comprise a top mold and a bottom mold. The top mold has a concave mold surface, and the bottom mold has a corresponding convex mold surface. The method comprises: 1. Use the top mold as the... Agent: Sinorica, LLC

20090258578 - Polishing pad and method for making the same: The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has... Agent: Volentine & Whitt PLLC

20090258579 - Form transfer grinding method: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly... Agent: Carlson, Gaskey & Olds/pratt & Whitney

20090258580 - Aqueous abrasives dispersion medium composition: An aqueous abrasives dispersion medium composition comprising: glycols; glycolethers represented by a general formula (1): R2O—(CHR1CH2O)m—R3 (1); and water. (In the general formula (1), R1 represents a hydrogen atom or a methyl group, R2 represents an alkyl group or an alkenyl group of carbon number 1 to 18 , R3... Agent: Ladas & Parry LLP

20090258581 - Double concentric solid wheel diamond dressers: A dresser for dressing a grind stone including two concentric solid wheel dressing elements. The dressing elements include an abrasive material within a matrix material. The grind stones dressed with the dressers of the invention operate at high removal rates thereby grinding substrates quickly and at low cost. The grind... Agent: Shumaker & Sieffert, P.A.

20090258582 - Cutting heads: A nozzle assembly (1) generates a jet (9) of water, or abrasive particles suspended in water, for use in an abrasive waterjet-cutting head. The nozzle assembly (1) comprises a nozzle element (5, 80, 84, 86, 91) with a tapering bore (7) therethrough, mounted to a carrier (2, 52) so that... Agent: Schwegman, Lundberg & Woessner, P.A.

20090258583 - Device and process for applying and/or detaching a wafer to/from a carrier: n

20090258584 - Multi-shell air-tight compartmentalized casings: A molded tool casing of at least two sections for air-tightly encasing a tool is taught. A seal is inserted into a groove molded into the sealing perimeter of one section. A protruding ridge is molded into the sealing perimeter of a second section that is to be joined to... Agent: Patricia M. Costanzo Pats Pending

20090258585 - Sanding surfaces having high abrasive loading: Abrasive articles are disclosed that may be used in dry sanding applications. The abrasive articles disclosed may be made entirely from abrasive materials or alternatively may be made by fastening abrasive surfaces to handles or tools. The abrasive articles of the present invention have abrasive surfaces with controlled wear rates... Agent: Denis Khoo Suite 120

20090258586 - Buffing ball: A buffing ball is formed by compressing a stack of generally circular buffing pads along a central axis. The individual pads have a generally wave-like outer peripheral surface having valleys and mounds. When compressed together, the mounds form small knobs that are ideal for buffing or cleaning intricate surfaces.... Agent: Wood, Herron & Evans, LLP

20090258588 - Chemical mechanical planarization pad with void network: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing... Agent: Innopad /gtpp

20090258587 - Polishing pad having groove structure for avoiding the polishing surface stripping: The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the... Agent: Volentine & Whitt PLLC

  
10/08/2009 > patent applications in patent subcategories. categorized by USPTO classification

20090253351 - Friction sensor for polishing system: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of... Agent: Fish & Richardson P.C.

20090253352 - Slicing method: The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a cooling speed of... Agent: Oliff & Berridge, PLC

20090253355 - Cmp abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive: The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090253354 - Polishing compositions and use thereof: Slurry compositions comprising abrasive particles and solid lubricant particles are useful for planiarizing surfaces, and preventing delamination and scratches.... Agent: Connolly Bove Lodge & Hutz LLP

20090253353 - Polishing pad: It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been... Agent: Knobbe Martens Olson & Bear LLP

20090253356 - Apparatus and method for polishing drill bits: A finishing device for finishing the exterior, flutes and tip of a drill bit is disclosed. The finishing device includes a containment vessel which houses an abrasive media which may have a visco-elastic component and an abrasive component. The drill bit is inserted into or through the abrasive media and... Agent: Kennametal Inc. Intellectual Property Department

20090253357 - Hand carrier for grinding material: The invention describes a hand carrier for grinding material with a grinding area (2) and a bail (4), the hand carrier (1) being extruded or molded in one piece from solid material of elastic synthetics and the grinding area (2) being bordered by a flange (3).... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090253358 - Polishing article with integrated window stripe: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality... Agent: Fish & Richardson P.C.

  
10/01/2009 > patent applications in patent subcategories. categorized by USPTO classification

20090247048 - Abrasive pump for an abrasive jet cutting machine: An abrasive supply system may, for example, be used to supply abrasive particles such as garnet to a cutting nozzle of an abrasive jet cutter. According to an embodiment, the abrasive is propelled by a substantially constant flow rate gas source. According to an embodiment, the system may be supplied... Agent: Graybeal Jackson LLP

20090247051 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus includes: an edge position detector which detects front and rear edge positions of an eyeglass lens based on target lens shape data; a bevel locus setting unit which includes: a) a provisional bevel locus calculator which obtains a provisional bevel locus by obtaining a bevel... Agent: Sughrue-265550

20090247050 - Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same: A grinding method for grinding a back surface of a semiconductor wafer that performs infeed grinding of a back surface of a wafer laminated body, the method, during the grinding of the back surface of the wafer laminated body, having: measuring respectively a thickness of an outer peripheral portion and... Agent: Christie, Parker & Hale, LLP

20090247049 - Post-process sizing control device for grinding machine: A post-process sizing control device is provided with origin compensation means for controlling a size measuring device to measure an actual size of a workpiece portion and for compensating the origin of a wheel head by a position compensation amount which corresponds to a difference between the actual size and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20090247052 - Wafer grinding method and wafer grinding machine: A wafer grinding method and a wafer grinding machine are disclosed for grinding a wafer by executing both the rough grinding process and the finish grinding process. After the rough grinding process before the finish grinding process, the wafer thickness is measured with a noncontact-type thickness gauge, and during the... Agent: Christie, Parker & Hale, LLP

20090247053 - Substrate production apparatus for producing a substrate for a display device: A substrate production apparatus for producing a substrate for a display device is disclosed. The substrate production apparatus includes a first production apparatus including a first scriber to scribe a first mother substrate into at least one first model substrate and at least one second model substrate, a first grinder... Agent: Morgan Lewis & Bockius LLP

20090247054 - Method to prevent slurry caking on cmp conditioner: A method of planarizing a semiconductor structure comprises moving a conditioning element on a surface of a polishing member, rotating the semiconductor structure relative to the polishing member against the surface of the polishing member, and rinsing the surface of the polishing member and the semiconductor structure. While the conditioning... Agent: Texas Instruments Incorporated

20090247055 - Methods for etching the edge of a silicon wafer: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.... Agent: Richard A. Schuth (memc) Armstrong Teasdale LLP

20090247056 - Grinding method for wafer having crystal orientation: A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning the grinding ring so that the grinding... Agent: Greer, Burns & Crain

20090247057 - Polishing platen and polishing apparatus: The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such... Agent: Wenderoth, Lind & Ponack, L.l.p.

20090247058 - Corner sander: A corner sander base including a sanding surface, the corner sander base for sanding proximate interior wallboard corners, the corner sander base including a first member and a second member connected together at a longitudinally oriented juncture where they form a tip, one side of the members defining a sanding... Agent: Mark A. Koch Professional Corporation

20090247059 - Apparatus for mechanical treatment of surfaces: Herein is described an apparatus for the mechanical treatment of surfaces comprising a wand (1), a head (2) that is movably fastened to the wand (1), a tool drive pad (3) attached in a rotatable manner to the head (2), a drive unit (4) for the drive of the tool... Agent: Walter A. Hackler, Ph.d. Patent Law Office

20090247060 - Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same: Disclosed is a polishing method for polishing a surface of a structure for magnetic-head manufacture by CMP in the process of manufacturing a magnetic head using a ceramic substrate made of a ceramic material containing AlTiC, the structure including the ceramic substrate and one or more layers formed thereon, and... Agent: Oliff & Berridge, Plc

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